Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm). Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.

Electrostatically actuated silicon membranes were designed, modeled, fabricated, and characterized. The intended application was for use in a microspeaker. Fabrication issues necessitated the use of thick diaphragms with a large gap between the electrodes. The devices did not function as speakers but did show actuation with a high DC voltage. Device dimensions were chosen by examining membrane mechanics, testing the processing steps required for device fabrication, and modeling with COMSOL. Several adhesives were researched to fabricate the device sidewalls, including BCB, PMMA, and TRA-Bond F112. A method for patterning PMMA through photolithography was found using a scanning electron microscope. Masks were designed in AutoCAD to create the electrostatically actuated devices and a microfabrication process was developed to produce diaphragms that could be characterized. Twenty micron thick diaphragms were fabricated by etching an SOI wafer in 25% TMAH and the etch depth was measured with a profilometer. Glass slides were coated with gold and patterned with positive photoresist to create counter-electrodes. The diaphragms were bonded to the glass slides using a forty micron thick layer of patterned SU-8 as sidewalls. Bonding was successful in the initial fabrication testing but not successful for the final devices. The final fabrication run resulted in eight devices that were partially bonded. Three devices were chosen to test the membrane actuation and the data analyzed for statistical significance. A DC voltage was applied to the electrodes with a MEMS driver and the change in force measured with a micro-force displacement system. Data analysis showed device actuation at high voltages (300V) for the medium and large devices.

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In this thesis, MEMS switches actuated using electrostatic actuation is explored. MEMS switches that are lateral switches and clamped-clamped switches are designed, fabricated, and tested in this thesis. This thesis extensively explains the process by which the MEMS Switches were designed and fabricated. In addition, it explains the changes in the switches when issues called for a modification to devices. Contact resistances were extensively studied, in this thesis. There has been a trade-off between the reliability of switches and their contact resistances. Many actions were taken to mitigate this trade-off and to allow both reliable devices with low contact resistances. The efforts to do so ranged from thermal oxidation to reduce the scalloping on the sidewalls, to modifying the dry etching recipe, to modifying the sputtering recipe, to electroplating, and many more. However, reliability of the MEMS Lateral switches was accomplished independent to the contact resistances. In addition, low contact resistances were accomplished independent to reliability. A novel approach to designing clamped-clamped MEMS switches is also showcased in this thesis. These devices experienced unique challenges compared to those faced with lateral switches. Both lateral and clamped-clamped switches are discussed in-depth in this thesis. / Master of Science

In this work, a multi dimensional RF MEMS variable capacitor that utilizes electrostatic actuation is designed and fabricated on a 425um thick silicon substrate. Electrostatic actuation is preferred over other actuation mechanisms due to low power consumption. The RF MEMS variable capacitor is designed in a CPW topology, with multiple beams supported (1 - 7 beams) on a single pedestal. The varactors are fabricated using surface micromachining techniques. A 1um thick silicon monoxide (Er - 6) is used as a dielectric layer for the varactor. The movable membrane is suspended on a 2.5um thick electroplated gold pedestal. The capacitance between the membrane and the bottom electrode increases as the bias voltage between the membrane and the bottom electrode is increased, eventually causing the membrane to snap down at the actuation voltage. For the varactors designed herein, the actuation voltage is approximately 30 - 90V. Full-wave electromagnetic simulations are performed from 1 - 25GHz to accurately predict the frequency response of the varactors. The EM simulations and the measurement results compare favorably. A series RLC equivalent circuit is used to model the varactor and used to extract the parasitics associated with the capacitor by optimizing the model with the measurement results. The measured capacitance ratio is approximately 12:1 with a tuning range from 0.5 - 6pF. Furthermore, the measured S-parameter data is used to extract the unloaded Q of the varactor (at 1GHz) and is found to be 234 in the up state and 27 in the down state. An improved anodic bonding technique to bond high resistivity Si substrate and low alkali borax glass substrate that finds potential application towards packaging of MEMS varactors is investigated. To facilitate the packaging of the varactors the temperature is maintained at 400°C. The bonding time is approximately 7min at an applied voltage of 1KV.

A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed.

