NDLTD Global ETD Search
  • Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 4
  • Tagged with
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
  • 3
  • 3
  • 2
  • 2
  • 2
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 4 of 4 (0.058 seconds)

Spelling suggestions: "subject:"bottom up film"" "subject:"bottom up file""

1

Analysis Of The ‘Bottom–Up’ Fill During Copper Metallization Of Semiconductor Interconnects

Akolkar, Rohan N. January 2005 (has links)
No description available.
Engineering, Chemical
Copper Electrodeposition
Bottom-up Fill
Additives
Mathematical Modeling
2

FUNCTION OF ADDITIVES IN COPPER ELECTRODEPOSITION FOR SEMICONDUCTOR DEVICE METALLIZATION

Adolf, James David 03 April 2008 (has links)
No description available.
Chemical Engineering
leveler
bottom up fill
kinetic parameters
copper
JGB
PEG
SPS
3

Modeling the Role of Plating Additives in the Metallization of Semiconductor Interconnects: From Dual Damascene to Through Silicon Vias

Adolf, James 01 June 2011 (has links)
No description available.
Chemical Engineering
Copper Electrodeposition
Bottom-Up Fill
Plating Additives
Electrochemical Modeling
4

Additives Screening Techniques and Process Characterization for Electroplating of Semiconductor Interconnects

Boehme, Lindsay Erin 11 June 2014 (has links)
No description available.
Chemical Engineering

Page generated in 0.0625 seconds