Presented thesis is focused on the study of properties of Ga and GaN nanostructures on graphene. In the theoretical part of the thesis a problematics of graphene and GaN fabrication is discussed with a focus on the relation of Ga and GaN to graphene. The experimental part of the thesis deals with the depositions of Ga on transferred CVD-graphene on SiO2. The samples are analyzed by various methods (XPS, AFM, SEM, Raman spectroscopy, EDX). The properties of Ga on graphene are discussed with a focus on the surface enhanced Raman scattering effect. Furthermore, a deposition of Ga on exfoliated graphene and on graphene on a copper foil is described. GaN is fabricated by nitridation of the Ga structures on graphene. This process is illustrated by the XPS measurements of a distinct Ga peak and the graphene valence band during the process of nitridation.

High electron mobility transistors (HEMTs) have long been studied for high frequency and high-power application. Among widely known high electron mobility transistors, AlGaN/GaN HEMTs are having the upper hand due to high electron mobility of the GaN channel. Over the times, issues like current collapse, gate leakage, self-heating and gate lag have questioned the performance and reliability of these devices. In the recent years, engineers have come up with newer architectures to address some of these issues. Inserting a high-k dielectric oxide layer in the gate stack proved to be an effective solution to mitigate gate leakage, reduce interfacial traps and improve optimal working conditions. This work aims to study the reliability aspect of these so-called metal-oxide-semiconductor high electron mobility transistors (MOS-HEMT) specifically, HfO2 and HfZrO2 MOS-HEMTs. It was found through numerical simulations that though HfO2 and HfZrO2 dielectrics were able to mitigate gate leakage current, they tend to accumulate more heat in the channel region with respect to the conventional silicon nitride (SiN) passivated counterparts. Moreover, few asymmetric structures were proposed where silicon nitride was placed in the dielectric layer along with HfO2/HfZrO2. In this study it was found that these asymmetric structures showed superior thermal performance while showing near-zero gate leakage current.

With experimental realization of micro-structures, the feasibility of achieving high brightness, low efficiency droop blue LED was implemented based on InGaN/GaN micro-LED-pillar design. A significantly high current density of 492 A/cm2 in a 20 μm diameter (D) micro-LED-pillar was achieved, compared to that of a 200 μm diameter LED (20 A/cm2), both at 10 V bias voltage. In addition, an increase in sustained quantum efficiency from 70.2% to 83.7% at high injection current density (200 A/cm2) was observed in micro-LED-pillars in conjunction with size reduction from 80 μm to 20 μm. A correlation between the strain relief and the electrical performance improvement was established for micro-LED-pillars with D < 50 μm, apart from current spreading effect. The degree of strain relief and its distribution were further studied in micro-LED-pillars with D ranging from 1 μm to 15 μm. Significant wavenumbers down-shifts for E2 and A1 Raman peaks, together with the blue shifted PL peak emission, were observed in as-prepared pillars, reflecting the degree of strain relief. A sharp transition from strained to relaxed epitaxy region was discernible from the competing E2 phonon peaks at 572 cm-1 and 568 cm-1, which were attributed to strain residue and strain relief, respectively. A uniform strain relief at the center of micro-pillars was achieved, i.e. merging of the competing phonon peaks, after Rapid Thermal Annealing (RTA) at 950℃ for 20 seconds, phenomenon of which was observed for the first time. The transition from maximum strain relief to a uniform strain relief was found along the narrow circumference (< 2.5 μm) of the pillars from the line-map of Raman spectroscopy. The extent of strain relief is also examined considering the height (L) of micro-LED-pillars fabricated using FIB micro-machining technique. The significant strain relief of up to 70% (from -1.4 GPa to -0.37 GPa), with a 71 meV PL peak blue shift, suggested that micro-LED-pillar with D < 3 μm and L > 3 μm in the array configuration would allow the building of practical devices. Overall, this work demonstrated a novel top-down approach to manufacture large effective-area, high brightness emitters for solid-state lighting applications.

