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Microscopic numerical analysis of semiconductor devices with application to avalnache photodiodesParks, Joseph Worthy, Jr. 12 1900 (has links)
No description available.
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In-situ monitoring of reactive ion etchingBaker, Michael Douglas 12 1900 (has links)
No description available.
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Studies on etching and polymer deposition in halocarbon plasmasAstell-Burt, P. J. January 1987 (has links)
Plasma etching, the selective removal of materials by reaction with chemically active species formed in a glow-discharge, is widely used by the electronics industry because of the advantages over 'wet' processes. The full potential has yet to be realised because chemical processes occuring in the plasma and at the plasma/substrate interface are incompletely understood. In this work attention was focussed on the accumulation of polymers on surfaces during plasma etching in fluorocarbon gases. An apparatus was designed and constructed to explore the conditions which give rise to these deposits by: i) The detection of the excited species such as CF and CF<sub>2</sub> (by optical emission spectroscopy); and ii) The rate of accumulation or removal of deposits (by means of a quartz crystal microbalance). The gases CF<sub>4</sub>, C<sub>2</sub>F<sub>6</sub>, C<sub>3</sub>F<sub>8</sub> and CHF<sub>3</sub> were used at pressures between 200-600mT, together with mixtures with H<sub>2</sub> and a few runs with other gases to vary the partial pressures of etching and polymerizing species. Both substrate effect of, viz silicon and thermally oxidised silicon (SiO<sub>2</sub>), and electrode materials effects have been examined. Polymer production from C<sub>3</sub>F<sub>8</sub> has been found to be more sensitive to electrode composition than that from CHF<sub>3</sub>, but the material formed is overall less thermally stable. On the other hand, polymers produced from C<sub>3</sub>F<sub>8</sub> accumulate at similar rates on Si and SiO<sub>2</sub>, whereas those from CHF3 show a much greater liklihood of building up on Si than SiO2 . XPS and infra-red spectroscopy have been used to demonstrate that polymers arising from these two gases exhibit marked structural differences, which can be minimised by mixing H<sub>2</sub> with C<sub>3</sub>F<sub>8</sub>. These effects can be correlated with the decomposition products expected in the plasma.
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Studies of the chemistry of plasmas used for semiconductor etchingToogood, Matthew John January 1991 (has links)
Optical diagnostic techniques have been developed and then used to investigate the chemistry of reactive species formed in CF<sub>4</sub> / O<sub>2</sub> rf parallel plate discharges, similar to those employed in semiconductor material processing. Oxygen atoms were detected by two photon laser induced fluorescence (LIF), and the technique was found to have a number of experimental caveats owing mainly to the high laser intensities required. In particular, amplified spontaneous emission (ASE), was observed from laser excitation of oxygen, and was found to influence the spontaneous fluorescence signal and thus question the use of LIF for ground state concentration measurements in these systems. The spin orbit states of the 3p <sup>3</sup>P level were resolved for the first time, both in using high resolution excitation experiments and also as a consequence of detecting ASE. Spin orbit temperatures of less than 50° above ambient were observed. The absolute concentration of oxygen has been found to be 7.4 ± 1.4 x 10<sup>13</sup> cm<sup>-3</sup> in a 50 mTorr, 100 W, 85% O<sub>2</sub> / CF<sub>4</sub> plasma. Optical emission was also used to study fluorine atoms and to examine the use of the actinometered emission technique as a measure of ground state concentrations. The latter was investigated directly by comparison with LIF measurements of O and CF<sub>2</sub>, and in many cases shown to be a poor representation of the ground state concentration. To investigate the chemical and physical processes in the plasma, time resolved methods are required and a new technique, time resolved actinometry, has been developed, tested by comparison with LIF measurements and then used to study the kinetics of fluorine atoms. Results have shown the importance of wall reaction rates on the magnitude of the fluorine atom concentrations, and the sensitivity of these concentrations to the nature of the surface, particularly in the presence of oxygen and silicon. Oxygen has also been shown to be removed predominantly at the surface but the influence of gas phase reactions with CF<sub>x</sub> radicals is apparent in discharges containing low percentages of O<sub>2</sub>. Studies on an afterglow type, electron cyclotron resonance reactor have been carried out as a comparison to the parallel plate system, and high excitation and dissociation levels have been observed from differences in the emission intensities and from measured values of the absolute CF and CF<sub>2</sub> concentrations. The use of LIF as a diagnostic for CF has been investigated by probing the predissociation of the A<sup>2</sup>Σ<sup>+</sup> state. Emission from the A<sup>2</sup>Σ<sup>+</sup> (v = 2) level has been seen for the first time, and a J independent predissociation mechanism, with a rate of 3 x 10<sup>9</sup> s<sup>-1</sup> has been observed.
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Low temperature SF6/O2ECR plasma etching for polysilicon gates /Hasan, Imad, January 1900 (has links)
Thesis (M. Eng.)--Carleton University, 2002. / Includes bibliographical references (p. 60-63). Also available in electronic format on the Internet.
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Reactive ion etching of polymide films using a radio frequency discharge /Fagan, James G. January 1987 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1987. / Typescript. Includes bibliographical references (leaves 106-108).
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Surface science studies on the interaction of nitrogen trifluoride ion beams and plasmas with silicon /Little, Thomas William, January 1999 (has links)
Thesis (Ph. D.)--University of Washington, 1999. / Vita. Includes bibliographical references (leaves 160-172).
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Application of surface analytical techniques to the characterisation of 60Pb/40Sn solder alloy on PCBsYoshitomi, Satoshi January 1995 (has links)
No description available.
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Impedance determination of a RF plasma discharge by external measurementsKrautschik, Christof Gabriel, 1957- January 1989 (has links)
The equivalent impedance of a RF plasma was experimentally determined by monitoring the voltage and current waveform for different input powers in real time. Average ion energies and fluxes were determined by a computer model which takes ion collisions in the sheath regions into account. In addition two models were proposed which explain how RF energy is converted to DC potential energy in the sheath. Etch rates of Si in a CF₄ discharge were also evaluated and related to the measurements.
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Anisotropic low-energy electron-enhanced etching of semiconductors in DC plasmaSteiner, Pinckney Alston, IV 08 1900 (has links)
No description available.
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