In the last decades, additive manufacturing (AM), also called three-dimensional (3D) printing, has advanced micro/nano-fabrication technologies, especially in applications like lightweight engineering, optics, energy, and biomedicine. Among these 3D printing technologies, two-photon polymerization (TPP) offers the highest resolution (even at the nanometric scale), reproducibility and the possibility to create monolithically 3D complex structures with a variety of materials (e.g. organic and inorganic, passive and active). Such active materials change their shape upon an applied stimulus or degrade over time at certain conditions making them dynamic and reconfigurable (also called 4D printing). This is particularly interesting in the field of medical microrobotics as complex functions such as gentle interactions with biological samples, adaptability when moving in small capillaries, controlled cargo-release profiles, and protection of the encapsulated cargoes, are required. Here we review the physics, chemistry and engineering principles of TPP, with some innovations that include the use of micromolding and microfluidics, and explain how this fabrication schemes provide the microrobots with additional features and application opportunities. The possibility to create microrobots using smart materials, nano- and biomaterials, for in situ chemical reactions, biofunctionalization, or imaging is also put into perspective. We categorize the microrobots based on their motility mechanisms, function, and architecture, and finally discuss the future directions of this field of research.

The growing demand for the Internet of Things (IoT) and Artificial Intelligence (AI) need high-speed commu-nication within short-range distances. In the Back-End-Of-Line (BEOL), Single-Mode Waveguide (SMW) with micro-mirror shows the promising application as an Optical Redistribution Layer (O-RDL) connecting photonic-chip at the interposer-level. The presented study shows the potential application of the 2-Photon-Polymerization (2PP) process for fabrication of out-of-plane coupling elements (micro-mirror) for SMW using low-loss Ormocer® hybrid polymers. This fabricated micro-mirror uses as a coupling element to connect the light from RDL to chips or for inter-layer connections at Interposer level. To evaluate the processing time, structural quality, and resolution of the printed micro-mirror, two types of lenses (63x and 25x) and Ormocer® polymers (OrmoComp and OrmoCore) were used. The optimization of the process flow for the micro-mirrors for SMW applications will be described in detail.

This paper describes technology and process development for a hybrid lithography approach pairing UV-lithography for planar single mode waveguides with 2-photon-polymerization direct-laser-writing for out-of-plane coupling mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. Minimum alignment accuracy at ≈ 3 μm is observed. Cut-back measurement on single mode waveguides shows attenuation of 0.64 dB cm −1 and 1.5 dB cm −1 at 1310 nm and 1550 nm respectively. Up to 2.5-times increase of shear-strength after thermal exposure up to 300 ◦ C is found using shear tests and compared for various surface treatments. Mechanical compatibility to reflow soldering is derived. An extensive study on the pattering of ORMOCER® using 2-photon-polymerization is performed. Flat 45 ◦ -micro mirrors with sub-10 μm dimensions are 3D-printed both in OrmoCore and OrmoComp. Outlook to further research on hybrid lithography integration approach is given.

This paper describes design and advances in process development for UV-lithography of planar single mode waveguides with openings for out-of-plane coupling µ-mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. However, non uniformity across 4” wafer is shown due to varying proximity and UV-intensity. Openings in full stack with steep sidewalls without residual layer are patterned. Reduction in stack thickness for very small exposure doses due to inhibition even under inert atmosphere is shown. 45° -µ-mirrors are integrated in these openings to manufacture a U-link via a single mode waveguide and two adjacent micro-mirrors. Optical characterization of U-link demonstrates the feasibility of hybrid lithography approach. However, non-uniformity of core cross-section leads to cross coupling of planar waveguides. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with µ-mirror printing is given.

This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon-polymerization direct-laser-writing (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.