Millimeter wave (mm-Wave) has become increasingly popular frequency band for next-generation high-speed wireless communications. In mm-Wave, the wireless channel path loss is severe, demanding a high output power in transmitters (Tx) to meet a required SNR in receivers (Rx). Due to the intractable speed-power tradeoff ingrained in silicon processes, however, achieving a high power at mm-Wave, particularly over W-band (> 90 GHz), is challenging in silicon power amplifiers. To relieve the output power burden, phased-arrays are widely adopted in mm-Wave wireless communication systems -- namely, by leveraging a parallel power combining in the space domain, inherent in the phased arrays, the required output power per array element can be reduced significantly with increasing array size. In large arrays ( > 100's -- 1000's number of arrays), the required output power per element could be small, typically around several 10's mW or less in silicon-based phased arrays. In such small-to-medium scale output power level, the static power dissipations by transistor knee voltage and passive components could be a significant portion of the output power, decreasing power efficiency of power amplifiers drastically. This poses a significant concern on the power efficiency of the large-scale silicon-based phased arrays in mm-Wave. Another critical problem in mm-Wave wireless systems design is the increase of passive reactive components loss caused by worsening skin depth effect and increasing dielectric loss through silicon substrate. This essentially degrades the reactive components quality factor (Q) and limits frequency selectivity of the silicon-based mm-Wave systems. This thesis tackles these two major technical challenges to provide high frequency selectivity with maintaining high power efficiency for future mm-Wave wireless systems over W-band and beyond. First, various high-efficiency techniques such as impedance tuning with a reactive component at a cascoding stage in conventional stacked power amplifiers or load-pull based inter-stage matching technique, rather than conventional conjugate matching, have been applied to W-band CMOS and SiGe BiCMOS amplifiers to improve power efficiency with 5-10 dBm output power level, suitable for a large phased array applications, as detailed in Chapter 2 and 3. Second, a 4-tap finite impulse response (FIR) filter based receiver architecture is presented in Chapter 4. The FIR filtered receiver leverages a sinc-pulse type frequency nulls built-in in the transmission-line based FIR filter's frequency response to increase frequency selectivity. The proposed FIR filtered receiver achieves > 40-dB image rejection by placing an image signal at the null frequency at D-band, one of the largest image rejection performance at the highest frequency band reported so far. / Ph. D. / Due to recent advances in Silicon based solid-state technologies, the interest towards the millimeter wave (mm-Wave) frequency band has been emerging for next-generation high-speed wireless communication applications. One of the most significant parameters in a communication system would be the output power of a transmitter. However, the output power is limited especially at mm-wave frequencies. A phased array is one of the viable solutions to overcome this burden by utilizing a parallel power combing in the space domain. The required output power per element can be relieved, typically around several tens of mill watts or less. There are two major factors limiting the output power, which are the high loss of passive and active devices. This dissertation presents solutions to overcome these challenges. In addition, a 4-tap finite impulse response (FIR) filter based receiver architecture is introduced, which rejects unwanted image signals in heterodyne systems by utilizing sinc-pulse type frequency nulls. The proposed FIR filter achieves more than 40 dB of image rejection at D-band (110-170 GHz), which is one of the highest filtering performance in the millimeter-wave frequency band.