RF/microwave tunable filters are widely employed in radar systems, measurement instruments, and communication systems. By using tunable filters, the frequency bandwidth is utilized effectively and the system cost and complexity is reduced. In the literature, various tuning techniques have been developed to construct tunable filters. Mechanical tuning, magnetic tuning, and electrical tuning are the most common. In terms of quality factor, power handling capability, and linearity, mechanical tuning is superior to the other two tuning techniques. Unfortunately, due to their bulky size, heavy weight, and low tuning speed, mechanically tunable filters have limited applications. MicroElectroMechanical Systems (MEMS) technology has the potential to produce highly miniaturized tunable filters; however, most of the MEMS tunable filters reported so far have a relatively low quality factor. The objective of the research described in this thesis is to investigate the feasibility of using MEMS technology to develop tunable filters with a high quality factor. The integration of MEMS tuning elements with a wide range of filter configurations is explored, from micromachined filters to traditional dielectric resonator filters, from planar filters to cavity filters. Both hybrid integration and monolithic integration approaches are carried out. To achieve tunability, MEMS tuning elements are embedded within RF and microwave filters. Tuning is accomplished by disturbing the electromagnetic fields of resonators with nearby MEMS tuning elements, which in turn change the resonant frequency of the resonators. First, the proposed tuning concept is experimentally demonstrated by integrating a surface micromachined planar filter with MEMS thermal actuators as the tuning elements. Then, a novel micromachined ridge waveguide filter embedded with similar MEMS tuning elements is proposed and constructed by using the EFAB^{TM} micromachining technique. A power handling analysis is performed for the newly devised 3D micromachined filter, and potential failure mechanisms such as air breakdown are identified. For the first time, a tunable dielectric resonator bandpass filter, incorporating vertical long-throw MEMS thermal actuators as tuning elements, is developed to achieve a wide tuning range, high quality factor, and large power handling capability. Several prototype tunable filter units are fabricated and tested. The experimental results reveal that the tunable filters maintain a relatively high quality factor value over a wide tuning range. In addition to the hybrid integration approach, a monolithic integration approach is investigated. A novel surface micromachining process is developed to allow monolithic integration of MEMS tuning elements into micromachined filters. Due to a stress mismatch, MEMS actuators fabricated by this process obtain a vertical deflection of several hundred microns, resulting in a wide tuning range. Various latching mechanisms are created, based on the micromachining processes that are used to fabricate the MEMS tuning elements. These out-of-plane latching mechanisms with multi-stable states have the potential to be adopted not only for tunable filter applications but also for switches and phase shifters.

RF/microwave tunable filters are widely employed in radar systems, measurement instruments, and communication systems. By using tunable filters, the frequency bandwidth is utilized effectively and the system cost and complexity is reduced. In the literature, various tuning techniques have been developed to construct tunable filters. Mechanical tuning, magnetic tuning, and electrical tuning are the most common. In terms of quality factor, power handling capability, and linearity, mechanical tuning is superior to the other two tuning techniques. Unfortunately, due to their bulky size, heavy weight, and low tuning speed, mechanically tunable filters have limited applications. MicroElectroMechanical Systems (MEMS) technology has the potential to produce highly miniaturized tunable filters; however, most of the MEMS tunable filters reported so far have a relatively low quality factor. The objective of the research described in this thesis is to investigate the feasibility of using MEMS technology to develop tunable filters with a high quality factor. The integration of MEMS tuning elements with a wide range of filter configurations is explored, from micromachined filters to traditional dielectric resonator filters, from planar filters to cavity filters. Both hybrid integration and monolithic integration approaches are carried out. To achieve tunability, MEMS tuning elements are embedded within RF and microwave filters. Tuning is accomplished by disturbing the electromagnetic fields of resonators with nearby MEMS tuning elements, which in turn change the resonant frequency of the resonators. First, the proposed tuning concept is experimentally demonstrated by integrating a surface micromachined planar filter with MEMS thermal actuators as the tuning elements. Then, a novel micromachined ridge waveguide filter embedded with similar MEMS tuning elements is proposed and constructed by using the EFAB^{TM} micromachining technique. A power handling analysis is performed for the newly devised 3D micromachined filter, and potential failure mechanisms such as air breakdown are identified. For the first time, a tunable dielectric resonator bandpass filter, incorporating vertical long-throw MEMS thermal actuators as tuning elements, is developed to achieve a wide tuning range, high quality factor, and large power handling capability. Several prototype tunable filter units are fabricated and tested. The experimental results reveal that the tunable filters maintain a relatively high quality factor value over a wide tuning range. In addition to the hybrid integration approach, a monolithic integration approach is investigated. A novel surface micromachining process is developed to allow monolithic integration of MEMS tuning elements into micromachined filters. Due to a stress mismatch, MEMS actuators fabricated by this process obtain a vertical deflection of several hundred microns, resulting in a wide tuning range. Various latching mechanisms are created, based on the micromachining processes that are used to fabricate the MEMS tuning elements. These out-of-plane latching mechanisms with multi-stable states have the potential to be adopted not only for tunable filter applications but also for switches and phase shifters.

