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Single-phase forced convection in a microchannel with carbon nanotubes for electronic cooling applicationsDietz, Carter Reynolds. January 2007 (has links)
Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Dr. David Gerlach, Committee Member ; Dr. Samuel Graham, Committee Member ; Dr. Minami Yoda, Committee Member ; Dr. Yogendra Joshi, Committee Chair.
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Microscale thermal management utilizing vapor extraction from a fractal-like branching heat sink /Apreotesi, Mario A. January 1900 (has links)
Thesis (M.S.)--Oregon State University, 2008. / Printout. Includes bibliographical references (leaves 95-99). Also available on the World Wide Web.
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Powder Recycling for the Production of Pin Fin Heat Sinks by Cold Gas Dynamic SprayPerry, Justin 05 November 2018 (has links)
As a result of the rise in processing power demands of today’s personal computers, water cooled pin fin heat sinks are increasingly being employed for the cooling of graphical processing units. Currently, these high performance devices are manufactured through high-cost, high-waste processes. In recent years, a new solution has emerged using the cold gas dynamic spray process, in which pin fins are directly manufactured onto a baseplate by spraying metallic powder particles through a mask. This process allows for a high degree of adaptability to different graphics processing unit shapes and sizes not achievable by any other process to date. One drawback of this process is that, as substrate sensitivity to heat and mechanical residual stresses requires the use of reduced spray parameters, there is reduced deposition efficiency, resulting in a fair portion of the feedstock powder being wasted. This work aims to demonstrate the feasibility of using powder recycling to mitigate this issue and compares coatings sprayed with reclaimed powder to their counterparts sprayed with as-received powder. The work demonstrates that cold gas dynamic spray is a highly flexible and economically competitive process for the production of pin fin heat sinks when using powder recycling even when spray parameters result in reduced deposition efficiency. The benefits of pin fins on heat transfer properties of flat plates used for graphical processing units is briefly addressed and demonstrated
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A study of micro-scale, fractal-like branching flow networks for reduced pumping power and improved temperature uniformityAlharbi, Ali Y. 29 November 2001 (has links)
A first generation, one-dimensional predictive model is proposed for
designing heat sinks with fractal flow networks. A three-dimensional
computational fluid dynamics (CFD) model is analyzed as a means for validating
the model and identifying areas for improvement.
Two separate CFD models were developed. One was analyzed with
conjugate heat transfer whereas the other was not. For the conjugate heat transfer
model, heat flux was provided at a single surface, simulating a heat source. Energy
addition to the latter model, referred to as the non-conjugate model, was uniform to
all surfaces and was developed to assess the assumptions employed in the one-dimensional
model.
Both CFD models were run with and without variable properties and are
compared to results with a series of parallel channels with identical convective
surface areas. In all cases, with and without conjugate heat transfer and with and
without variable fluid properties, the fractal flow network showed lower maximum
surface temperatures than the straight channel network for identical pumping
powers. The pumping power, however, was determined assuming constant fluid
properties.
The variation in fluid viscosity with temperature was determined to have a
significant impact on the pressure distribution, which indicates that variable fluid
viscosity needs to be included in the one-dimensional model.
Also varied in the analyses were heat sink material, heat flux and flow rate.
Qualitative results show that temperature variations within the copper substrate are
less significant than in the stainless steel substrate. All analyses, including the one-dimensional
model, were restricted to laminar flow conditions. / Graduation date: 2002
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Converging nozzle design for a subsonic wind tunnel to test heat sinks under impinging and parallel airflowsSzleper, Michele Lee 05 1900 (has links)
No description available.
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Considerations on optimum design of micro heat pipe sinks using water as working fluidSimionescu, Florentina, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
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A technique for spatially resolved wall temperature measurements in microchannel heat sinks using infrared thermography /Krebs, Daniel P. January 1900 (has links)
Thesis (M.S.)--Oregon State University, . / Printout. Includes bibliographical references (leaves 99-103). Also available on the World Wide Web.
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1/f noise of GaAs resistors on semi-insulating substrates, and 1/f noise due to temperature fluctuations in heat conduction /Choi, Mun-Seork, January 1900 (has links)
Thesis (Ph. D.)--Oregon State University, 2009. / Printout. Includes bibliographical references (leaves 87-92). Also available on the World Wide Web.
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Modeling convective boiling flow with in-situ local vapor extraction /Salakij, Saran. January 1900 (has links)
Thesis (M.S.)--Oregon State University, 2010. / Printout. Includes bibliographical references (leaves 67-70). Also available on the World Wide Web.
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Hot spot mitigation in microprocessors by application of single phase microchannel heat sink and microprocessor floor planningChauhan, Anjali. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineeering, 2009. / Includes bibliographical references.
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