In the study, the effects of the machining conditions, ex, machining positions, loads and rotating speed ratio on machining mechanism of wafer are investigated by using the continuous composite electroplated polisher and find the best machining conditions of the polisher. Experimental results show that when the wafer and polisher are full contact, the operating of machinery is most smooth and the flatness is better. When the load is increased, the reducing rate of average roughness¡]Ra¡^and maximum roughness¡]Rmax¡^, removal rate, and the speed of mirror degree are increased. The machining mechanism and the stability of machinery is depended on the value of rotating speed ratio. In the different rotating speed ratio, the flatness of wafer is difference. For example, the rotating speed ratio is 1, the flatness is 1.5 £gm/38 mm. The rotating speed ratio is 2, the flatness is 2.3 £gm/38 mm. Finally, choose the rotating speed ratio, which the values of rotating speed are close and complex on the range of rotating speed which machinery can be operating most stable in machining process. Because of the machining mechanism are similar and the grinding locus are finer. Hence, the flatness of wafer becomes better. When the rotating speed ratio is 1.1, the flatness is 1.46£gm/38 mm. The rotating speed ratio is 1.11, the flatness is 1.45£gm/38 mm. The effect of the rotating speed ratio of the wafer and polisher on the grinding locus type of grinding surface is theoretically analyzed. Results show that when the rotating speed ratio is irregular, the distribution of grinding locus becomes finer. The analyzable results of locus and provable results of experiment are the same.

Diamond has superior characteristics, such as high hardness, high isolation, and high breakdown voltage, but it is also difficult to manufacture for industrial application. Because diamond is a nonconductor, the usual electrical discharge machining (EDM) method cannot be used. Hence, this study uses the plating nickel to keep the diamond powder as the composite electroplated layer of nickel-diamond powder. The variation of the composite layer and the diamond particle erosion characteristic after arc discharge can be realized by single-arc discharge. By the result of experiment, it can be known that the erosion area will be enlarged when the diamond particle is near to central erosion area, because the diamond that has good heat stability makes plasma to spread. The erosion area will be decreased when the diamond particle is near to edge of erosion area, because it stops the melted nickel to spread. The surface of diamond particle is broken slightly that the particle become more spherical and has some nickel remain on it when pulse voltage is less than 300 volt or the diamond particle is near to edge of erosion area. The surface of diamond particle is broken seriously that the particle is cracked to pieces when pulse voltage is more than 300 volt or the diamond particle is near to central erosion area.

Physical, chemical and corrosion properties of a hexavalent chromium conversion coating (CCC) and that of a commercial third generation trivalent chromium system; Tripass LT1500, on zinc electrodeposited steel has been studied. Moreover, the role of additives has been studied to elucidate film formation and corrosion resistance mechanisms. Micro-cracking and self-repair corrosion protection behaviour commonly associated with hexavalent CCCs has also been investigated. Scanning Electron Microscopy (SEM) studies showed that for both hexavalent and trivalent CCCs were in general, flat with a spherical-like structure and in the case of the former microcracked beyond 122 nm conversion coating thickness. In general, the micro-crack pattern observed e.g. a dense crack network, depended upon the underlying zinc substrate morphology. The study has also demonstrated the effect of SEM imaging and prior specimen preparation conditions on hexavalent CCC micro-cracking and blistering. X-ray Photoelectron Spectroscopy (XPS), Auger Electron Spectroscopy (AES) and Infrared (IR) data has indicated that the hexavalent CCC film formation appears to be a electrochemical/sol-gel mechanism given the lack of zinc content at surface and subsurface regions within the conversion coating, presence of H2O and in particular the contribution of Cr(OH)3 as opposed to Cr2O3. An alternative film formation mechanism may exist for trivalent CCC given a higher proportion of zinc at surface and sub-surface regions, IR data analysis indicating that chromium is possibly deposited from a chromium (III) complex ion such as [CrC2O4(H2O)4] + , moreover as Cr(OH)3 and Cr2O3 compounds as indicated by XPS data analysis. The role of cobalt nitrate during film formation is unclear given that cobalt was not detected within the trivalent CCC from XPS and AES data. Electrochemical LPR measurements, polarisation curves and XPS data has shown in general, self-repair corrosion protection properties for hexavalent CCC to be lacking. Instead, it is proposed that the corrosion protection behaviour for hexavalent and trivalent CCC to be barrier. Polarisation curves and LPR data showed that the corrosion resistance performance for trivalent CCC was higher than hexavalent CCC, in general. LPR data showed that the omission of cobalt nitrate and increased addition of sodium molybdate content within the Tripass LT1500 treatment solution formulation was found to overall decrease corrosion resistance within the trivalent CCC. In addition, silica based topcoat and black trivalent CCCs was also investigated and characterised using AES, SEM and LPR. Zinc whiskers was also observed from zinc electrodeposits following exposure to thermal treatment (150°C for 1 h). Elemental analysis and grain pattern investigations failed to help determine the cause of zinc whisker initiation. Zinc whiskers was seen to protrude out of hexavalent and trivalent CCCs, with the latter requiring a longer thermal exposure time.

