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To fully exploit the potential of gallium nitride (GaN) devices for optoelectronics and power electronic applications, the structures of device need to be investigated and optimized. In particular carrier densities, conductivities and localised charges can have a significant impact to device performances. Electrical scanning probe microscopy techniques, including scanning capacitance microscopy (SCM), conductive atomic force microscopy (C-AFM) and kelvin probe force microscopy (KPFM), were utilized to study the structures of nitride devices such as high electron mobility transistors (HEMTs), light emitting diodes (LEDs) and junction diodes. These results combine with other characterisation techniques to give an enhanced understanding about the nitride structures. Leakage currents are one of the major challenges in HEMTs, especially leakages in buffer layers which deteriorate the breakdown voltage of the devices. To achieve an insulating buffer layer, carbon doping is usually used to compensate the unintentional n-type doping of nitride materials. Here, I show that vertical leakage can originate from the formation of inverted hexagonal pyramidal defects during the low temperature growth of an AlGaN:C strain relief layer. The semi-polar facets of the defects enhanced the oxygen incorporation and led to the formation of leakage pathways which were observed using SCM. Leakage occurring at HEMT surfaces will lead to current collapses of devices. In this work, I discovered nano-cracks on a HEMT surface. C-AFM showed enhanced conductivity along these nano-cracks. A model based on stress relaxation analysis was proposed to explain the drop of surface potential along the nano-cracks. Advances in the quality of epitaxial GaN grown by MOVPE have been facilitated by understanding the formation of defects within the materials and structures. However, hillocks as a specific type of defects have not been intensively studied yet. In this work, three types of hillocks were discovered on GaN p-i-n diodes and a GaN film grown on patterned sapphire substrates. It was found that pits were always present around the centres of hillocks. Multi-microscopy results showed these pits were developed from either an inversion domain or a nano-pipe or a void under the sample surface. Formation of hillocks was usually associated with a change of growth condition, such as an increase in Mg doping or a decrease in growth temperature and gas flows, despite the formation mechanism is still unclear. GaN$_{1-x}$As$_x$ is a highly mismatched alloy semiconductor whose band-gap can be engineered across the whole visible spectrum. For this reason and the potential to achieve high p-type doping, GaN$_{1-x}$As$_x$ is a promising material for optoelectronic applications. However, the growth of GaN$_{1-x}$As$_{x}$ at intermediate As fraction while maintaining a high conductivity and uniformity of the material is still challenging. Two n-GaN/p-GaN$_{1-x}$As$_x$ diodes with different Ga flows were investigated. Both samples demonstrated that highly Mg-doped GaN$_{1-x}$As$_x$ with high As fraction is achievable. However, the samples contained both amorphous and polycrystalline regions. The electrical scanning probe microscopy results suggested the amorphous structure has a lower hole concentration and hence conductivity than the polycrystalline structure. Nevertheless, there is still a lack of understanding about the electrical properties and conduction mechanisms of the GaN$_{1-x}$As$_x$ alloy.

Yes / This work integrates a harmonic tuning mechanism in synergy with the GaN HEMT transistor for 5G mobile transceiver applications. Following a theoretical study on the operational behavior of the Class-F power amplifier (PA), a complete amplifier design procedure is described that includes the proposed Harmonic Control Circuits for the second and third harmonics and optimum loading conditions for phase shifting of the drain current and voltage waveforms. The performance improvement provided by the Class-F configuration is validated by comparing the experimental and simulated results. The designed 10W Class-F PA prototype provides a measured peak drain efficiency of 64.7% at 1dB compression point of the PA at 3.6GHz frequency.

