Abstract The main objective of this thesis was to research the integration of novel materials and fabrication processes into Low Temperature Co-fired Ceramic (LTCC) technology; enabling fabrication of Radio Frequency (RF) and microwave components with advanced performance. The research focuses on two specific integration cases, which divide the thesis into two sections: the integration of tunable dielectric structures and the integration of air filled waveguides. The first section of the thesis describes the development and characterization of low sintering temperature Barium Strontium Titanate (BST) thick film paste. Sintering temperature of BST is decreased from approximately 1350 °C down to 900 °C by lithium doping and pre-reaction of the doped composition. This allows the co-sintering of the developed BST paste with commercial LTCC materials. Additionally two integration techniques to embed tunable components in an LTCC substrate using the developed BST paste are also presented and the electrical performance of the components is evaluated. The highest measured tunability value was 44% with a bias field of 5.7 V/µm. The permittivity of the films varied between 790 and 190, and the loss tangent varied between 0.004 and 0.005, all measured unbiased at 10 kHz. The developed LTCC compatible BST paste and the presented integration techniques for tunable components have not been previously published. In the second section of the thesis, a fabrication method for the LTCC integrated air-filled rectangular waveguides with solid metallic walls is presented. The fabrication method is described in detail and implemented in a set of waveguides used for characterization. A total loss of 0.1–0.2 dB/mm was measured over a frequency band of 140–200 GHz. The electrical performance of the waveguides is evaluated and their use demonstrated in an integrated LTCC antenna operating at 160 GHz.

This thesis studies the options of using PCB embedding bare die power MOSFET and new packaging of MOSFET to increase the power density in a PCB. This is to decrease the winding losses in an isolated DC/DC converter which, according to "Flex Power Modules", can be done by improving the interleaving between the layers of the transformer and/or decreasing the AC loop. To test the MOSFET packaging two layout are made from a reference PCB, one using embedded MOSFET and the other using the new packaging. The leakage induction and winding losses are simulated and if they are lower compared to the reference PCB prototypes are manufactured. The simulated result is that PCB embedded MOSFET decrease the leakage induction but the winding loss is higher. With the new packaging the leakage induction is higher and the winding loss has linear characteristics. Only the PCB with the new MOSFET packaging is made because the MOSFET die gate pad is too small for the PCB manufacturer to make a via connection to it. The PCB is tested that it operates as a DC/DC converter with a 40-60 V input and a 12 V output. The PCB is put on a test board in a wind-tunnel to test its characteristics under different wind speeds, input voltage and loads. The result is that the PCB has a higher efficiency than the reference PCB but it has worse thermal resistance. Further development of the design needs to be made to improve the thermal resistance. Using new packaging is a way to continue the development of power converter with lower efficiency but embedding MOSFET needs a less complicated manufacturing process before there is any widespread usage.

Cette thèse, qui s’intègre dans le cadre du projet européen EMCOMIT, a pour objectif de contribuer à l’étude des circuits imprimés haute densité d’intégration comportant un nombre de couches important et des composants enterrés. La qualification de cette technologie est effectuée en conduisant des simulations et des mesures électriques sur des véhicules de tests spécifiques. L’analyse des résultats électriques permet d’évaluer l’aptitude de ces matériaux à répondre aux exigences des applications de télécommunication et de technologie de l’information rapide. La fiabilité d’un assemblage de BGA de grande taille sur un circuit imprimé a été évaluée. Des simulations thermomécaniques ont été effectuées afin de calculer les contraintes résiduelles accumulées pendant le procédé d’assemblage puis l’énergie dépensée dans les parties critiques des joints au cours d’un cycle thermique. Simultanément, des BGA reportés sur des circuits imprimés ont été placés dans une chambre climatique et ont subi des variations de températures. / This thesis, which is part of the European EMCOMIT project, aims at contributing to the study of high density printed circuit board including a great number of internal layers and embedded components. The qualification of this technology is done by the way of simulations and electrical measurements on specific test vehicles. The electrical results allow estimating the performance of materials for telecommunication applications and speed data transfer. The reliability of the assembly of the large BGA on a printed circuit board has been evaluated. Thermomechanical simulations have been done in order to compute residual stresses stored during the assembly process and the deformation energy density in the solder joints during one thermal cycle. Simultaneously BGA soldered on printed circuits have been positioned in climatic chamber and have been subjected to temperature variations.