Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass interface. Ready and Turbini (2000) identified this copper salt as the Cu2(OH)3Cl, atacamite compound. This work has investigated the influence of polyethylene glycol (PEG) and polyethylene propylene glycol (PEPG) fluxing agents on the chemical nature of CAF. For coupons processed with PEPG flux, with and without chloride, a copper-chloride containing compound was formed in the polymer matrix. This compound was characterized using x-ray photoelectron spectroscopy (XPS) as CuCl and an electrochemical mechanism for the formation of the chloride-containing CAF has been proposed. For PEG flux, with and without chloride, it has been shown that CAF only formed, but no copper containing compound formed in the matrix. It appears for PEG fluxed coupons, a PEG-Cu-Cl complex forms, binds the available Cu and acts as a barrier to the formation of CuCl in the polymer matrix. Meeker and Lu Valle (1995) have previously proposed that CAF failure is best represented by two competing reactions – the formation of a copper chloride corrosion compound (now identified as Cu2(OH)3Cl) and the formation of innocuous trapped chlorine compounds. Since no evidence of any trapped chloride compounds has been found, we propose that the formation of CAF is best represented by a single non-reversible reaction. For coupons processed with a high bromide-containing flux, bromide containing CAF was created and characterized using transmission electron microscopy (TEM) to be Cu2(OH)3Br. In addition, a copper-containing compound was formed in the polymer matrix and characterized using XPS as CuBr. An electrochemical mechanism for the formation of bromide-containing CAF has been proposed based on the XPS data. .

Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass interface. Ready and Turbini (2000) identified this copper salt as the Cu2(OH)3Cl, atacamite compound. This work has investigated the influence of polyethylene glycol (PEG) and polyethylene propylene glycol (PEPG) fluxing agents on the chemical nature of CAF. For coupons processed with PEPG flux, with and without chloride, a copper-chloride containing compound was formed in the polymer matrix. This compound was characterized using x-ray photoelectron spectroscopy (XPS) as CuCl and an electrochemical mechanism for the formation of the chloride-containing CAF has been proposed. For PEG flux, with and without chloride, it has been shown that CAF only formed, but no copper containing compound formed in the matrix. It appears for PEG fluxed coupons, a PEG-Cu-Cl complex forms, binds the available Cu and acts as a barrier to the formation of CuCl in the polymer matrix. Meeker and Lu Valle (1995) have previously proposed that CAF failure is best represented by two competing reactions – the formation of a copper chloride corrosion compound (now identified as Cu2(OH)3Cl) and the formation of innocuous trapped chlorine compounds. Since no evidence of any trapped chloride compounds has been found, we propose that the formation of CAF is best represented by a single non-reversible reaction. For coupons processed with a high bromide-containing flux, bromide containing CAF was created and characterized using transmission electron microscopy (TEM) to be Cu2(OH)3Br. In addition, a copper-containing compound was formed in the polymer matrix and characterized using XPS as CuBr. An electrochemical mechanism for the formation of bromide-containing CAF has been proposed based on the XPS data. .

Submitted by Silvana Teresinha Dornelles Studzinski (sstudzinski) on 2016-12-23T12:17:06Z No. of bitstreams: 1 Tiago de Freitas Machado_.pdf: 13489744 bytes, checksum: 639cbc0fc0de3f47a3c757ff594540e0 (MD5) / Made available in DSpace on 2016-12-23T12:17:06Z (GMT). No. of bitstreams: 1 Tiago de Freitas Machado_.pdf: 13489744 bytes, checksum: 639cbc0fc0de3f47a3c757ff594540e0 (MD5) Previous issue date: 2016-09-15 / itt Chip - Instituto Tecnológico de Semicondutores da Unisinos / O processo de soldagem de esferas em componentes do tipo esferas organizadas em matriz do inglês BGA, ball gris array é crítico para o encapsulamento de semicondutores pois uma falha pode gerar rejeitos e retrabalhos indesejáveis ao desempenho da produção. O processo atual da empresa de encapsulamentos analisada apresentou, de forma acumulada, entre os meses de janeiro a junho de 2015 uma taxa de 1220 defeitos por milhão de unidades produzidas, relacionadas ao modo de falha denominado tamanho da esfera com o código SB003. Matérias primas alternativas para aplicação em processo de soldagem de esferas em encapsulamento de semicondutores de diferentes fabricantes, podem apresentar melhor desempenho com relação a esta ocorrência. A redução das perdas de material e de defeitos no processo de soldagem de esferas é essencial para que uma empresa de encapsulamento de semicondutores se mantenha competitiva financeiramente no mercado tanto nacional quanto internacional. O objetivo deste trabalho foi avaliar através de análises de laboratório e aplicações práticas, quatro opções de fluxos de solda solúveis ou parcialmente solúveis em água. Foram comparadas as características de viscosidade, índice de acidez, pH e perda de massa através de TGA do inglês thermogravimetric analysis, aprimorando o conhecimento intrínseco sobre este material e seu comportamento nesta etapa. Foi analisado o impacto dos diferentes fluxos de solda no desempenho da soldagem, realizando a observação da ação do fluxo em um forno de refusão e a habilidade de realinhar esferas de solda fora de posição que impactam na redução da ocorrência de defeitos. Obteve-se como resultado o fluxo A com melhor performance para realinhamento, 9,58% das esferas foram reposicionadas, perda de massa gradual e menos abrupta que os demais. / The process of soldering spheres in ball grid array components, called BGA, is critical to the semiconductor packaging, because one failure can generate rejects and undiserable reworks to production performance. The current process of the packaging company analyzed presented, in accumulated form, between the months of january and june of 2015 the defect rate of 1220 defects per million of produced units, related to the failure mode denominated ball size with the code SB003. Alternative raw material for solder sphere process applied to semiconductor packaging of different manufacturer could show better performance related to these occurrence. The reduction of material waste and defects reduction in the soldering spheres process is essential to keep a semiconductor packaging company competitive financially both in the national and international market. The objective was to evaluate through laboratory analysis and practical applications four options of soldering flux water and non-water soluble. Characteristics were compared of viscosity, acidity level, pH and mass loss through thermogravimetric analysis TGA improving the intrinsic knowledge about this material and its behavior in the step. The impact was analyzed of different solder flux performance on soldering, performing observation of the flux action on the reflow oven and the ability to realign the solder spheres misplaced that impact on the reduction of the occurrence of defects. It was obtained as result the flux A with better performance of realignment, 9.58% of misplaced spheres were repositioned, present gradual mass loss and less abrupt than the others.