Le travail de la thèse s’articule sur le développement d’un nouveau type de capteurs de gaz à base des matériaux semi-conducteurs III-Nitrure (Les nitrures de gallium). Ces matériaux présentent de nombreux avantages qui pourraient être utilisées pour concevoir des capteurs NOx sensibles et sélectifs pour le contrôle des pollutions émises par la ligne d’échappement Diesel. Afin de limiter et déduire les gaz polluants émis par les moteurs à explosion en générale et les moteurs Diesel en particuliers (NO, NO2, NH3, CO, …), différentes normes européennes ont été établies. Pour respecter ces normes, plusieurs modifications sur les moteurs et les lignes d’échappement des véhicules ont été effectuées (filtres à particules, catalyseurs, capteurs NOx, …). Les capteurs NOx utilisés actuellement sont à base d’électrolyte solide. Ils sont basés dans leur fonctionnement sur la mesure de la concentration d’oxygène présente dans le gaz d’échappement qui permet de son tour l’estimation de la concentration totale des gaz NOx (mesure indirecte). Ces capteurs ne détectent pas le NH3 à la sortie de la ligne d’échappement, et ne donnent pas une information précise sur le rapport entre NO et NO2 (manque de sélectivité) qui est un facteur important pour le bon fonctionnement de catalyseur sélectif SCR (amélioration de rendement) ; d’où la nécessité d’un capteur de gaz plus performant et en particulier sélectif afin d’améliorer les systèmes de contrôle, de post-traitement et de diagnostic. Notre approche consiste à utiliser un transistor HEMT (High Electron Mobility Transistor) à gaz bidimensionnel d’électrons à base de nitrure de Gallium avec l’association d’une couche fonctionnelle à la place de la grille. L’interaction des molécules de gaz avec cette couche fonctionnelle donne une signature (variation de signal de sortie) spécifique pour chaque type de gaz qui aide à l’amélioration de la sélectivité. Le projet contient deux parties : l’optimisation de la structure choisie et l’optimisation de la couche fonctionnelle afin d’obtenir une détection sélective entre les différents gaz polluants. Cette technologie est intéressante pour développer des capteurs de gaz grâce aux possibilités de détecter des faibles variations de tensions et aux possibilités de fonctionnement dans des environnements sévères. La thèse de doctorat s’inscrit dans le cadre de l’OpenLab materials and processes en collaboration entre le laboratoire Georgia-Tech lorraine et l’entreprise Peugeot-Citroën PSA / The work of the thesis focuses on the development of a new type of gas sensors based III-Nitride semiconductor materials (gallium nitrides). These materials have many advantages that could be used to develop sensitive and selective NOx sensors for the control of pollution emitted by diesel exhaust line. To limit the polluting gases emitted by internal combustion engines in general and diesel in particular (NO, NO2, NH3, CO, ...), different European standards have been established. To meet these standards, anti-pollution systems (consisting of particle filters, catalysts, NOx sensors, ... etc) are used. NOx sensors currently used in automobiles are based on a solid electrolyte. Their operation is based on the measurement of the oxygen concentration. This enables an estimate of the total concentration of NOx gas (indirect measurement) after filtering NOx from O2 and decomposing NOx into O2. These sensors do not detect NH3 at the outlet of the exhaust line, and do not give accurate information on the relationship between NO and NO2 (lack of selectivity) which is important factor for an optimal functioning of selective catalyst (SCR performance improvement). Hence there exists a need for a more efficient and selective in particular gas sensor to improve the control systems, post-treatment and diagnosis. Our approach is to use a HEMT (High Electron Mobility Transistor) transistor based on gallium nitride with a combination of a functional layer instead of the gate. The interaction of the gas molecules with the functional layer gives a signature (output signal variation) specific for each type of gas that helps to improve the selectivity. The project contains two parts: the optimization of the chosen structure and the optimization of the functional layer in order to achieve selective detection between various gaseous pollutants. This technology is interesting for development of gas sensors through the possibility of detection low voltage variations and the possibility of operating in harsh environments. The thesis is part of OpenLab "Materials and Processes" in a collaboration between Georgia Tech-CNRS laboratory and the PSA Peugeot-Citroen Group

The recent application of semiconductor materials, such as GaN, to power electronics has led to the development of a new generation of devices, which promise lower losses, higher operating frequencies and reductions in equipment size. The aim of this research is to study the capabilities of emerging GaN power devices, to understand their advantages, drawbacks, the challenges of their implementation and their potential impact on the performance of power converters. The thesis starts by presenting the development of a simple model for the switching transients of a GaN cascode device under inductive load conditions. The model enables accurate predictions to be made of the switching losses and provides an understanding of the switching process and associated energy flows within the device. The model predictions are validated through experimental measurements. The model reveals the suitability of the cascode device to soft-switching converter topologies. Two GaN cascode transistors are characterised through experimental measurement of their switching parameters (switching speed and switching loss). The study confirms the limited effect of the driver voltage and gate resistance on the turn-off switching process of a cascode device. The performance of the GaN cascode devices is compared against state-of-the-art super junction Si transistors. The results confirm the feasibility of applying the GaN cascode devices in half and full-bridge circuits. Finally, GaN cascode transistors are used to implement a 270V - 28V, 1.5kW, 1 MHz phase-shifted full-bridge isolated converter demonstrating the use of the devices in soft-switching converters. Compared with a 100 kHz silicon counterpart, the magnetic component weight is reduced by 69% whilst achieving a similar efficiency of 91%.

