Plastic relaxation was observed in InᵡGa₁₋ᵡN/GaN epilayers grown on c-plane sapphire substrates. The relaxation obeys the universal hyperbolic relation between the strain and the reciprocal of the layer thickness. Plastic relaxation in this material system reveals that there is no discontinuous relaxation at critical thickness and once a layer starts to relieve, it follows the same strain-thickness dependence, unconstrained by the original misfit until the material system work hardens. From x-ray diffraction calibration, the in-plane and normal relaxation constants KP0 and KN0 for the InᵡGa₁₋ᵡN/GaN grown on sapphire were found to be −0.98 ± 0.03 and +0.51 ± 0.03 nm, respectively. / Singapore-MIT Alliance (SMA)

Biaxial tensile strain has been shown to greatly enhance the optoelectronic properties of epitaxial germanium (Ge) layers. As a result, tensile-Ge (and#949t-Ge) layers grown on larger lattice constant InGaAs or GeSn have attracted great research interest. However, no previous studies have investigated the plastic relaxation occurring in these and#949t-Ge layers. Here, we experimentally demonstrate that plastic relaxation occurs in nearly all and#949t-Ge epitaxial layers that are of practical interest for optoelectronic applications, even when layers may still exhibit strain-enhanced characteristics. We show arrays of misfit dislocations (MDs), which are mostly disassociated, form at the and#949t-Ge/InGaAs interface for and#949t-Ge layers as thin as 15 nm with less than 1% total mismatch. Wedge geometry of plain view transmission electron microscopy (PV-TEM) foils is utilized to carry out a depth dependent investigation MD spacing for a range of and#949t-Ge/InGaAs heterostructures. MD spacing measured by PV-TEM is correlated to and#949t-Ge layer relaxation measured by high-resolution x-ray diffraction. We confirm very low relaxation (< 10% relaxed) in and#949t-Ge layers does not imply they have been coherently grown. We demonstrate plastic relaxation in the and#949t-Ge layer is acutely sensitive to grown-in threading dislocations (TDs) in the template material, and that reducing TD density is critical for maximizing strain retention. Given that and#949t-Ge layer thicknesses of 150+ nm with greater than 1% tensile strain are desired for optoelectronic devices, this work suggests that MDs may inevitably be present at and#949t-Ge/InGaAs heterointerfaces in practical devices, and that the effect of MDs on optoelectronic performance must be better understood. / Master of Science