This thesis describes the fabrication and testing of electroluminescent diodes made from silicon subjected to plasma ion implantation. A silicon-compatible, electrically driven light source is desired to increase the speed and efficiency of short-range data transfer in the communications and computing industries. As it is an indirect band gap material, ordinary silicon is too inefficient a light source to be useful for these applications. Past experiments have demonstrated that modifying the structural properties of the crystal can enhance its luminescence properties, and that light ion implantation is capable of achieving this effect. This research investigates the relationship between the ion implantation processing parameters, the post-implantation annealing temperature, and the observable electroluminescence from the resulting silicon diodes.<p> Prior to the creation of electroluminescent devices, much work was done to improve the efficiency and reliability of the fabrication procedure. A numerical algorithm was devised to analyze Langmuir probe data in order to improve estimates of implanted ion fluence. A new sweeping power supply to drive current to the probe was designed, built, and tested. A custom software package was developed to improve the speed and reliability of plasma ion implantation experiments, and another piece of software was made to facilitate the viewing and analysis of spectra measured from the finished silicon LEDs.<p> Several dozen silicon diodes were produced from wafers implanted with hydrogen, helium, and deuterium, using a variety of implanted ion doses and post-implantation annealing conditions. One additional device was fabricated out of unimplanted, unannealed silicon. Most devices, including the unimplanted device, were electroluminescent at visible wavelengths to some degree. The intensity and spectrum of light emission from each device were measured. The results suggest that the observed luminescence originated from the native oxide layer on the surface of the ion-implanted silicon, but that the intensity of luminescence could be enhanced with a carefully chosen ion implantation and annealing procedure.</p>

This thesis describes the fabrication and testing of electroluminescent diodes made from silicon subjected to plasma ion implantation. A silicon-compatible, electrically driven light source is desired to increase the speed and efficiency of short-range data transfer in the communications and computing industries. As it is an indirect band gap material, ordinary silicon is too inefficient a light source to be useful for these applications. Past experiments have demonstrated that modifying the structural properties of the crystal can enhance its luminescence properties, and that light ion implantation is capable of achieving this effect. This research investigates the relationship between the ion implantation processing parameters, the post-implantation annealing temperature, and the observable electroluminescence from the resulting silicon diodes.<p> Prior to the creation of electroluminescent devices, much work was done to improve the efficiency and reliability of the fabrication procedure. A numerical algorithm was devised to analyze Langmuir probe data in order to improve estimates of implanted ion fluence. A new sweeping power supply to drive current to the probe was designed, built, and tested. A custom software package was developed to improve the speed and reliability of plasma ion implantation experiments, and another piece of software was made to facilitate the viewing and analysis of spectra measured from the finished silicon LEDs.<p> Several dozen silicon diodes were produced from wafers implanted with hydrogen, helium, and deuterium, using a variety of implanted ion doses and post-implantation annealing conditions. One additional device was fabricated out of unimplanted, unannealed silicon. Most devices, including the unimplanted device, were electroluminescent at visible wavelengths to some degree. The intensity and spectrum of light emission from each device were measured. The results suggest that the observed luminescence originated from the native oxide layer on the surface of the ion-implanted silicon, but that the intensity of luminescence could be enhanced with a carefully chosen ion implantation and annealing procedure.</p>

This investigation examines band gap engineering of the GaAsN alloy by means of plasma ion implantation. The strong redshift of the alloy's band gap is suitable for telecommunication applications and thus stimulated much interest in recent years. Nitrogen (N) ion implantation into gallium arsenide (GaAs) results in a thin shallow N-rich layer below the surface. However, the violent implantation process also modifies the concentrations of gallium and arsenide. The core of this thesis is a novel method for prediction of the band gap from the conditions in the processing plasma.<p>The first important variable, the number of implanted ions, is obtained from the Lieberman model for the current during high-voltage Plasma Ion Implantation (PII). A review of the model's assumptions is provided as well as a comprehensive discussion of the implantation which includes error boundaries. The predicted and measured ion currents agree within error boundaries. The number of implanted ions can therefore be obtained from the prediction.<p>The distribution of the implanted ions was subsequently explored by simulations such as TRIM and TRIDYN. It was found that the nitrogen content in GaAs is limited by the sputtering of the surface atoms. Furthermore, the content of gallium increases near the surface while the content of arsenic decreases. The predicted ratios of the constituents in the implanted layer is such that the alloy cannot form by ion implantation alone; it could be reconciled by annealing.<p>Preliminary samples were produced and tested for the formation of the GaAsN alloy by Raman spectroscopy. No evidence for bonds between N and either Ga or As was found in the as-implanted samples. The thesis concludes with a discussion of the necessary steps to synthesize the GaAsN alloy.

This investigation examines band gap engineering of the GaAsN alloy by means of plasma ion implantation. The strong redshift of the alloy's band gap is suitable for telecommunication applications and thus stimulated much interest in recent years. Nitrogen (N) ion implantation into gallium arsenide (GaAs) results in a thin shallow N-rich layer below the surface. However, the violent implantation process also modifies the concentrations of gallium and arsenide. The core of this thesis is a novel method for prediction of the band gap from the conditions in the processing plasma.<p>The first important variable, the number of implanted ions, is obtained from the Lieberman model for the current during high-voltage Plasma Ion Implantation (PII). A review of the model's assumptions is provided as well as a comprehensive discussion of the implantation which includes error boundaries. The predicted and measured ion currents agree within error boundaries. The number of implanted ions can therefore be obtained from the prediction.<p>The distribution of the implanted ions was subsequently explored by simulations such as TRIM and TRIDYN. It was found that the nitrogen content in GaAs is limited by the sputtering of the surface atoms. Furthermore, the content of gallium increases near the surface while the content of arsenic decreases. The predicted ratios of the constituents in the implanted layer is such that the alloy cannot form by ion implantation alone; it could be reconciled by annealing.<p>Preliminary samples were produced and tested for the formation of the GaAsN alloy by Raman spectroscopy. No evidence for bonds between N and either Ga or As was found in the as-implanted samples. The thesis concludes with a discussion of the necessary steps to synthesize the GaAsN alloy.