This thesis investigates end-effector systems used in a chemomechanical scribing process. Chemomechanical scribing is a method of patterning silicon to selectively deposit a monolayer of material on the surface of the silicon. This thesis details the development of a unique end-effector for chemomechanical scribing using a compliant mechanism solution. The end-effector is developed to scribe lines that have uniform geometry and produce less chipping on the surface of the silicon. The resulting scribing mechanism is passively controlled, has high lateral stiffness, and low axial stiffness. The mechanism is analyzed using the pseudo-rigid-body model and linear-elastic beam method to determine the axial stiffness, finite element methods to determine the lateral stiffness, and fatigue analysis to determine mechanism cycle life. This thesis also investigates the significance of mechanical factors on the chemomechanical scribing process using the compliant end-effector. The factors examined are scribing force, scribing speed, tip geometry, wafer orientation, and wetting liquid. The factors are analyzed using a two-step approach: first, an analysis of the influence of the mechanical factors on line characteristics and second, an analysis of the influence of line characteristics on line performance.