Les whiskers, filaments métalliques qui poussent sur des surfaces métalliques, sont unproblème très important pour la fiabilité des composants électroniques. Depuis ces dernièresannées, il y a eu un regain d’intérêts industriels dans le domaine de la croissance des whiskers,principalement en raison de la miniaturisation des dispositifs électroniques et des réglementationsenvironnementales interdisant l'utilisation du plomb.Alors que la plupart des recherches concernent les whiskers d'étain, il y a encore peu detravaux sur les whiskers de zinc. Les revêtements d’électrodéposés de zinc sont utilisés commeprotection anticorrosion pour les aciers faiblement alliés dans diverses industries, commel'automobile, l'aéronautique ou l'énergie, ainsi que dans les structures de soutien ou les planchersfaux plafonds dans les centres de données informatiques. Afin d'atténuer, de prévenir et deprédire les défaillances causées par les whiskers de zinc, les mécanismes de sa croissance doiventêtre compris.Grâce à des tests de stockage accéléré et à des observations par microscopie électronique àbalayage (MEB), la cinétique de croissance des whiskers de zinc a été étudiée sur des tôles d'acierau carbone faiblement allié, galvanisé et chromé. Afin de comprendre les mécanismes de lacroissance des whiskers de zinc, la caractérisation quantitative ainsi que les excroissances (densité,volume et vitesse de croissance) ont été reliées aux paramètres suivants: la température, le bainpour l’électrodéposition du zinc, la chromatation, l’épaisseur du substrat d’acier, l’épaisseur durevêtement de zinc ainsi que la contrainte résiduelle.En outre, la microstructure et la cristallographie du revêtement de zinc, des racines deswhiskers ainsi que des whiskers elles-mêmes ont été étudiées par diffraction des électronsrétrodiffusés (EBSD), microscopie électronique à transmission (MET), microanalyse par rayon X(EDX) et le dispositif ASTAR pour l'orientation locale des grains; la préparation des échantillonsa été réalisée à l’aide d’un faisceau d'ions focalisés (FIB). La recristallisation ainsi que lesdislocations dans les whiskers et les excroissances ont été observés; aucun composéintermétallique n’a été observé que ce soit dans les échantillons issus de différents bainsélectrolytes ou encore dans les films / whiskers.Il a été montré que la relaxation de contrainte de compression résiduelle et la croissance deswhiskers sont deux phénomènes différents mais fortement reliés et thermiquement activés.Chacun d'entre eux suit un mécanisme différent; les énergies d'activation apparentes des deuxphénomènes ont été établies, et la diffusion aux joints de grains est proposée comme le principalmécanisme de diffusion pour la croissance des whiskers.Des cinétiques de la croissance des whiskers, à la fois analytique et phénoménologique sontproposées. Une bonne estimation de la croissance des whiskers et de leur vitesse de croissance àdes températures proches des conditions de fonctionnement est obtenue par comparaison avecles données expérimentales. / Whiskers, conductive metallic filaments that grow from metallic surfaces, are a very importantissue for reliability of electronic components. Through recent years, there has been a renewedindustrial interest on whisker growth, mainly due to the miniaturization of electronic devices andthe environmental regulations forbidding the use of lead.While most of the research has been focused on tin whiskers, there is still little reference tozinc whiskers. Electroplated zinc coatings are actually used as anticorrosive protection for lowalloy steels in diverse industries such as automotive, aerospace or energy, as well as for supportstructures or raised-floor tiles in computer data centers. In order to mitigate, prevent and predictthe failures caused by the zinc whiskers, the mechanisms of growth must be understood.By accelerated storage tests and Scanning Electron Microscopy (SEM) observation, kinetics ofgrowth of zinc whiskers was studied on low alloy chromed electroplated carbon steel.Quantitative characterization of both whisker and hillocks (density, volume and growth rate) wasrelated with the parameters