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Effective heat management is essential for preserving performance and dependability as electronic equipment becomes increasingly powerful and smaller. This project presents the developed system, TeRMeS, which was created to test the thermal resistance of thermal interface materials (TIMs) essential for the thermal management of electronic devices, including battery systems. This work focuses on using steady-state techniques to evaluate TIMs under various operational forces and temperatures in real-world electronic packaging conditions. A noteworthy breakthrough is the creation of a user-friendly graphical user interface (GUI), which offers sophisticated options for real-time thickness measurement and enables researchers to alter parameters and dynamically display outcomes, thereby improving the measuring process. The results of the experiment highlight the importance of TIM thickness and applied force in lowering thermal resistance and increasing thermal conductivity. These elements are necessary to prevent battery packs and electrical parts from overheating. To improve heat management strategies in high-performance computing and electronics, the study provides accurate, reliable data by focusing on steady-state measurements.