Spelling suggestions: "subject:"microelectronics packaging.""
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Physics-based modeling methodology for reliability of microviasRamakrishna, Gnyaneshwar 08 1900 (has links)
No description available.
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Development and integration of thin film polymer ceramic nanocomposite capacitor dielectrics in SOPWindlass, Hitesh 12 1900 (has links)
No description available.
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Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packagesCampbell, James Stephen, Jr. 05 1900 (has links)
No description available.
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Flip chip processing of lead-free solders and halogen-free high density microvia substratesBaynham, Grant Andrew 05 1900 (has links)
No description available.
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Processing and characterization of polymer-ceramic composite thin film dielectrics for embedded decoupling applicationsMani, Rajesh 12 1900 (has links)
No description available.
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Thermal management of small scale electronic systemsDesai, Anand Hasmukh. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).
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Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
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Capacity requirements planning of multichip modules through simulationDasalla, Kathryn Anne. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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Computational and experimental investigations of laser drilling and welding for microelectronic packagingHan, Wei. January 2004 (has links)
Thesis (Ph. D.)--Worcester Polytechnic Institute. / Keywords: Optoelectronic holography; Microwelding; Microelectronic packaging; Microdrilling; Laser micromachining; Computational modeling. Includes bibliographical references (p. 204-212).
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Study and characterization of plastic encapsulated packages for MEMSDeshpande, Anjali W. January 2005 (has links)
Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: finite difference methods; OEH methodology; packaging; plastic encapsulation; Fick's second law of diffusion; MEMS. Includes bibliographical references (p. 144-161).
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