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The commercial need to capture, process and represent the shape and form of an outline has lead to the development of a number of spline routines. These use a mathematical curve format that approximates the contours of a given shape. The modelled outline lends itself to be used on, and for, a variety of purposes. These include graphic screens, laser printers and numerically controlled machines. The latter can be employed for cutting foil, metal. plastic and stone. One of the most widely used software design packages has been the lKARUS system. This, developed by URW of Hamburg (Gennany), employs a number of mathematical descriptions that facilitate the process of both modelling and representation of font characters. It uses a variety of curve formats, including Bezier cubics, general conics and parabolics. The work reported in this dissertation focuses on developing improved techniques, primarily. for the lKARUS system. This includes two algorithms which allow a Bezier cubic description, two for a general conic representation and, yet another, two for the parabolic case. In addition, a number of algorithms are presented which promote conversions between these mathematical forms; for example, Bezier cubics to a general conic form. Furthennore, algorithms are developed to assist the process of rasterising both cubic and quadratic arcs.

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This thesis is focused on the e-commerce in tourism, current trends associated with the development of technologies used in e-commerce in tourism and the application of new technologies in online selling of packages holiday. The first chapter is focused on e-commerce in tourism in general. The second chapter is focused on 6 most used B2B and B2C systems for travel agencies and on their comparison. The third chapter is focused on the phenomenon of german packages being sold by czech travel agencies in Czech republic.

The demand for high performance microelectronic products drives the development of 3-D chip-stacking structure. By the introduction of through-silicon-via (TSV) into 3-D flip-chip packages, microelectronic performance is improved by increasing circuit capacity and diminishing signal delay. However, TSV-embedded structure also raises concerns over many reliability issues that come with the steep thermal and mechanical transient responses, increasing numbers of bi-material interfaces and reduced component sizes. In this research, defect initiation induced by thermalmechanical phenomena is studied to establish the early failure modes within 3-D flip-chip packages. It is found that low amplitude but extremely high frequency thermal stress waves would occur and attenuate rapidly in the first hundreds of nanoseconds upon power-on. Although the amplitude of these waves is far below material yielding points, their intrinsic characteristics of high frequency and high power density are capable of compromising the integrity of all flip-chip components. By conducting spectral analysis of the stress waves and applying the methodology of accumulated damage evaluation, it is demonstrated that micron crack initiation and interconnect debond are highly probable in the immediate proximity of the heat source. Such a negative impact exerted by the stress wave in the early, while brief, transient period is recognized as the short time scale dynamic effect. Researched results strongly indicate that short-time scale effects would inflict very serious reliability issues in 3-D flip-chip packages. The fact that 3-D flip-chip packages accommodate a large amount of reduced-size interconnects makes it vulnerable to the attack of short time scale propagating stress waves. In addition, the stacking structure also renders shearing effect extremely detrimental to 3-D flip-chip integrity. Finally, several guidelines effective in discouraging short-time scale effects and thus improving TSV flip-chip package reliability are proposed