Ternary III-nitride alloys have enabled the design of various devices ranging from optoelectronics to power electronics due to their tunable band gap. BxGa1-xN is a wide band gap semiconductor with applications in detecting devices, power electronics and light-emitting diodes. The band gap can be modulated by changing the Boron concentration. It can be grown by metal-organic chemical vapor deposition as a mixed thin film of wurtzite and zincblende structures. In this work, we investigate the structural and electronic properties of BxGa1-xN (x<0.2) by first-principles calculations for both the wurtzite and zincblende phases. The formation energies of Si and Mg impurities and of a Ga vacancy are also calculated. We find that the wurtzite structure is favored over the zincblende structure. Furthermore, the Si and Mg impurities have relatively low formation energies in their neutral state, which indicates compatibility with BxGa1-xN, while a Ga vacancy has very high formation energy, hence being less likely to form spontaneously. Moreover, in the charged states, the formation energy of Mg is reasonably low for most values of the Fermi level, while the formation energy of Si depends linearly on the Fermi level, indicating challenges in achieving n-type conductivity. For a Ga vacancy in a triple acceptor state, the formation energy is reasonably low close to the conduction band, therefore, Ga vacancies interfere with n-type conductivity.

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Advanced power semiconductor devices have consistently proven to be a major force in pushing the progressive development of power conversion technology. The emerging wide-band-gap (WBG) material based power semiconductor devices are considered as gaming changing devices which can exceed the limit of silicon (Si) and be used to pursue groundbreaking high-frequency, high-efficiency, and high-power-density power conversion. The switching performance of cascode GaN HEMT is studied at first. An accurate behavior-level simulation model is developed with comprehensive consideration of the impacts of parasitics. Then based on the simulation model, detailed loss breakdown and loss mechanism analysis are studied. The cascode GaN HEMT has high turn-on loss due to the reverse recovery charge and junction capacitor charge, and the common source inductance (CSI) of the package; while the turn-off loss is extremely small attributing to unique current source turn off mechanism of the cascode structure. With this unique feature, the critical conduction mode (CRM) soft switching technique is applied to reduce the dominant turn on loss and significantly increase converter efficiency. The switching frequency is successfully pushed to 5MHz while maintaining high efficiency and good thermal performance. Traditional packaging method is becoming a bottle neck to fully utilize the advantages of GaN HEMT. So an investigation of the package influence on the cascode GaN HEMT is also conducted. Several critical parasitic inductance are identified, which cause high turn on loss and high parasitic ringing that may lead to device failure. To solve the issue, the stack-die package is proposed to eliminate all critical parasitic inductance, and as a result, reducing turn on loss by half and avoiding potential failure mode of the cascode GaN device effectively. Utilizing soft switching and enhanced packaging, a GaN-based MHz totem-pole PFC rectifier is demonstrated with 99% peak efficiency and 700 W/in3 power density. The switching frequency of the PFC is more than ten times higher than the state-of-the-art industry product while it achieves best possible efficiency and power density. Integrated power module and integrated PCB winding coupled inductor are all studied and applied in this PFC. Furthermore, the technology of soft switching totem-pole PFC is extended to a bidirectional rectifier/inverter design. By using SiC MOSFETs, both operating voltage and power are dramatically increased so that it is successfully applied into a bidirectional on-board charger (OBC) which achieves significantly improved efficiency and power density comparing to the best of industrial practice. In addition, a novel 2-stage system architecture and control strategy are proposed and demonstrated in the OBC system. As a continued extension, the critical mode based soft switching rectifier/inverter technology is applied to three-phase AC/DC converter. The inherent drawback of critical mode due to variable frequency operation is overcome by the proposed new modulation method with the idea of frequency synchronization. It is the first time that a critical mode based modulation is demonstrated in the most conventional three phase H-bridge AC/DC converter, and with 99% plus efficiency at above 300 kHz switching frequency. / Ph. D.