No / This paper presents a novel method to prepare stretchable conductors and pressure sensors based on the gold/polydimethylsiloxane (PDMS) system. The gold films were sputtered onto structured PDMS surfaces produced with a photolithographic surface treatment with the aim of reducing tensile strains in the gold film. Scanning electron microscopy (SEM) and atomic force microscopy analyses showed that these 3D patterns reduce cracks and delaminations in the gold film. Electrical measurements indicate that the patterns also protect the films against repeated tensile cycling, although the un-patterned samples remained conducting as well after the completion of 120 cycles. The extrapolated resistivity value of the patterned sample (4.5 × 10−5 Ωcm) compares well with previously published data. SEM micrographs indicate that the pattern features deflect the cracks and therefore toughen the gold film. However, x-ray photoelectron spectroscopy and contact angle analyses indicate that the patterning process also slightly modifies the surface chemistry. This patterning method was used to prepare capacitive strain gauges with pressure sensitivity (ΔZ/Z)/P of 0.14 kPa−1 in the sub-kPa regime. Such stretchable and potentially conformal low-pressure sensors have not been produced before and could prove advantageous for many smart fabric applications.

Now-a-days sensors are not limited only to industry or research laboratories but have come to common man’s usage. From kids toys to house hold equipment like washing machine, microwave oven as well as in automobiles, a wide variety of sensors and actuators can be easily seen. The aim of the present thesis work is to discuss the design, development, fabrication and testing of miniaturized piezoresistive, absolute type, low pressure sensor and flow sensor. Detailed performance study of these sensors in different ambient conditions (including harsh environment such as radiation, temperature etc.) has been reported. Extensive study on designing of thin silicon diaphragms and optimization of piezoresistor parameters is presented. Various experiments have been performed to optimize the fabrication and packaging processes. In the present work, two low range absolute type pressure sensors (0-0.5 bar and 0-1 bar) and a novel flow sensor (0-0.1 L min-1) for gas flow rate measurement are developed. The thesis is divided into following six chapters. Chapter 1: It gives a general introduction about miniaturization, MEMS technology and its applications in sensors area. A brief overview of different micromachining techniques is presented, giving their relative advantages and limitations. Literature survey of various types of MEMS based pressure sensors along with recent developments is presented. At the end, the motivation for the present work and organization of the thesis is discussed. Chapter 2: In this chapter, various design aspects of low, absolute type pressure sensors (0-0.5 bar and 0-1 bar) are discussed in detail. Static analysis of the silicon diaphragms has been carried out both analytically as well as through finite element simulations. Piezoresistive analysis is carried out to optimize the piezoresistor dimensions and locations for maximum sensitivity and minimum nonlinearity. All the Finite Element Analyses (FEA) were carried out using Coventorware software. A novel approach for the selection of resistor parameters (sheet resistance, length to width ratio) is reported . Finally, the expected performance of the designed sensors is summarized. Chapter 3: This chapter is divided into two parts. The first part presents the fabrication process flow adopted to develop these low range absolute pressure sensors. Two fabrication process approaches (wet etching and dry etching) which are used to fabricate the thin diaphragms are discussed in detail. Following an overall description, various aspects of the fabrication are elaborated on, like mask design, photolithography process, ion-implantation, bulk micromachining and wafer bonding. The required parameters for implantation doses, annealing cycles, low stress nitride deposition and anodic bonding are optimized through extensive experimental trials. The second part of this chapter discusses about the different levels of packaging involved in the realization of pressure sensors. Finite Element Analyses (FEA) of Level -0 and Level-1 packages has been carried out using ANSYS software to optimize the packaging materials. Exhaustive experimental studies on the selection of die attach materials and their characterization is carried out. Based upon these studies, the glass thickness and die-attach materials are selected. Chapter 4: The chapter discusses the measurement of the fabricated devices. The wafer level characterization which includes I-V characterization, measurement of offset and full scale output is discussed first. And then the temperature coefficient of resistance and offset is measured at wafer level itself. The performance characteristics like sensitivity, nonlinearity, hysteresis and offset of packaged pressure sensors is presented for all the variants (0.5 bar and 1 bar sensors fabricated by KOH and DRIE process) and their comparison with simulated values shows a close match. The measurement of dynamic characteristics using in-house developed test set-up are presented. The next section discussed detailed study about the stability of the developed sensors. The last part of this chapter reports the harsh environment characterization of the sensors viz. high temperature, humidity exposure, radiation testing etc. Chapter 5: The development of a novel micro-orifice based flow sensor for the flow rate measurement in the range of L min-1 is presented in this chapter. The sensing element is a thin silicon diaphragm having four piezoresistors at the edges. A detailed theoretical analysis showing the relationship between output voltage generated and flow rate has been discussed. The flow sensor is calibrated using an in-house developed testing set-up. Novelty of the design is that the differential pressure is measured at the orifice plate itself without the need of two pressure sensors or u-tube which is required otherwise. Chapter 6: This chapter summarizes the salient features of the work presented in this thesis with the conclusion. And then the scope for carrying out the further work is discussed.