The Fully compliant Tensural Bistable Mechanism (FTBM) class is introduced. The class consists of fully compliant linear bistable mechanisms that achieve much of their displacement and bistable behavior through tension loading of compliant segments. Multiple topologies of designs arising from the FTBM class were designed using a finite element analysis (FEA) model with optimization. In a coupled design approach, thermal actuators were optimized to the force and displacement requirements of the bistable mech-anisms, and selected FTBM devices were combined in switching systems with the result-ing Thermomechanical In-plane Microactuators (TIMs) and Amplified Thermomechanical In-plane Microactuators (ATIMs). Successful on-chip actuation was demonstrated. The bistable mechanisms and actuators in this work were fabricated in the MUMPs and SUMMiT V surface micromachining MEMS fabrication technologies. The Stacked Amplified Thermomechanical In-plane Microactuator (StATIM) is also introduced. The StATIM is a compact linear output actuator based on the ATIM that is capable of large displacements relative to the size of the actuator. The StATIMs presented in this thesis were fabricated in the SUMMiT V technology.

Feedback control of MEMS devices has the potential to significantly improve device performance and reliability. One of the main obstacles to its broader use is the small number of on-chip sensing options available to MEMS designers. A method of using integrated piezoresistive sensing is proposed and demonstrated as another option. Integrated piezoresistive sensing utilizes the inherent piezoresistive property of polycrystalline silicon from which many MEMS devices are fabricated. As compliant MEMS structures flex to perform their functions, their resistance changes. That resistance change can be used to transduce the structures' deflection into an electrical signal. This dissertation addresses three topics associated with integrated piezoresistive sensing: developing an empirical model describing the piezoresistive response of polycrystalline-silicon flexures, designing compliant MEMS with integrated piezoresistive sensing using the model, and implementing feedback control using integrated piezoresistive sensing. Integrated piezoresistive sensing is an effective way to produce small, reliable, accurate, and economical on-chip sensors to monitor compliant MEMS devices. A piezoresistive flexure model is presented that accurately models the piezoresistive response of long, thin flexures even under complex loading conditions. The model facilitates the design of compliant piezoresistive MEMS devices, which output an electrical signal that directly relates to the device's motion. The piezoresistive flexure model is used to design a self-sensing long displacement MEMS device. Motion is achieved through contact-aided compliant rolling elements that connect the output shaft to kinematic ground. Self-sensing is achieved though integrated piezoresistive sensing. An example device is tested that demonstrates 700 micrometers of displacement with a sensing resolution of 2 micrometers. The piezoresistive microdisplacement transducer (PMT) is a structure that uses integrated piezoresistive sensing to monitor the output displacement of a thermomechanical inplane microacutator (TIM). Using the PMT as a feedback sensor for closed-loop control of the TIM reduced the system's response time from 500~$mu$s to 190~$mu$s, while maintaining a positioning accuracy of $pm$29~nm. Feedback control of the TIM also increased its robustness and reliability by allowing the system to maintain its performance after it had been significantly damaged.

Nanopositioners have been developed with electrostatic, piezoelectric, magnetic, thermal, and electrochemical actuators. They move with as many as six degrees of freedom; some are composed of multiple stages that stack together. Both macro-scale and micro-scale nanopositioners have been fabricated. A summary of recent research in micropositioning and nanopositioning is presented to set the background for this work. This research project demonstrates that a dual-stage nanopositioner can be created with microelectromechanical systems technology such that the two stages are integrated on a single silicon chip. A nanopositioner is presented that has two stages, one for coarse motion and one for fine motion; both are fabricated by surface micromachining. The nanopositioner has one translational degree of freedom. Thermal microactuators operate both stages. The first stage includes a bistable mechanism: it travels 52 micrometers between two discrete positions. The second stage is mounted on the first stage and moves continuously through an additional 8 micrometers in the same direction as the first stage. Two approaches to the control of the second stage are evaluated: first, an electrical input is transmitted to an actuator that moves with the first stage; second, a mechanical input is applied to an amplifier mechanism mounted on the first stage after completing the coarse motion. Four devices were designed and fabricated to test these approaches; the one that performed best was selected to fulfill the objective of this work. Thermal analysis of the actuators was performed with previously developed tools. Pseudo-rigid-body models and finite element models were created to analyze the mechanical behavior of the devices. The nanopositioners were surface micromachined in a two-layer polysilicon process. Experiments were performed to characterize the resolution, repeatability, hysteresis, and drift of the second stages of the nanopositioners with open-loop control. Position measurements were obtained from scanning electron micrographs by a numerical procedure, which is described in detail. The selected nanopositioner demonstrated 170-nanometer resolution and repeatability within 37 nanometers. The hysteresis of the second stage was 6% of its full range. The nanopositioner drifted 25 nanometers in the first 60 minutes of operation with a time constant of about 6 minutes. The dual-stage nanopositioner may be useful for applications such as variable optical attenuators or wavelength-specific add--drop devices.