NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 41 to 50 of 232 (0.044 seconds)

Spelling suggestions: "subject:"microelectronics""

41

A modular, direct chip attach, wafer level MEMS package : architecture and processing

Neysmith, Jordan M. 12 1900 (has links)
No description available.
Microelectronic packaging
42

Study of warpage of base substrates and materials for large-area MCM-D packaging

Dang, Anh Xuan-Hung 12 1900 (has links)
No description available.
Multichip modules (Microelectronics)
Microelectronic packaging Materials
43

Physics-based modeling methodology for reliability of microvias

Ramakrishna, Gnyaneshwar 08 1900 (has links)
No description available.
Microelectronic packaging Materials
44

Development and integration of thin film polymer ceramic nanocomposite capacitor dielectrics in SOP

Windlass, Hitesh 12 1900 (has links)
No description available.
Microelectronic packaging
Nanostructure materials
Nanotechnology
Composite materials
45

Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packages

Campbell, James Stephen, Jr. 05 1900 (has links)
No description available.
Microelectronic packaging Testing
Microelectronics
Thermal stresses
46

Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Baynham, Grant Andrew 05 1900 (has links)
No description available.
Microelectronic packaging Materials
Solder and soldering
Green technology
47

Processing and characterization of polymer-ceramic composite thin film dielectrics for embedded decoupling applications

Mani, Rajesh 12 1900 (has links)
No description available.
Microelectronic packaging
Composite materials
Thin films
Capacitors
48

Thermal management of small scale electronic systems

Desai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
49

Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /

Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
50

Capacity requirements planning of multichip modules through simulation

Dasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

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