The introduction of deep reactive ion etching (DRIE) technology has greatly expanded the accessible design space for microscopic systems. Structures that are hundreds of micrometers tall with aspect ratios of 40:1, heretofore impossible, can now be achieved. However, this technology is primarily a forming technology, sculpting structures from a substrate. This work seeks to complement deep reactive ion etching by developing an electrical isolation technology to enable electro-mechanical function in these new deep reactive ion etched structures. The objective of the research is twofold. The first is to develop and characterize an electrical isolation technology for DRIE, single crystal silicon (SCS) micro-electro-mechanical systems (MEMS) using temperature gradient zone melting (TGZM) of aluminum junctions for diodic isolation. The second is to demonstrate the utility of this electrical isolation technology in the design, simulation, fabrication, and testing of a MEMS device, i.e. a micro-gyroscope, in such a way that the benefits from junction isolated, deep reactive ion etched, single crystal silicon devices are preserved.

This thesis presents the optimization of deep reactive ion etching process (DRIE) to achieve high precision 3-dimensional integrated micro electro mechanical systems (MEMS) sensors with high aspect ratio structures. Two optimization processes have been performed to achieve 20 &amp / #956 / m depth for 1 &amp / #956 / m opening for a dissolved wafer process (DWP) and to achieve 100 &amp / #956 / m depth for 1 &amp / #956 / m opening for silicon-on-glass (SOG) process. A number of parameters affecting the etch rate and profile angle are investigated, including the step times, etch step pressure, platen power, and electrode temperature. Silicon etch samples are prepared and processed in METU-MET facilities to understand and optimize the DRIE process parameters that can be used for the production of MEMS gyroscopes and accelerometers. The etch samples for DWP are masked using a photoresist, Shipley S1813. After the optimization process, vertical trench profiles are achieved with minimum critical dimension loss for trench depths up to 20 &amp / #956 / m. Since the selectivity of the resist is not sufficient for 100 &amp / #956 / m deep trench etch process, silicon dioxide (SiO2) is used as the mask for this process. At the end of the optimization processes, more than 100 &amp / #956 / m depth for 1 &amp / #956 / m opening with almost vertical sidewalls are achieved. In summary, this study provides an extensive understanding of the DRIE process for successful implementations of integrated MEMS sensors.

Three ionic liquids (ILs), trihexyltetradecylphosphonium tetrafluoroborate (TTPT), N-butyl-4-methylpyridinium tetrafluoroborate (BMPT), and 1-methyl-3- octylimidazolium tetrafluoroborate (MOIC), were utilized to prepare sol- gel sorbent coatings. Non-polar polydimethylsiloxane (PDMS) and polar poly(ethylene glycol) (PEG), poly(tetrahydrofuran) (PolyTHF) and bis[(3-methyldimethoxy-silyl)propyl] polypropylene oxide (BMPO) polymers were employed to develop novel ionic liquidmediated sol- gel hybrid organic- inorganic sorbents. The novel sorbents were first tested as coatings for capillary microextraction off-line hyphenated to gas chromatography. To gain an understanding of the role of the ionic liquids in the sol-gel process, the preconcentration abilities of these novel coatings were investigated for several classes of compounds utilizing CME-GC. This was accomplished by comparing GC peak areas of a series of analytes extracted on the ionic liquid mediated sol-gel CME coatings with that of analogous peak areas obtained on sol- gel coatings prepared without the ionic liquid. The morphology of these coatings was compared using scanning electron microscopy (SEM) imaging data. Overall, the ionic liquid-mediated sol- gel coatings had more porous morphologies than the sol-gel coatings prepared without ionic liquid. The PDMS andBMPO sol-gel coatings prepared with ionic liquid in the sol solution provided enhanced extraction sensitivity reflected in higher preconcentration effects and lower detection limits than the sol- gel coatings prepared without the ionic liquid. The polar IL-mediated BMPO sol- gel sorbent was further investigated by exploring the extraction profile and thermal stability of these coatings. A further application of ionic liquid-mediated sol-gel sorbents could be as stationary phases in a microchip-based separation system. Towards this goal, microfluidic channels were fabricated in glass substrates using microelectromechanical engineering. Spiral and serpentine channels were etched in Pyrex and fused silica wafers using wet and deep reactive ion etching (DRIE) techniques. Microfabrication protocols such as the use of hard mask and etching times were investigated for both techniques. DRIE produced microfluidic channels that had an etch quality that was superior to wet etched channels. Thus, the ultimate microchip-based separation system should by fabricated using DRIE.