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Noble metal nanoparticles are of great interest due to their tunable optical and radiative properties. The specific wavelength of light at which the localized surface plasmon resonance occurs is dependent upon the shape, size and composition of the particle as well as the dielectric constant of the host medium. Thus, the optical properties of noble metal nanoparticles can be systematically tuned by altering these specific parameters. The purpose of this thesis is to investigate some of these properties related to metallic nanoparticles. The first several chapters focus on theoretical modeling to predict and explain various plasmonic properties of gold and silver nanoparticles while the later chapters focus on more accurately combining experimental and theoretical methods to explain the plasmonic properties of hollow gold nanoparticles of various shapes. The appendix contains a detailed description of the theoretical methods used throughout the thesis. It is intended to serve as a guide such that a user could carry out the various types of calculations discussed in this thesis simply by reading this appendix.

Electron beam lithography (EBL) and Nanoimprint Lithography (NIL) are the promising tools for today’s technology in terms of resolution capability, fidelity and cost of operation. Achieving highest possible resolution is a key concept for EBL where there is a huge request in applications of nanotechnology for sub-20 nm feature sizes. Defining features at these length scales is a challenge, and there is a large demand for resist that is not only capable of giving high resolution but also having low cost and ease of process. In this work I studied Polystyrene (PS) which is an alternative organic e-beam resist in terms of ease of process and resolution capability. I examined the process of electron-beam exposure and attempted to characterize the factors that affect the achieved resolution and sensitivity. Besides this work, I designed and fabricated a new type of mold for NIL since mold fabrication is a key factor for NIL technology. The resolution of NIL process depends on the mold features and polymer mold technology received great attention in terms of cost of fabrication and process, fidelity, and reliability. I used MD 700 Fluoropolymer as a new type of polymer mold which was believed to be a good candidate for the polymer mold of high throughput NIL.

Microelectronic fabrication of Si typically involves high-temperature or high-energy processes. For instance, wafer fabrication, transistor fabrication, and silicidation are all above 500°C. Contrary to that tradition, we believe low-energy processes constitute a better alternative to enable the industrial application of single-molecule devices based on 2D materials. The present work addresses the postsynthesis processing of graphene at unconventional low temperature, low energy, and low pressure in the poly methyl-methacrylate- (PMMA-) assisted transfer of graphene to oxide wafer, in the electron-beam lithography with PMMA, and in the plasma patterning of graphene with a PMMA ribbon mask. During the exposure to the oxygen plasma, unprotected areas of graphene are converted to graphene oxide. The exposure time required to produce the ribbon patterns on graphene is 2 minutes. We produce graphene ribbon patterns with ∼50 nm width and integrate them into solid state and liquid gated transistor devices. / )e submitted manuscript has been created by UChicago Argonne, LLC, Operator of Argonne National Laboratory (“Argonne”). Argonne, a U.S. Department of Energy Office of Science laboratory, is operated under Contract DE-AC02-06CH11357. )e U.S. Government retains for itself, and others acting on its behalf, a paid-up nonexclusive, irrevocable worldwide license in said article to reproduce, prepare derivative works, distribute copies to the public, and perform publicly and display publicly, by or on behalf of the government. Funding text #2 )e Center for Nanoscale Materials was supported by the U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences, under Contract DE-AC02-06CH11357. )e authors also acknowledge financial support from Argonne National Laboratory’s Laboratory-Directed Research and Development Strategic Initiative. / Revisión por pares

