This thesis presents the integration of atomic vapor cells with anti-resonant reflecting optical waveguides (ARROWs) fabricated on silicon chips. These potentially provide a compact platform for a number of optical applications, including the study of quantum coherence effects such as electromagnetically induced transparency and single-photon nonlinearities, as well as frequency stabilization standards. The use of hollow waveguides allows for light propagation in low index (vapor) media with compact mode areas. ARROWs make particularly attractive waveguides for this purpose because they can be interfaced with solid core waveguides, microfabricated on a planar substrate, and are effectively single mode. ARROW fabrication utilizes an acid-removed sacrificial core surrounded by alternating plasma deposited dielectric layers, which act as Fabry-Perot reflectors. To demonstrate the effectiveness of the ARROW as a vapor cell, a platform consisting of solid and hollow core waveguides integrated with rubidium vapor cells was developed. A variety of sealing techniques were tested for vapor cell integration with the ARROW chip and for compatibility with rubidium. Rubidium was used because it is of particular interest for studying quantum coherence effects. Liquefied rubidium was transferred from a bulk supply into an on-chip vapor cell in an anaerobic atmosphere glovebox. Optical absorption measurements confirmed the presence of rubidium vapor within the hollow waveguide platform. Further analysis of the measurements revealed high optical density of rubidium atoms in the hollow core. Saturated absorption spectroscopy measurements verified that the on-chip integrated vapor cell was suitable for common precision spectroscopy applications.

<p>Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.</p><p>Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.</p><p>The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.</p>

Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities. Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated. The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications. / wisenet