temperature, electroplating electrolyte, presence of chrome, steelsubstrate thickness, zinc coating thickness and residual stress, in order to understand themechanisms of growth.Additionally, both microstructure and crystallography of zinc coating, whisker roots and actualwhiskers were studied by Electron Backscatter Diffraction (EBSD), Transmission ElectronMicroscopy (TEM), Energy-dispersive X-ray spectroscopy (EDX) and local grain orientationwith ASTAR setup, using Focused Ion Beam (FIB) for samples preparation. Recrystallization aswell as dislocations were observed in both whiskers and hillocks; no intermetallic compoundswere seen in neither electroplated nor whiskers.It is found that compressive residual stress relaxation and whiskers growth are two differentbut strongly interconnected phenomena both thermally activated, an each of them follows adifferent mechanism; apparent activation energies of the two phenomena are calculated, andgrain boundary diffusion is established as the main diffusion mechanism for whiskers growth.Whiskers growth kinetics, both analytical and phenomenological is proposed. Goodestimation of whiskers growth and whiskers growth rate at temperatures close to operationconditions is obtained when compared with experimental data. / Whiskers, filamentos metálicos que crecen en superficies metálicas, son un problema muyimportante para la fiabilidad de componentes electrónicos. Durante los últimos años, ha habidoun renovado interés industrial en el crecimiento de whiskers, debido principalmente a laminiaturización de dispositivos electrónicos y a las regulaciones ambientales que prohíben lautilización de plomo.La mayoría de las investigaciones se concentran en los whiskers de estaño y hay todavía pocostrabajos sobre los whiskers de zinc. Los recubrimientos de zinc electrodepositado son utilizadoscomo protección anticorrosión para los aceros de baja aleación en diversas industrias, comoautomotriz, aeronáutica o energética, así como en la estructuras de soporte o tejas de techosfalsos en los centros de datos informáticos. Para atenuar, prevenir y predecir las fallas causadaspor los whiskers de zinc, los mecanismos de crecimiento deben ser comprendidos.Gracias a experimentos de almacenamiento de muestras y a observaciones por microscopíaelectrónica de barrido (SEM), la cinética de crecimiento de whiskers de zinc ha sido estudiada enaceros de baja aleación recubiertos de zinc y cromados. Para comprender los mecanismos decrecimiento de whiskers de zinc, la caracterización cuantitativa de whiskers y de protuberancias(densidad, volumen y velocidad de crecimiento) fue relacionada con los parámetros siguientes:temperatura, electrolito usado en la electrodeposición de zinc, cromado, espesor del substrato deacero, espesor del recubrimiento de zinc al igual que el estrés residual.Adicionalmente, microestructura y cristalografía del recubrimiento de zinc, de raíces dewhiskers así como de los propios whiskers fueron estudiadas por medio de la difracción deelectrones por retrodispersión (EBSD), microscopía electrónica de transmisión (TEM),microanálisis por rayos X (EDX) y el dispositivo ASTAR para la orientación local de granos; lapreparación de muestras fue realizada con la ayuda de un haz de iones localizados (FIB). Larecristalización así como las dislocaciones en whiskers y protuberancias fueron observadas;ningún compuesto intermetálico ha sido observado en los recubrimientos ni en los whiskers.Se determinó que la relajación del estrés residual de compresión y el crecimiento de whiskersson dos fenómenos diferentes pero fuertemente interconectados y térmicamente activados. Cadauno de ellos sigue un mecanismo diferente; las energías de activación aparentes de los dosfenómenos han sido establecidas, y la difusión por bordes de grano es propuesta como elprincipal mecanismo de difusión para el crecimiento de whiskers.Cinéticas de crecimiento de whiskers, a la vez analíticas y fenomenológicas son propuestas.Una buena estimación del crecimiento de whiskers y su velocidad de crecimiento a temperaturascercanas a las condiciones de operación es obtenida por comparación con los datosexperimentales.