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In the present investigation, a comprehensive photonic characterization and analysis of low energy Ar⁺ ion beam processed GaAs surfaces is presented. The purpose of this investigation was to evaluate the damage and amorphization introduced at the surface and sub-surface regions by ion bombardment. Ar⁺ ion beam etching was selected in order to rule out the possibility of producing any additional effects at the interface due to chemical reactions in the case of reactive ion etching. After a brief review of the concepts and underlying physics, several photonic structures are introduced. The basic theory governing the photovoltaic devices and photoconductive samples is discussed. The preparation and characterization techniques of ion beam processed GaAs samples are described. An automated photovoltaic materials and devices (PVMD) system was developed. Asyst, a Forth based scientific software was selected to write the source codes for data acquisition and reduction. The inherent fast execution times of the software allows data acquisition in real time, ensuring the quasi-steady state condition. The electrical and optical evaluation procedures developed and employed for the present investigation are discussed. One of the striking features of the ion beam bombardment on semi-insulating (SI) GaAs samples was the observation of persistent photoconductivity. A phenomenological model for optically generated ion beam induced metastable defect state formation was proposed to explain the persistent photoconductivity. Presence of two or more exponential curves in the relaxation mode indicates the distributed nature of the traps within the band gap. A conjectural flat-band energy diagram was introduced to elucidate the proposed model. The observed dark and photoconductivity response model was based on the distributed lumped electrical components analysis. Fundamental transport equations were employed in the analysis of the lumped electrical components model. Metal-Insulator-Semiconductor (MIS) type Schottky barrier diodes and photodiodes were fabricated employing both thermal and anodic oxides. Diode parameters were evaluated as a function of ion-beam energy. An increase in reverse saturation current density accompanied by an increase in the ideality factor was observed, indicating the presence of trap-assisted tunneling and a region of high recombination. The effective barrier height was generally lowered; however, no monotonic correlation with the ion energy was observed. It is proposed that the mechanisms described in previous studies (e.g. tunneling, stoichiometry effects, ion penetration depth) were dominated by the effect of Fermi level pinning at the electronic states of process-induced defects. Deep level transient spectroscopy (DLTS) indicated the presence of at least two distinct deep trap levels, at 0.32 eV and at 0.52 eV below the conduction band edge, as a consequence of ion beam etching. The EL2 peak was evident in the virgin sample and vanished in the ion beam etched samples and such observation is in agreement with our proposed model. The photovoltaic response was characterized using illuminated current-voltage (I-V) and spectral response measurements. The ratio of external quantum efficiencies of IBE devices to unetched device indicates the regions and relative extent of the damage. Since the damage has a impact on the band-bending due to excess carrier generation, the sub-bandgap photon absorption response reveals the degree of disorder. XPS results indicated an increased surface sensitivity and change in Ga/As ratio as a function of ion beam energy. The modelling of ion-beam-processed samples was considered and several computer programs which simulate their operation are described. The depth of amorphization was calculated using the Lindhard-Scharff-SchiΦtt (LSS) theory and the standard projected range and straggle parameters, and experimental parameters. A large difference was observed in the values calculated using LSS theory and experimentally measured values, using optical probes. The difference was explained in light of the Collision-Cascade model. / Ph. D.

Over the past decade there has been an explosion in the demand for wireless mobile personal communications systems (PCS), a trend that shows no signs of slowing down in the foreseeable future. This demand has created a greater need for low-cost, low-power, compact system solutions. As a result, "single-chip" implementations of wireless functions have received a significant amount of attention. A significant roadblock to complete integration of these functions is the requirement for high-Q resonators in RF filter and tank circuits. Current on-chip techniques being used to realize monolithic RF resonators based on planar inductors, capacitors and active circuits are accompanied by problems such as high loss, large chip area and high power consumption. An alternative to these on-chip solutions is the use of monolithically integrated electromechanical devices. This thesis describes the modeling, fabrication and characterization of nanoelectromechanical (NEM) single crystal silicon resonators. The potential advantages associated with these devices are high-Q, small die area and low power consumption. The development of such devices compatible with modern integrated circuit fabrication techniques offers the possibility for integration of high performance RF filters and resonators onto a single RFIC chip. The advantageous characteristics of these resonators could lead to mobile PCS devices with lower cost and increased battery life. The NEM resonator designs investigated in this work are fabricated using an electron-beam lithography based surface machining process in silicon-on-insulator technology. Various design, fabrication and testing issues are discussed. The feasibility of lateral capacitive actuation and detection in such structures is examined. / Master of Science

Oxide materials display a wide range of physical properties. Recently, doped complex oxides have drawn considerable attention for various applications including thermoelectrics. Doped complex oxide materials have high Seebeck coefficients (S) and electrical conductivities (o) comparable to other doped semiconductors but low thermoelectric figure of merit ZT values due to their poor thermal conductivities. For example, niobium doped strontium titanate (SrNbxTi_1-xO₃ or simply Nb:STO) has a power factor comparable to that of bismuth telluride. Semiconductor nanostructures have demonstrated a decrease in thermal conductivity (κ) resulting in an increase in the thermoelectric figure of merit (ZT). Nanostructures of doped oxides like niobium doped strontium titanate, may also lead to decreased κ and a corresponding increase in ZT. The major impediment to nanostructured oxide thermoelectric materials is the lack of suitable fabrication techniques for testing and eventual use. Electron Beam Lithography (EBL) was used to pattern poly-methyl-methacrylate (PMMA) resists on undoped single crystalline SrTiO₃ (STO) substrates which were then filled with Nb:STO using Pulsed Laser Deposition (PLD) at room temperature. This technique produced nanowires and nanodots with critical dimensions below 100 nm, and a yield of approximately 95%. In addition to scanning electron microscopy and atomic force microscopy morphological studies of the patterned oxide, thin film analogues were used to study composition, crystallinity and electrical conductivity of the material in response to a post deposition heat treatment. Since the thin films were grown under similar experimental parameters as the oxide nanostructres, the patterned oxides are believed to be stoichiometric and highly crystalline. The study found that using a combination of EBL and PLD, it is possible to produce highly crystalline, doped complex oxide nanostructures with excellent control over morphology. Furthermore, the technique is applicable to nearly all materials and provides the capability of patterning doped oxide materials without the requirement of etching or multiple lithography steps makes this approach especially interesting for future fundamental materials research and novel device fabrication. / Master of Science