No description available.

No description available.

The vapour-phase reaction of 2-methyl-tetrahydropyran and 2-ethyltetrahydropyran with aniline over an activated alumina catalyst has been studied. The product, in each case, consisted of a mixture of an N-arylpiperidine, an N-arylpyrrolidine formed by ring contraction, and two N-alkenylanilines formed by ring opening. The structures of the nitrogen heterocyclic compounds were established by independent syntheses involving the reaction of the appropriate dibroinoalkane with aniline. The N-alkenylanilines were characterised by hydrogenation to known N-alkylanilines and by identification of the osonolysis products. / Thesis / Master of Science (MS)

No description available.

No description available.

The vapour-phase reaction of 2-methy-tetrhydropyran and 2-ethyltetralydropyran with aniline over an activated alumina catalyst has been studied. The product, in each case, consisted of a mature of an N-aryl-piperidine, an N-arylpyrrolidine formed by ring contraction, and two N-alkelnylanilines formed by ring opening. The structures of the nitrogen heterocyclic compounds were established by independent syntheses involving the reaction of the appro­priate dibromoalkane with aniline. The N-alkenylanilines were characterised by hydrogenation to known N-alkylanilines and by identification of the osonolysis products. / Thesis / Master of Science (MSc)

There are numerous pre-existing fingerprint development techniques, however, often prints are difficult to develop, depending on their age or the surface upon which they have been deposited. Forensic scientists are relentlessly looking for new and better methods to enhance fingerprints. More recent technologies have higher sensitivity to very low levels of constituents present in residues and so are able to unearth significant details from a person's fingerprints at molecular level e.g. DNA, drug metabolites. Therefore, research continues in an attempt to generate novel, nondestructive processes that can enhance latent fingerprints. Exposing fingerprints to the p-block compounds selenium dioxide (SeO2), phosphorus sulfides (P4Sx) and phosphonitrilic chloride trimer (NPCl2)3, in the vapour phase resulted in latent prints being visualized on a range of media. Selenium dioxide revealed prints on metal surfaces (e.g. brass) which were enhanced further upon formation of a dark brown coating of copper-selenide formed on the surface when exposed to moisture, giving a better contrast. P4S3 vapour revealed a higher percentage of prints and samples had greater stability in air while although (NPCl2)3 was able to develop fingerprints, the low quality was undesirable. Initially it was thought that (NPCl2)3 has the potential for further derivatisation but was proven very difficult to interact with compounds especially those with the potential to induce fluorescence. However, all three compounds are commercially available and sublimation techniques are straightforward.

Semiconductor lasers based on gallium arsenide and relatedmaterials are widely used in applications such as opticalcommunication systems, sensing, compact disc players, distancemeasurement, etc. The performance of these lasers can beimproved using a buried heterostructure offering lateralcarrier and optical confinement. In particular, if theconfinement (burying) layer is implemented by epitaxialregrowth of an appropriate aluminium-free semi-insulating (SI)material, passivation of etched surfaces, reduced tendency tooxidation, low capacitance and integration feasibility areadditional advantages. The major impediment in the fabrication of GaAs/AlGaAsburied-heterostructure lasers is the spontaneous oxidation ofaluminium on the etched walls of the structure. Al-oxide actsas a mask and makes the regrowth process extremely challenging.In this work, a HCl gas-basedin-situcleaning technique is employed successfully toremove Al-oxide prior to regrowth of SI-GaInP:Fe and SI-GaAs:Fearound Al-containing laser mesas by Hydride Vapour PhaseEpitaxy. Excellent regrowth interfaces, without voids, areobtained, even around AlAs layers. Consequences of usinginadequate cleaning treatments are also presented. Regrowthmorphology aspects are discussed in terms of different growthmechanisms. Time-resolved photoluminescence characterisation indicates auniform Fe trap distribution throughout the regrown GaInP:Fe.Scanning capacitance microscopy measurements demonstrate thesemi-insulating nature of the regrown GaInP:Fe layer. Thepresence of EL2 defects in regrown GaAs:Fe makes more difficultthe interpretation of the characterisation results in the nearvicinity of the laser mesa. GaAs/AlGaAs buried-heterostructure lasers, both in-planelasers and vertical-cavity surface-emitting lasers, withGaInP:Fe as burying layer are demonstrated for the first time.The lasers exhibit good performance demonstrating thatSI-GaInP:Fe is an appropriate material to be used for thispurpose and the suitability of our cleaning and regrowth methodfor the fabrication of this type of semiconductor lasers.Device characterisation indicates negligible leakage currentalong the etched mesa sidewalls confirming a smooth regrowthinterface. Nevertheless, experimental and simulation resultsreveal that a significant part of the injected current is lostas leakage through the burying material. This is attributed todouble carrier injection into the SI-GaInP:Fe layer.Simulations also predict that the function of GaInP:Fe ascurrent blocking layer should be markedly improved in the caseof GaAs-based longer wavelength lasers. <b>Keywords:</b>semiconductor lasers, in-plane lasers, VCSELs,GaAs, GaInP, semi-insulating materials, hydride vapour phaseepitaxy, regrowth, buried heterostructure, leakage current,simulation.

