Spelling suggestions: "subject:"microelectronics packaging.""
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Packaging of silicon carbide high temperature, high power devices processes and materials /Liu, Yi, Johnson, R. Wayne, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).
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Design and simulation of a multichip module /Nazareth, Mathew B. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 103-104).
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Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applicationsJha, Gopal Chandra. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Rao R. Tummala; Committee Member: C. P. Wong; Committee Member: P. M. Raj.
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Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approachMehrotra, Gaurav. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.
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Drop impact reliability testing lead-free chip scale packages : a thesis /Farris, Andrew. Liddicoat, Albert A. January 2008 (has links)
Thesis (M.S.)--California Polytechnic State University, 2008. / Major professor: Albert Liddicoat, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Electrical Engineering." "June 2008." Includes bibliographical references (leaves 70-73). Also available online. Also available on microfiche (2 sheets).
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High power flip-chip light emitting diode /Lai, Yin Hing. January 2004 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 60-68). Also available in electronic version. Access restricted to campus users.
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Design, synthesis, and characterization of novel, low dielectric, photodefinable polymersRomeo, Michael Joseph. January 2008 (has links)
Thesis (Ph.D.)--Chemical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Henderson, Cliff; Committee Member: Beckham, Haskell; Committee Member: Hess, Dennis; Committee Member: Koros, William; Committee Member: Tolbert, Laren.
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Design-for-manufacturability (DFM) for system-in-package (SiP) applicationsDoppalapudi, Ranjeeth. January 2008 (has links)
Thesis (M. S.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Dr. Swaminathan, Madhavan; Committee Member: Dr. Chatterjee, Abhijit; Committee Member: Dr. Lim, Sungkyu. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /Koeneman, Paul Bryant, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.
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Design and optimization of VCSEL-based optical interconnects on packageTerranova, Brandon. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Physics, Applied Physics and Astronomy, 2009. / Includes bibliographical references.
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