A measurement system has been developed for use on a light aircraft to measure the pressure distribution over the wing surfaces. The measurement system was developed as a low-cost alternative to existing advanced measurement systems. The system consisted of low profile, low cost pressure sensors that interfaced digitally with microcontrollers for data acquisition. The pressure sensors and microcontrollers were developed into self-contained sensor modules with all electronic components mounted on flexible circuit board that formed the base of the modules. Two types of module were developed; a module with a single pressure sensor and a module with a row of seven pressure sensors at fifteen millimetre spacing. The total cost of the sensor modules was approximately ninety dollars for a single sensor module and one hundred and forty dollars for the seven sensor module. Studies were carried out using numerical methods to predict the pressure distribution over a NACA2412 airfoil. The numerical studies were used to evaluate the effect of adding the sensor modules to the wing, and the effect of the sensor distribution on measured force coefficients. Numerical predictions were made using the XFOIL software package. This software was validated using the Hess-Smith inviscid panel method. Flight testing was carried out with the pressure distribution measurement system to confirm the operation of the system and to make preliminary measurements. The flight testing focused on the measurement of steady state pressure distributions for comparison with the numerical predictions. Good agreement was found between the measured pressure distributions and the XFOIL predictions. Integration of the pressure distributions enabled comparison of normal force, lift force and quarter chord moment coefficients. The measured force coefficients showed the expected trends with angle of attack although it was found that the limited number of sensor modules used caused large error in the quarter chord moment coefficient compared to the numerical predictions.

The role of a roof on any building is to separate the interior environment of the building from the exterior environment, thereby making it a crucial component of the building design. Metal roof edges are the first line of defense against wind-induced loads on the roof system; however, data on the nature of these loads acting on the roof edge system is scarce. Previous studies with field measurements of wind pressure acting on the roof edge reported that metal flashings experienced negative pressure. These findings suggest that current building codes in North America (i.e. NBCC and ASCE codes) do not accurately identify wind design loads acting on roof edge systems. The Roof Edge Systems and Technologies (REST) project is a consortium of academia, government and roof industries, which was created to develop testing protocols and design guidelines for roof edges. The work presented in this thesis contributes to the collection and analysis of wind loads acting on metal roof edges, which were installed on the Canada Post building in Vancouver, Canada. The thesis presents the findings and analysis of the measured wind-induced pressure acting on all surfaces of three different edge configurations, namely the Anchor Clip Configuration (ACC), Continuous Cleat Configuration (CCC) and Discontinuous Cleat Configuration (DCC). The analysis showed the presence of negative pressure acting on all three faces of the configurations, in which the type of configuration had minimum effect on the magnitude and nature of the wind-induced loads. Furthermore, the top face of the edge configurations was found to experience the highest suction, and the front face of the edge coping was subjected to a net outward suction force due to the combination of the suction experienced by the coping front face and the positive pressure acting on the cleat. Comparison of these results with current NBCC and ASCE building codes highlight a need to update these codes in order to adequately design metal roof edges against wind action.

No description available.

Hypersonic flow is both fascinating and intriguing mainly because of presence of strong entropy and viscous interactions in the flow field. Notwithstanding the tremendous advancements in numerical modeling in the last decade separated hypersonic flow still remains an area where considerable differences are observed between experiments and numerical results. Lack of reliable data base of surface static pressures with good spatial resolution in hypersonic separated flow field is one of the main motivations for the present study. The experiments in hypersonic shock tunnels has an advantage compared to wind tunnels for simulating the total energy content of the flow in addition to the Mach and Reynolds numbers. However the useful test time in shock tunnels is of the order of few milliseconds. Hence in shock tunnel experiments it is essential to have pressure measurement devices which has special features such as small in size, faster response time and the sensors in array form with improved spatial resolutions. Micro Electro Mechanical Systems (MEMS) is an emerging technology, which holds lot of promise in these types of applications. In view of the above requirement, MEMS based pressure sensor array was developed to measure the static pressure distribution. The study is comprised of two parts: one is on the development of MEMS based pressure sensor array, which can be used for hypersonic application and other is on experimental static pressure measurement using MEMS based sensors in separated hypersonic flow over a backward facing step model. Initially a static pressure sensor array with 25 sensors was developed. The static calibration of sensor array was carried out to characterize the sensor array for various characteristic parameters. The preliminary experimental study with cluster of 25 MEMS sensor array mounted on the flat plate did not provide reliable and repeatable results, but gave valuable inputs on the typical problems of using MEMS sensors in short duration hypersonic ground test facilities like shock tunnels. Incidentally, to the best of our knowledge this is first report on use of MEMS based pressure sensors in hypersonic shock tunnel. Later cluster of 5 sensor array was developed with improved electronic packaging and surface finish. The experiments were conducted with flat plate by mounting 5 sensor array shows good agreement in static pressure measurement compared with standard sensors. In the second part of the study a backward facing step model, which simulates the typical gasdynamic flow features associated with hypersonic flow separation is designed. Backward facing step model with step height of 3 mm was mounted with sensor array along the length of model. Just after the step, static pressure measurements were carried out with MEMS sensors. It is important to note that, in the space available in backward facing step model we could mount only one conventional Kulite pressure transducer. The experiments were conducted at Mach number of 6.3 and at stagnation enthalpy of 1.5 MJ/kg in hypersonic shock tunnel (HST-5) at IISc. Based on the static pressure measurement on backward facing step, the location of separation and reattachment points were clearly identified. The static pressure values show that reattachment of flow takes place at about 7 step heights. Numerical simulations were carried out using commercial CFD code, FLUENT for flat plate and backward facing step models to compliment the experiments. The experimental tests results match well with the illustrative numerical simulations results.