<p>Semiconductor lasers based on gallium arsenide and relatedmaterials are widely used in applications such as opticalcommunication systems, sensing, compact disc players, distancemeasurement, etc. The performance of these lasers can beimproved using a buried heterostructure offering lateralcarrier and optical confinement. In particular, if theconfinement (burying) layer is implemented by epitaxialregrowth of an appropriate aluminium-free semi-insulating (SI)material, passivation of etched surfaces, reduced tendency tooxidation, low capacitance and integration feasibility areadditional advantages.</p><p>The major impediment in the fabrication of GaAs/AlGaAsburied-heterostructure lasers is the spontaneous oxidation ofaluminium on the etched walls of the structure. Al-oxide actsas a mask and makes the regrowth process extremely challenging.In this work, a HCl gas-based<i>in-situ</i>cleaning technique is employed successfully toremove Al-oxide prior to regrowth of SI-GaInP:Fe and SI-GaAs:Fearound Al-containing laser mesas by Hydride Vapour PhaseEpitaxy. Excellent regrowth interfaces, without voids, areobtained, even around AlAs layers. Consequences of usinginadequate cleaning treatments are also presented. Regrowthmorphology aspects are discussed in terms of different growthmechanisms.</p><p>Time-resolved photoluminescence characterisation indicates auniform Fe trap distribution throughout the regrown GaInP:Fe.Scanning capacitance microscopy measurements demonstrate thesemi-insulating nature of the regrown GaInP:Fe layer. Thepresence of EL2 defects in regrown GaAs:Fe makes more difficultthe interpretation of the characterisation results in the nearvicinity of the laser mesa.</p><p>GaAs/AlGaAs buried-heterostructure lasers, both in-planelasers and vertical-cavity surface-emitting lasers, withGaInP:Fe as burying layer are demonstrated for the first time.The lasers exhibit good performance demonstrating thatSI-GaInP:Fe is an appropriate material to be used for thispurpose and the suitability of our cleaning and regrowth methodfor the fabrication of this type of semiconductor lasers.Device characterisation indicates negligible leakage currentalong the etched mesa sidewalls confirming a smooth regrowthinterface. Nevertheless, experimental and simulation resultsreveal that a significant part of the injected current is lostas leakage through the burying material. This is attributed todouble carrier injection into the SI-GaInP:Fe layer.Simulations also predict that the function of GaInP:Fe ascurrent blocking layer should be markedly improved in the caseof GaAs-based longer wavelength lasers.</p><p><b>Keywords:</b>semiconductor lasers, in-plane lasers, VCSELs,GaAs, GaInP, semi-insulating materials, hydride vapour phaseepitaxy, regrowth, buried heterostructure, leakage current,simulation.</p>

IQE (Europe) Ltd. manufactures group III/V compound semiconductor material structures, using the Metal Organic Vapour Phase Epitaxy process. The manufactured ranges of semi-conducting materials are relative to discrete or multi-compound use of Gallium Arsenide or Indium Phosphide [III/V]. For MOVPE to compete in large-scale markets, the manufacturing process requires transformation into a reliable, repeatable production process. This need is identified within the process scrap percentage of the process when benchmarked against the more mature Si-CVD process. With this wide-ranging product base and different material systems, flexible processes and systems are essential. The negative impact however, of this demanded flexibility is a complex system, resulting in instability. Minor fluctuations in time, flow, pressure, temperature, or composition in the manufacturing process, will lead to characteristic differences in the produced material [product], when comparing the prescribed run to the actual run. The product profile changes very rapidly, correspondingly the failure profile of the process is equally as dynamic, it is essential therefore that the analysis and projected activities and actions can be identified and consolidated in a timely manner. This project evaluates the process used by IQEE to manufacture III/V compound semi-conducting material structures and uses the business performance to identify the process drivers. One year's [1997] business and process information is used for a single iteration of the improvement cycle. These drivers are then utilised as operators and offer the critical weaknesses in the process related to performance blockages. Some of the techniques utilised in the process evaluation and cause derivation; are original contributions specifically derived for use with a multi-platform complex process with multiple cause and effect operators. A double reporting FMEA contributes a differing rank for like machines running differing products, offering a machine specific failure profile. A novel composite of P-diagram and process flow techniques enables determination of activity influences confirming the key failure mechanism as previously identified by the business risk analysis. This project concludes by nominating the key failure mechanism accounting for 41% of the approximate 50% scrap figure identified again within the business risk analysis. The effects attributed to this failure mechanism are 2- dimensionally analysed utilising an original double operating FMEA, plotting effect to effect for the individual causes, offering a prioritised list of failure categories. The highest priority failure mode is addressed by an equipment design exercise, resulting in an overall 10% sales potential recontribution.