This work proposes wideband and broadband Planar Ultra-wideband Modular Antenna (PUMA) arrays designed to improve cost and reliability for high production volume commercial and military applications. The designs feature simplified PCB stack-ups with high dielectric constant (Dk) dimensionally stable materials to improve the manufacturing cost and yield. Additionally, the packages use ball grid array (BGA) interconnects, commonly used in digital electronics, for simple solder reflow integration with radio frequency (RF) electronics. While high Dk materials present practical manufacturing benefits, theoretical background will show how and why PUMA arrays lose frequency bandwidth and scan volume with high Dk materials. Further, a band limiting cavity mode will be shown to encroach into the frequency band of high Dk PUMA arrays due to a higher order common mode. PUMA arrays designed on several high Dk materials (Dk = {2.55, 3, 3.7}) will be presented to characterize this reduction in bandwidth. A wideband 7.25-31 GHz (4.3:1) PUMA array-on-package designed on Rogers RO4725JXR (Dk = 2.55) is presented with infinite array simulation results showing good active impedance match, port isolation and cross-polarization performance out to q = 45°. A simplified broadband 15-21 GHz (30%) PUMA array on a thin (λ/11) single layer of Isola FR408HR (Dk = 3.7) is proposed with infinite array results predicting strong active impedance, port isolation and cross-polarization performance with better port isolation and cross-polarization levels than a similar dual-polarized probe fed patch array.