Cette thèse vise à améliorer la méthode d'analyse du fond continu inélastique afin de l'appliquer à des cas qui présentent un intérêt technologique. En effet, ces améliorations sont cruciales car elles portent sur des critères de précision et de gain de temps, plus particulièrement pour l’étude de dispositifs présentant plusieurs couches profondément enterrées de matériaux bien distincts. Ainsi, l'analyse du fond continu inélastique associée à la spectroscopie de photoélectrons à rayons X durs (HAXPES) présente un grand intérêt car l’HAXPES permet de sonder plus profondément dans un échantillon qu'avec la spectroscopie de photoélectrons à rayons X classique (XPS). Ce présent travail porte sur des échantillons technologiquement pertinents, principalement des transistors à haute mobilité d'électrons (HEMTs), à certaines étapes cruciales de leur processus de fabrication, tels que des recuits. Il est donc très important que ces analyses soient effectuées de manière non destructive afin de préserver les interfaces enterrées. Ce sont souvent l'emplacement de phénomènes complexes qui sont critiques pour les performances du dispositif et une meilleure compréhension est une condition préalable à l’amélioration des dispositifs. Dans ce travail, les phénomènes de diffusion en profondeur sont étudiés grâce à l’analyse du fond continu inélastique associée à l’HAXPES (en utilisant le logiciel QUASES) pour des profondeurs allant jusqu'à 60 nm. Les résultats de distribution en profondeur présentent des écarts par rapport aux mesures TEM inférieures à 5%. Le choix des paramètres d'entrée de la méthode est discuté pour une large gamme d'échantillons et des règles simples en sont issues qui rendent l'analyse réelle plus facile et plus rapide à effectuer. Enfin, il a été montré que la spectromicroscopie faite avec la technique HAXPEEM peut fournir des spectres à chaque pixel utilisables pour l’analyse du fond continu inélastique. Cela peut fournir une cartographie 3D de la distribution en profondeur des éléments de manière non-destructive. / This thesis aims at improving the inelastic background analysis method in order to apply it to technologically relevant samples. Actually, these improvements are utterly needed as they concern criteria of accuracy and time saving particularly for analysis of devices presenting deeply buried layers with different materials. For this purpose, the interest of the inelastic background analysis method is at its best when combined with hard X-ray photoelectron spectroscopy (HAXPES) because HAXPES allows to probe deeper in the sample than with conventional X-ray photoelectron spectroscopy (XPS). The present work deals with technologically relevant samples, mainly the high-electron mobility transistor (HEMT), at some crucial steps of their fabrication process as annealing. Actually, it is very important that these analyses shall be performed non-destructively in order to preserve the buried interfaces. These are often the location of complex phenomena that are critical for device performances and a better understanding is often a prerequisite for any improvement. In this thesis, the in-depth diffusion phenomena are studied with the inelastic background analysis technique (using the QUASES software) combined with HAXPES for depth up to 60 nm. The depth distribution results are determined with deviations from TEM measurements smaller than a typical value of 5%. The choice of the input parameters of the method is discussed over a large range of samples and simple rules are derived which make the actual analysis easier and faster to perform. Finally, it was shown that spectromicroscopy obtained with the HAXPEEM technique can provide spectra at each pixel usable for inelastic background analysis. This is a proof of principle that it can provide a 3D mapping of the elemental