The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Conventional solders, pastes and pads are no longer sufficient to handle the high heat fluxes associated with connecting the device to the sink. Carbon nanotubes(CNTs) have been proposed as a possible thermal interface material(TI M), due to their thermal and mechanical properties, and prior research has established the effectiveness of vertically arranged CNT arrays to match the capabilities of the best conventional TIMs. However, to reach commercial applicability, many improvements need to be made in terms of improving thermal and mechanical properties as well as cost and manufacturing ease of the layer. Prior work demonstrated a simple method to transfer and bond CNT arrays through the use of a nanometer thin layer of gold as a bonding layer. This study sought to improve on that technique. By controlling the rate of deposition, the bonding temperature was reduced. By using different metals and thinner layers, the potential cost of the technique was reduced. Through the creation of a patterned array, a phase change element was able to be incorporated into the technique. The various interfaces created are characterized mechanically and thermally.

Controlling the temperature of the exhaust valves is paramount for proper functioning of engines and for the long lifespan of valve train components. The majority of the heat outflow from the valve takes place along the valve-seat-cylinder head-coolant thermal path which is significantly influenced by the thermal contact resistance (TCR) present at the valve/seat and seat/head interfaces. A test rig facility and experimental procedure were successfully developed to assess the effect of the valve/seat and seat/head interfaces on heat outflow from the valve, in particular the effects of the valve/seat interface geometry, seat insert assembly method, i.e. press or shrink fit, and seat insert metallic coating on the operating temperature of the valve. The results of tests have shown that the degree of the valve-seat geometric conformity is more significant than the thermal conductivity of the insert: for low conforming assemblies, the mean valve head temperature recorded during tests on copper-infiltrated insert seats was higher than that recorded during tests on noninfiltrated seats of higher conformance. The effect of the insert-cylinder head assembly method, i.e. shrink-fitted versus press-fitted inserts, has proved negligible: results have shown insignificant valve head temperature variations, for both tin-coated and uncoated inserts. On the other hand, coating the seat inserts with a layer of tin (20-22μm) reduced the mean valve head temperature by approximately 15°C as measured during tests on uncoated seats. The analysis of the valve/seat and seat/head interfaces has indicated that the surface asperities of the softer metal in contact would undergo plastic deformation. Suitable thermal contact conductance (TCC) models, available in the public domain, were used to evaluate the conductance for the valve/seat and seat/cylinder head interfaces. Finally, a FE thermal model of the test rig has been developed with a view to assess the quality of the calculated TCC values for the valve/seat and seat/head interfaces. The results of the thermal analysis have shown that predicted temperatures at chosen control points agree with those measured during tests on thermometric seats with an acceptable level of accuracy, proving the effectiveness of the used TCC models.

Controlling the temperature of the exhaust valves is paramount for proper functioning of engines and for the long lifespan of valve train components. The majority of the heat outflow from the valve takes place along the valve-seat-cylinder head-coolant thermal path which is significantly influenced by the thermal contact resistance (TCR) present at the valve/seat and seat/head interfaces. A test rig facility and experimental procedure were successfully developed to assess the effect of the valve/seat and seat/head interfaces on heat outflow from the valve, in particular the effects of the valve/seat interface geometry, seat insert assembly method, i.e. press or shrink fit, and seat insert metallic coating on the operating temperature of the valve. The results of tests have shown that the degree of the valve-seat geometric conformity is more significant than the thermal conductivity of the insert: for low conforming assemblies, the mean valve head temperature recorded during tests on copper-infiltrated insert seats was higher than that recorded during tests on noninfiltrated seats of higher conformance. The effect of the insert-cylinder head assembly method, i.e. shrink-fitted versus press-fitted inserts, has proved negligible: results have shown insignificant valve head temperature variations, for both tin-coated and uncoated inserts. On the other hand, coating the seat inserts with a layer of tin (20-22¿m) reduced the mean valve head temperature by approximately 15°C as measured during tests on uncoated seats. The analysis of the valve/seat and seat/head interfaces has indicated that the surface asperities of the softer metal in contact would undergo plastic deformation. Suitable thermal contact conductance (TCC) models, available in the public domain, were used to evaluate the conductance for the valve/seat and seat/cylinder head interfaces. Finally, a FE thermal model of the test rig has been developed with a view to assess the quality of the calculated TCC values for the valve/seat and seat/head interfaces. The results of the thermal analysis have shown that predicted temperatures at chosen control points agree with those measured during tests on thermometric seats with an acceptable level of accuracy, proving the effectiveness of the used TCC models.

