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The increasing structural functionalities of materials in microelectronics and MEMs packages has led to an explosion of interest in characterizing the mechanical properties of small volumes of materials in the micrometer to nanometer regime. In microelectronics packages, one of the main challenges in reliability assessment is the prediction of solder joint failure during service applications. To a large extent, this is hindered by the difficulty in measuring the properties of micro-scale solder balls, which can be quite different from those of bulk solders. Recently, there has been substantial interest in miniaturized impression testing for measuring creep and other mechanical properties of microelectronic solder joints. Since impression testing produces punch stress versus impression strain data, it is necessary to find the appropriate correlations to convert the properties obtained by impression stress-strain testing to equivalent uniaxial properties. Therefore, in this work, finite element modeling using ANSYSTM is employed to obtain the elastic, plastic and creep properties of these Sn-Ag solder joints from impression testing, which uses a flat-tip cylindrical indenter, so that correlations may be drawn with corresponding properties from uniaxial testing.

Since the late 1970s, families of microelectronic technologies that could bring the advantages of high levels of electronic integration have been available at reasonable prices and manageable risk to all sectors of UK industry. However, the uptake of these technologies has been painfully slow, particularly by the small and medium enterprises (SMEs) that make up most of the companies currently operating in the UK. It is the aim of the research described here to assess how slow the uptake has been, the reasons for it, and possible solutions to the problem. The problem is investigated with reference to SMEs. In order to reach conclusions it has been necessary to:- • Define Application Specific Integrated Circuit (ASIC) technology and review its history • Review that nature of the UK SME base and identify why they should use ASICs • Review the UK, European and World ASIC markets • Analyse the nature of the UK ASIC design and supply industry • Ascertain the reasons for non-adoption and assess their validity • Relate the findings of this research to appropriate business, organisational and system models • Review past and existing technology-transfer programmes operating in the area of ASIC adoption at a UK, European and world level • Compare the adoption of ASIC technology with the adoption of similar, wide-ranging, new technologies The study concludes that the technology is unique in the wide range of industries to which it can be applied, and that although some advances in adoption have been made, there remains a significant number of hurdles to adoption which can best be addressed by government intervention and supporting activity from supply-companies, trade associations, user-groups and professional and educational institutions. Only once adoption has reached a 'critical mass' can it be assumed that a self-sustaining market will result.

Digitized by Kansas Correctional Industries

Typescript. / Digitized by Kansas Correctional Industries

Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.

Thesis (Ph. D.)--Florida State University, 2002. / Advisor: Dr. David Lind, Florida State University, College of Arts and Sciences, Dept. of Physics. Title and description from dissertation home page (viewed Sept. 29, 2003). Includes bibliographical references.

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

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