NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 6 of 6 (0.139 seconds)

Spelling suggestions: "subject:"fire bonding (6electronic packaging)"" "subject:"fire bonding (belectronic packaging)""

1

Characterization of copper diffusion in advanced packaging /

Zhang, Xiaodong. January 2007 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 134-144). Also available in electronic version.
2

Optimization of metallization and process variables in low temperature wire bonding technology /

Chan, Yu Hin. January 2003 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.
3

Wideband characterization of wire bond interconnects for microwave integrated circuit packaging

Sutono, Albert 05 1900 (has links)
No description available.
Wire bonding (Electronic packaging)
Microwave circuits
4

Multiwire microstrip interconnects for high-frequency integrated circuit packaging

Cafaro, Nicholas Giovanni, Jr. 05 1900 (has links)
No description available.
Wire bonding (Electronic packaging)
Microwave circuits
5

Characterization of temperature variation during the wire bonding process

Suman, Shivesh K. 08 1900 (has links)
No description available.
6

Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes

Srinivasan, Guruprasad. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.

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