In this thesis, the relationship between the elastic modulus of PDMS and the base/agent ratio (the amount of crosslinking) is studied. Reliable macroscopic compression test instrument was developed. Preload method was applied for the nanoindentation flat punch test to develop full contact. In chapter 2, an easy instrument setup for macroscopic compression test is described. A series of PDMS samples with different base/agent ratios were tested using the macroscopic compression method. The relationship between PDMS elastic modulus and its base/agent ratio was established. In chapter 3, PDMS nanoindentation DMA tests provide stable data with different test control models. The storage modulus collected using nanoindenting DMA tests is comparable with elastic modulus collected in PDMS compression test in chapter 2. Nanoindentation experiments with flat punch were also done to test the elastic modulus of PDMS network 5:1. The adhesion force tests with different nanoindentation tips, which are Berkovich tip, conical tip and cube corner tip, show that PDMS's adhesion force is related to the sample's base/agent ratio, the nanoindentating depth and the tip's geometrical shape.

Dans le cadre de l'intégration « 3D », une technologie d'assemblage par report de puces sur tranche de silicium (« flip chip ») reposant sur un procédé de microinsertion a été développée ces dernières années. Cette technologie est basée principalement sur la mise en contact par thermocompression, de réseaux de (micro)inserts en Nickel ECD, avec des plots de connexions métalliques en Al(Cu). Au cours de ce travail, un scénario de formation du contact entre un unique microinsert de Nickel rugueux et un film mince d'Aluminium lisse, prenant en compte la présence d'Alumine native à l'interface de contact, est proposé pour une gamme de pressions allant du MPa au GPa. L'analyse du contact métal-oxyde-métal se base essentiellement sur la fissuration de l'oxyde natif suivie de l'extrusion du métal au travers des fissures, et nécessite d'établir au préalable les lois de comportement des matériaux mis en jeu à partir d'essais de nanoindentation instrumentée couplés à des simulations numériques. Enfin, la mesure de l'évolution de la résistance électrique de contact en fonction de la force appliquée à l'aide de dispositifs expérimentaux originaux, permet de mettre en évidence les différents mécanismes de formation du contact métallique lors du procédé de microinsertion. / In the field of « 3D » microelectronic integration, a wafer level technology using flip chip stacking and based on a microinsertion process has been developed recently. This technology is mainly based on the contact realized by thermocompression between a network of microinserts made of Nickel ECD, with connections pads in Al(Cu). In this work, a scenario describing the contact establishment between a unique rough microinsert of Nickel and a smooth thin Aluminum film taking into account the presence of native Alumina at the contact interface, is developed for a range of pressures from MPa to GPa. The analysis of the metal-oxide-metal contact is essentially based on the fracture of the native oxide followd by the metal extrusion through cracks, and requires the knowledge of the behaviour laws of materials, obtained from instrumented nanoindentation tests coupled with numerical modeling. Finally, the measure of the electrical contact resistance evolution in function of applied load, with specific pioneering experimental setup, showcases the mechanisms driving the formation of metallic contact during the microinsertion process.