- About
-
The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 81 to 90 of 232 (0.072 seconds)Spelling suggestions: "subject:"microelectronics""
| 81 |
System-in-package a system level investigation for package reliability /Saiyed, Mohammed Shafi. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of System Science and Industrial Engineering, 2005. / Includes bibliographical references.
|
| 82 |
An investigation into the effect of the PCB motion on the dynamic response of MEMS devices under mechanical shock loadsAlsaleem, Fadi M. January 2007 (has links)
Thesis (M.S.M.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2007. / Includes bibliographical references.
|
| 83 |
Die stress analysis in plastic encapsulated electronic packages an experimental and numerical approach /Chaparala, Satish Chandra. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 121-136).
|
| 84 |
Packaging of silicon carbide high temperature, high power devices processes and materials /Liu, Yi, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).
|
| 85 |
Design and simulation of a multichip module /Nazareth, Mathew B. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 103-104).
|
| 86 |
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applicationsJha, Gopal Chandra. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Rao R. Tummala; Committee Member: C. P. Wong; Committee Member: P. M. Raj.
|
| 87 |
Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approachMehrotra, Gaurav. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.
|
| 88 |
Drop impact reliability testing lead-free chip scale packages : a thesis /Farris, Andrew. Liddicoat, Albert A. January 2008 (has links)
Thesis (M.S.)--California Polytechnic State University, 2008. / Major professor: Albert Liddicoat, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Electrical Engineering." "June 2008." Includes bibliographical references (leaves 70-73). Also available online. Also available on microfiche (2 sheets).
|
| 89 |
High power flip-chip light emitting diode /Lai, Yin Hing. January 2004 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 60-68). Also available in electronic version. Access restricted to campus users.
|
| 90 |
Design, synthesis, and characterization of novel, low dielectric, photodefinable polymersRomeo, Michael Joseph. January 2008 (has links)
Thesis (Ph.D.)--Chemical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Henderson, Cliff; Committee Member: Beckham, Haskell; Committee Member: Hess, Dennis; Committee Member: Koros, William; Committee Member: Tolbert, Laren.
|
Page generated in 0.0788 seconds