depth distribution with a nondestructive method. / Denne afhandling har til formål at forbedre den uelastiske baggrundsanalysemetode til anvendelser i den til teknologiske industri. Faktisk er disse forbedringer absolut nødvendige, for at opnå nøjagtighed og tidsbesparelse, især for analyse af prøver med dybt begravede lag af forskellige materialer. Til det formål er interessen for den uelastiske baggrundsanalysemetode bedst i kombination med hård røntgenfotoelektron-spektroskopi (HAXPES), fordi HAXPES gør det muligt at probe dybere i prøven end med konventionel røntgenfotoelektron-spektroskopi (XPS). Dette arbejde beskæftiger sig med teknologisk relevante prøver, hovedsagelig høj-elektron mobilitetstransistor (HEMT), på nogle afgørende trin i deres fremstillingsproces som fx annealing. Faktisk er det meget vigtigt, at disse analyser udføres på en ikke-destruktiv måde for at bevare de begravede grænseflader. Det er ofte her de komplekse fysiske fænomener opstår, som er kritiske for fuktionaliteten, og en bedre forståelse af grænsefladerne er ofte en forudsætning for at kunne forbedre denne. I denne afhandling studeres de dybdegående diffusionsfænomener med den uelastiske baggrundsanalyse teknik (ved hjælp af QUASES software) kombineret med HAXPES for dybder op til 60 nm. Dybdestributionsresultaterne har afvigelser fra TEM-målinger mindre end en typisk værdi på 5%. Valget af input parametre for metoden er diskuteret på bagground af et stort udvalg af prøver samt omfattende simuleringer og enkle regler er udledt, hvilket gør den praktiske analyse nemmere og hurtigere at udføre. Endelig blev det vist, at spektromikroskopi opnået med HAXPEEM-teknikken kan tilvejebringe spektre ved hver enkelt pixel som kan anvendes til uelastisk baggrundsanalyse. Dette viser at i princippet kan en 3D-billeddannelse af den elementære dybdefordeling bestemmes ikke destruktivt.

The ever increasing diversity in communication systems has created a demand for constant improvements in receiver components. This thesis describes the design and characterisation of front-end receiver components for various challenging applications, including characterisation of low noise foundry processes, LNA design and multi-band antenna design. It also includes a new theoretical analysis of noise coupling in low noise phased array receivers.In LNA design much depends on the choice of the optimum active devices. A comprehensive survey of the performance of low noise transistors is therefore extremely beneficial. To this end a comparison of the DC, small-signal and noise behaviours of 10 state-of-the-art GaAs and InP based pHEMT and mHEMT low noise processes has been carried out. Their suitability in LNA designs has been determined, with emphasis on the SKA project. This work is part of the first known detailed investigation of this kind. Results indicate the superiority of mature GaAs-based pHEMT processes, and highlight problems associated with the studied mHEMT processes. Two of the more promising processes have then been used to design C-band and UHF-band MMIC LNAs. A new theoretical analysis of coupled noise between antenna elements of a low noise phased array receiver has been carried out. Results of the noise wave analysis, based on fundamental principles of noisy networks, suggest that the coupled noise contribution to system noise temperatures should be smaller than had previously been suggested for systems like the SKA. The principles are applicable to any phased array receiver. Finally, a multi-band antenna has been designed and fabricated for a severe operating environment, covering the three extremely crowded frequency bands, the 2.1 GHz UMTS, the 2.4 GHz ISM and the 5.8 GHz ISM bands. Measurements have demonstrated excellent performance, exceeding that of equivalent commercial antennas aimed at similar applications.