The Fully compliant Tensural Bistable Mechanism (FTBM) class is introduced. The class consists of fully compliant linear bistable mechanisms that achieve much of their displacement and bistable behavior through tension loading of compliant segments. Multiple topologies of designs arising from the FTBM class were designed using a finite element analysis (FEA) model with optimization. In a coupled design approach, thermal actuators were optimized to the force and displacement requirements of the bistable mech-anisms, and selected FTBM devices were combined in switching systems with the result-ing Thermomechanical In-plane Microactuators (TIMs) and Amplified Thermomechanical In-plane Microactuators (ATIMs). Successful on-chip actuation was demonstrated. The bistable mechanisms and actuators in this work were fabricated in the MUMPs and SUMMiT V surface micromachining MEMS fabrication technologies. The Stacked Amplified Thermomechanical In-plane Microactuator (StATIM) is also introduced. The StATIM is a compact linear output actuator based on the ATIM that is capable of large displacements relative to the size of the actuator. The StATIMs presented in this thesis were fabricated in the SUMMiT V technology.