For the last four decades, the semiconductor industry has experienced an exponential growth. According to the ITRS, as we advance into the era of nanotechnology, the traditional CMOS electronics is reaching its physical and economical limits. The main objective of this thesis is to explore novel design opportunities for reconfigurable architectures given by the emerging technologies. On the one hand, the thesis will focus on the traditional FPGA architecture scheme, and survey some structural improvements brought by disruptive technologies. While the memories and routing structures occupy the major part of the FPGAs total area and mainly limit the performances, 3-D integration appears as a good candidate to embed all this circuitry into the metal layers. Configuration and routing circuits based on back-end compatible resistive memories, a monolithic 3-D process flow and a prospective vertical FETs process flow are introduced and assessed within a complete architectural context. On the other hand, the thesis will present some novel architectural schemes for ultra-fine grain computing. The size of the logic elements can be reduced thanks to inherent properties of the technologies, such as the crossbar organization or the controllable polarity of carbon electronics. Considering the granularity of the logic elements, specific fixed and incomplete interconnection topologies are required to prevent the large overhead of a configurable interconnection pattern. To evaluate the potentiality of this new architectural scheme, a specific benchmarking flow will be presented in order to explore the ultra-fine grain architectural design space.

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Durant les quatre dernières décennies, l’industrie des semi-conducteurs a connu une croissance exponentielle. En accord avec l’ITRS et à mesure de l'approche vers le nanomètre, les promesses sont énormes et les composants sont réduits à leurs limites physiques et économiques ultimes. L’objectif principal de cette thèse est d’explorer les opportunités offertes par les technologies émergentes pour la conception d’architectures reconfigurables. Tout d’abord, la thèse se centre sur l’architecture FPGA traditionnelle et étudie des améliorations structurelles apportées par des technologies en ruptures. Tandis que les structures de configuration et de routage occupent la majeure partie de la surface d’un FPGA et limitent ces performances, l’intégration 3-D apparait comme une bonne opportunité pour déplacer ces circuits dans les niveaux métalliques. Des circuits de configuration et de routage utilisant des mémoires résistives compatibles back-end, un procédé d’intégration 3-D ou encore un procédé de réalisation de transistors verticaux seront introduits et évalués dans un contexte architectural complet. Par la suite, la thèse présente de nouvelles propositions architecturales pour la logique à grain ultra-fin. La taille des éléments logiques peut être réduite grâce aux propriétés inhérentes de certaines technologies, telles que l’arrangement en structures entrecroisées de nanofils ou la polarité contrôlable des transistors carbones. Considérant le changement de granularité des opérateurs logiques, des topologies d’interconnexions fixes sont nécessaires afin d’éviter l’important surcoût dû à l’interconnexion programmable. Afin d’étudier les possibilités de cette organisation, un flot d’évaluation est présenté et utilisé pour explorer l’espace de conception relatif aux architectures à grain ultra-fin. / For the last four decades, the semiconductor industry has experienced an exponential growth. According to the ITRS, as we advance into the era of nanotechnology, the traditional CMOS electronics is reaching its physical and economical limits. The main objective of this thesis is to explore novel design opportunities for reconfigurable architectures given by the emerging technologies. On the one hand, the thesis will focus on the traditional FPGA architecture scheme, and survey some structural improvements brought by disruptive technologies. While the memories and routing structures occupy the major part of the FPGAs total area and mainly limit the performances, 3-D integration appears as a good candidate to embed all this circuitry into the metal layers. Configuration and routing circuits based on back-end compatible resistive memories, a monolithic 3-D process flow and a prospective vertical FETs process flow are introduced and assessed within a complete architectural context. On the other hand, the thesis will present some novel architectural schemes for ultra-fine grain computing. The size of the logic elements can be reduced thanks to inherent properties of the technologies, such as the crossbar organization or the controllable polarity of carbon electronics. Considering the granularity of the logic elements, specific fixed and incomplete interconnection topologies are required to prevent the large overhead of a configurable interconnection pattern. To evaluate the potentiality of this new architectural scheme, a specific benchmarking flow will be presented in order to explore the ultra-fine grain architectural design space.