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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 1 to 3 of 3 (0.048 seconds)

Spelling suggestions: "subject:"durchkontaktierung"" "subject:"durchkontaktierungen""

1

3-dimensional chip integration technology and critical issues

Benkart, Peter January 2009 (has links)
Zugl.: Ulm, Univ., Diss., 2009
2

Processing Effect on Via Extrusion for Through-Silicon Vias (TSVs) in 3D Interconnects: A Comparative Study of Two TSV Structures

Jiang, Tengfei, Spinella, Laura, Im, Jay, Huang, Rui, Ho, Paul S. 22 July 2016 (has links) (PDF)
In this paper, processing effects of electroplating and post- plating annealing on via extrusion are investigated. The study is based on two TSV structures with identical geometry but different processing conditions. Via extrusion, stress and material behaviors of the TSV structures were first compared. Electron backscatter diffraction (EBSD) and time-of-flight secondary ion mass spectroscopy (TOF-SIMS) were used to characterize the microstructure of TSVs and the additives incorporated during electroplating. Based on the results, processing effects on via extrusion and its mechanism are discussed, including grain growth, local plasticity, and diffusional creep.
3D integration
through-silicon via
via extrusion
thermal stress
microstructure
ddc:620
Durchkontaktieren
Wärmespannung
Mikrostruktur
3

Processing Effect on Via Extrusion for Through-Silicon Vias (TSVs) in 3D Interconnects: A Comparative Study of Two TSV Structures: Processing Effect on Via Extrusion for Through-Silicon Vias (TSVs) in 3DInterconnects: A Comparative Study of Two TSV Structures

Jiang, Tengfei, Spinella, Laura, Im, Jay, Huang, Rui, Ho, Paul S. 22 July 2016 (has links)
In this paper, processing effects of electroplating and post- plating annealing on via extrusion are investigated. The study is based on two TSV structures with identical geometry but different processing conditions. Via extrusion, stress and material behaviors of the TSV structures were first compared. Electron backscatter diffraction (EBSD) and time-of-flight secondary ion mass spectroscopy (TOF-SIMS) were used to characterize the microstructure of TSVs and the additives incorporated during electroplating. Based on the results, processing effects on via extrusion and its mechanism are discussed, including grain growth, local plasticity, and diffusional creep.
info:eu-repo/classification/ddc/620
ddc:620

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