Dans le cadre de l’évolution du plus grand accélérateur circulaire de particules « LHC », un important programme de mise à niveau sur l’ensemble des détecteurs qui le constitue a été lancé. Parmi eux, on retrouve la mise à niveau du détecteur LHCb qui comprend le remplacement complet de plusieurs sous-détecteurs. La fréquence de lecture élevée de 40MHz, sans précédent dans une expérience de physique des particules, et l’environnement de rayonnement sévère lié à l’augmentation de l’intensité du LHC, sont les principaux défis à relever par les nouveaux sous-détecteurs. Le travail présenté dans ce manuscrit, décrit une petite partie de l’évolution du détecteur LHCb. Le développement et la construction d’un nouveau trajectographe à grande échelle, basé sur une nouvelle technologie à fibres scintillantes «SciFi», lues avec des photomultiplicateurs au silicium «SiPM», est l’un des projets clés du programme de mise à niveau de LHCb. La première partie, consiste à étudier les échanges thermiques et à concevoir un système de refroidissement pour chaque Read-Out Box « ROB » qui contient deux cartes électroniques frontales « FE », et qui permettent de lire les données du détecteur. Ces dernières possèdent une dissipation thermique d’environ 110W.Pour assurer le bon fonctionnement des composants électroniques, il est obligatoire de mettre en place un refroidisseur. Des contraintes importantes sont prisent en compte dans cette étude, la première représente l’espace limité en regard du besoin du système de refroidissement, des interfaces électroniques et mécanique, la seconde concerne les SiPM. Reliés à l’électronique par des câbles flexibles, elles sont situées à proximité de l’électronique « FE » et leur température de fonctionnement doit être parfaitement réglée autour des -40°C. Des travaux de simulations numériques sur les logiciels FloTHERM et ANSYS ont été menés sur le banc expérimental réalisé au sein du laboratoire, et qui nous ont permis de déterminer la solution de refroidissement la mieux adaptée. Cette étude nous a aussi montré qu’il est plus que nécessaire d’intégrer des interfaces thermiques « IT» telles que des pâtes thermiques afin d’assurer un meilleur transfert de chaleur entre les composants électroniques et le refroidisseur. La deuxième partie, représente une étude approfondie sur les interfaces thermiques qui sont un point délicat de transfert de chaleur, car elles peuvent avoir plusieurs dizaines de pour cent de la résistance thermique globale. Pour garantir une utilisation adéquate et durable de ces matériaux, plusieurs paramètres ont été vérifiés, en particulier la dureté, la consistance (pas de production de graisse ou d’huile) et la conductivité thermique, grâce à un banc de mesures adapté d’après la méthode normalisé ASTM D5470, grâce auquel on a pu mesurer le flux de chaleur qui traverse l’échantillon d’interface thermique testé et qui est généré par une source chaude et un source froide qui sont montées aux extrémités de notre banc.Grâce à l’installation CHARME (CERN) et à la plate-forme PAVIRMA (Campus des Cézeaux), une série de mesure d’irradiations aux neutrons et aux rayons X sont également effectuées, correspondant à l’environnement dans lequel elles seront exposées dans l’expérience, d’un côté pour identifier les dégradations et changements possibles sur les résistances thermiques par l’analyse de l’impédance thermique, de l’autre pour identifier l’interface thermique qui convient le mieux à notre application et qui permet d’assurer un excellent échange thermique et donc un bon refroidissement de l’électronique frontale au sein du trajectographe du détecteur LHCb. / In the context of the evolution of the biggest circular accelerator of particles «LHC», an important program of upgrade on all the detectors which establishes itself was thrown. Among them, we find the upgrade of the detector LHCb which includes the complete replacement of several sub-detectors. The frequency of high reading of 40MHz, an unprecedented in an experiment of physical appearance of particles, and the environment of severe radiation bound to the increase of the intensity of the LHC, are the main challenges by the new sub-detectors. The work presented in this manuscript, described as a small part of the evolution of the LHCb detector. The development and the construction of a new wide-scale tracker, based on a new technology with scintillating fiber «SciFi», read with photomultipliers to the silicon «SiPM», is one of the key projects of the LHCb upgrade program. The first part, consists in studying the thermal exchanges and designing a cooling system for every Read-Out Box «ROB» which contains two electronic front-end « FE », and which allow to read the data of the detector. The latter has a thermal dissipation about 110W. To ensure the smooth running of electronic components, it is compulsory to set up a cooler. Important constraints are taken into account in this study, the first one represents the space limited compared to the need for the cooling system, the electronic interfaces and mechanical, the second concerns the SiPM. Connected with the electronics by flexible cables, they are located near the electronics «FE» and their temperature of operation is perfectly settled around -40 ° C. Works of digital simulations on the software FloTHERM and ANSYS were led on the experimental bench realized within the laboratory, and which allowed us to determine the best adapted solution of cooling. This study also showed to us that he is more than necessity to integrate thermal interfaces «IT» such as thermal pastas to assure a better transfer of heat between electronic components and cooler. The second part, represents an in-depth study on the thermal interfaces which are a delicate point of transfer of heat, because they can have dozens percent of the global thermal resistance. To guarantee an adequate and sustainable use of these materials, several parameters were verified, in particular hardness, consistency (no production of fat or oil) and the thermal conductivity, thanks to a bench of measures adapted according to the method normalized ASTM D5470, with this bench we could measure the flow of heat through the tested thermal interface sample and which is generated by a hot source and a cold source that are mounted at the ends of our bench.With the installation CHARME (CERN) and PAVIRMA (Cézeaux), a series of measure of irradiations at the neutrons and the X-rays are also made, correspond-ing to the environment in which they will be exposed in the experience, on one side to identify the damages and the possible changes on the thermal resistances by the analysis of the thermal impedance, the other one to identify the thermal interface which suits best our application and which allows to assure an excellent thermal exchange and thus a good cooling of the frontal electronics within the trajectographe of the detector LHCb.