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Characterization of copper diffusion in advanced packaging /Zhang, Xiaodong. January 2007 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 134-144). Also available in electronic version.
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Optimization of metallization and process variables in low temperature wire bonding technology /Chan, Yu Hin. January 2003 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.
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Wideband characterization of wire bond interconnects for microwave integrated circuit packagingSutono, Albert 05 1900 (has links)
No description available.
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Multiwire microstrip interconnects for high-frequency integrated circuit packagingCafaro, Nicholas Giovanni, Jr. 05 1900 (has links)
No description available.
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Characterization of temperature variation during the wire bonding processSuman, Shivesh K. 08 1900 (has links)
No description available.
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Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishesSrinivasan, Guruprasad. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.
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