- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 1 to 10 of 140 (0.064 seconds)Spelling suggestions: "subject:"microelectronics packaging.""
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Evaluation and process development of wafer-level-applied underfill material systems for flip chip assemblyBusch, Stephen Christopher 05 1900 (has links)
No description available.
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| 2 |
A thermal analysis tool for three-dimensional models of multilayer microelectronics /Creel, Kenneth E., January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaf 128). Also available via the Internet.
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| 3 |
Materials study for interfacial adhesion and reliability of microelectronics packaging structures /Dai, Xiang, January 1998 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1998. / Vita. Includes bibliographical references (leaves 154-163). Available also in a digital version from Dissertation Abstracts.
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| 4 |
Thermo-mechanical behavior of tin-lead and lead-free ceramic column grid array packagesJoshi, Rahul V. January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Mechanical Engineering Dept., 2005. / Includes bibliographical references.
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| 5 |
Hybrid spectral/intelligent modeling, control and diagnosis for nonlinear distributed curing processes /Deng, Hua. January 2005 (has links) (PDF)
Thesis (Ph. D.)--City University of Hong Kong, 2005. / "Submitted to Department of Manufacturing Engineering and Engineering Management in partial fulfillment of the requirements for the degree of Doctor of Philosophy." Includes bibliographical references (leaves 169-181).
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| 6 |
Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled packagePaydenkar, Chetan S. 05 1900 (has links)
No description available.
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| 7 |
Cure behavior of epoxy polymers used in microelectronics /Taweeplengsangsuke, Jantrawan, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).
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| 8 |
Palletization and design-of-simulations for large area processing and assembly in electronic packagingVariyam, Manjula N. 08 1900 (has links)
No description available.
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| 9 |
High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packagingOk, Seong Joon 12 1900 (has links)
No description available.
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| 10 |
Development and integration of thin film zinc oxide integral resistors in SOPMorales, Hector Roberto 05 1900 (has links)
No description available.
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