Title from PDF of title page. / Document formatted into pages; contains 88 pages. / Thesis (M.S.E.E.)--University of South Florida, 2003. / Includes bibliographical references. / Text (Electronic thesis) in PDF format. / ABSTRACT: In this work, a multi dimensional RF MEMS variable capacitor that utilizes electrostatic actuation is designed and fabricated on a 425um thick silicon substrate. Electrostatic actuation is preferred over other actuation mechanisms due to low power consumption. The RF MEMS variable capacitor is designed in a CPW topology, with multiple beams supported (1 - 7 beams) on a single pedestal. The varactors are fabricated using surface micromachining techniques. A 1um thick silicon monoxide (Er - 6) is used as a dielectric layer for the varactor. The movable membrane is suspended on a 2.5um thick electroplated gold pedestal. The capacitance between the membrane and the bottom electrode increases as the bias voltage between the membrane and the bottom electrode is increased, eventually causing the membrane to snap down at the actuation voltage. For the varactors designed herein, the actuation voltage is approximately 30 - 90V. / ABSTRACT: Full-wave electromagnetic simulations are performed from 1 - 25GHz to accurately predict the frequency response of the varactors. The EM simulations and the measurement results compare favorably. A series RLC equivalent circuit is used to model the varactor and used to extract the parasitics associated with the capacitor by optimizing the model with the measurement results. The measured capacitance ratio is approximately 12:1 with a tuning range from 0.5 - 6pF. Furthermore, the measured S-parameter data is used to extract the unloaded Q of the varactor (at 1GHz) and is found to be 234 in the up state and 27 in the down state. An improved anodic bonding technique to bond high resistivity Si substrate and low alkali borax glass substrate that finds potential application towards packaging of MEMS varactors is investigated. To facilitate the packaging of the varactors the temperature is maintained at 400°C. The bonding time is approximately 7min at an applied voltage of 1KV. / System requirements: World Wide Web browser and PDF reader. / Mode of access: World Wide Web.

A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed.

A MEMS-based micro-electro-discharge machining technique that is enabled by the actuation of micromachined planar electrodes defined on the surfaces of the workpiece is developed that eliminates the need of numerical control machines. First, the planar electrodes actuated by hydrodynamic force is developed. The electrode structures are defined by patterning l8-µm-thick copper foil laminated on the stainless steel workpiece through an intermediate photoresist layer and released by sacrificial etching of the resist layer. The planer electrodes are constructed to be single layer structures without particular features underneath. All the patterning and sacrificial etching steps are performed using dry-film photoresists towards achieving high scalability of the machining technique to large-area applications. A DC voltage of 80-140 V is applied between the electrode and the workpiece through a resistance-capacitance circuit that controls the pulse energy and timing of spark discharges. The parasitic capacitance of the electrode structure is used to form a resistance capacitance circuit for the generation of pulsed spark discharge between the electrode and the workpiece. The suspended electrodes are actuated towards the workpiece using the downflow of dielectric machining fluid, initiating and sustaining the machining process. Micromachining of stainless steel is experimentally demonstrated with the machining voltage of 90V and continuous flow of the fluid at the velocity of 3.4-3.9 m/s, providing removal depth of 20 µm. The experimental results of the electrode actuation match well with the theoretical estimations. Second, the planar electrodes are electrostatically actuated towards workpiece for machining. In addition to the single-layer, this effort uses double-layer structures defined on the bottom surface of the electrode to create custom designed patterns on the workpiece material. The suspended electrode is electrostatically actuated towards the wafer based on the pull-in, resulting in a breakdown, or spark discharge. This instantly lowers the gap voltage, releasing the electrode, and the gap value recovers as the capacitor is charged up through the resistor. Sequential pulses are produced through the self-regulated discharging-charging cycle. Micromachining of the stainless-steel wafer is demonstrated using the electrodes with single-layer and double-layer structures. The experimental results of the dynamic built-capacitance and mechanical behavior of the electrode devices are also analyzed. / Applied Science, Faculty of / Electrical and Computer Engineering, Department of / Graduate

This thesis presents analysis, design, implementation, and testing of electrostatically actuated MEMS microvalves. The microvalves are specifically designed for lab-on-a-chip applications to achieve leakage ratios below 0.1 at pressure levels in the order of 101 kPa. For this purpose, two different microvalves are presented in the study. In the proposed designs, electrostatic actuation scheme is utilized to operate the microvalves in normally open and normally closed modes. Characterization of normally open microvalves show that, microvalves with radii ranging between 250