The sensor is a device that converts a form of energy concerning which the information is sought, called the measurand, to a form (electrical) in which it can be usefully processed or interpreted. Sensors rely on physical or chemical phenomena and materials where those phenomena appear to be useful. Those phenomena may concern the material itself or its geometry. Hence, the major innovations in sensors come from new materials, new fabrication techniques or both. Normally, thin film sensors are realized by depositing a sensing film on a suitable substrate. There could be many combination of metals and insulating materials being deposited depending upon the application or sensing requirements. In general, sensors for various applications are fabricated using a variety of liquid phase technologies (also called as wet methods) and gas phase technologies (also called as dry methods) of deposition. Hence sensor fabrication technology requires various combination of processing technologies and newer materials. In the present work, an attempt is made to design and fabricate a thin film based pressure sensor using a combination of wet and dry deposition techniques. The diaphragm, used for sensing the pressure is coated with a hard anodic coating (Al2O3) using a wet technology, viz. pulse hard anodizing technique, for electrical insulation requirement. The piezo-resistive strain sensing films were deposited onto this coating by dry method, namely, DC Magnetron sputtering technique.. Chapter 01 gives a brief overview of sensors, their classification, principles of sensing,characteristics, materials used in the fabrication of sensors like conductors and insulators, the components of a sensor. Chapter 02 gives brief information about various techniques of depositions viz., liquid phase technologies (wet methods) and vapour phase technologies (dry methods) used to fabricate the sensors. Also, information regarding the coating property evaluation and coating characterization techniques is included. The chapter 03 presents a detailed account of work carried out to obtain an electrically insulating layer by the development of pulse hard anodizing process for aluminum alloy diaphragm, necessary process optimization and testing. The details related to the development, fabrication and testing of thin film based pressure sensors using aluminum alloy diaphragm with hard anodic coating are presented in Chapter 04. The thin film strain gauges were deposited using DC magnetron sputtering technique. The information about mask design, deposition process parameters, calibration etc is also included. Chapter 05 provides summary of the work carried out and conclusions. The scope of carrying out further work is also outlined.

This thesis reports the discovery of a wide negative di↵erential resistance (NDR) region in a graphite-silicone composite that was utilized to create a strain-tuned flexible oscillator. Encoding the strain into frequency mimics the behavior of mechanoreceptor neurons in the skin and demonstrates a flexible and electronically active material suitable for state of the art bio-electronic applications. The NDR was investigated over a range of composite filling fractions and temperatures; alongside theoretical modelling to calculate the tunneling current through a graphite-silicone barrier. This led to the understanding that the NDR is the result of a semi-metal to insulator transition of embedded graphene bilayers within the graphite nanoparticles. The transition, brought about by a transverse bias across specifically orientated particles, opens a partial band-gap at the Fermi level of the bilayer. NDR in a flexible material has not been observed before and has potential for creating a flexible active device. The electromechanical properties of the composite were considered through a bend induced bilayer strain. The piezoresistance was found to be dominated by transient resistance spiking from the breaking of conduction lines, which then reform according to the viscoelasticity of the polymer matrix. The resistance spiking was embraced as a novel method for sensitive di↵erential pressure detection, used in the development of two applications. Firstly, it was employed for the detection of ultrasound waves and found to have an acoustic pressure detection threshold as low as 48 Pa. A commensurability was observed between the composite width and ultrasound wavelength which was shown to be consistent with the formation of standing waves, described by Bragg’s law. Secondly, a differential pressure array of 64 composite pixels was fabricated and demonstrated to image pressures under 3.8 kPa at a resolution of 10 dpi. The NDR active region was incorporated into an LC circuit where it was demonstrated to sustain oscillations of up to 12.5 kHz. The composite was then strained and an intrinsic frequency was observed which had a linear dependence on the strain with a frequency shift of 84 Hz / % strain. Lastly the composite was used in a strain-tuned amplifier circuit and shown to provide a gain of up to 4.5. This thesis provided the groundwork for a completely flexible electronically active device for futuristic bio-electronic skins with resolutions and sensitivities rivalling those of human tactile sensing.

The objective of this research is to develop a new class of miniaturized sensors on-catheter technology through the integration of functional nanomaterials and flexible microsystems, with high sensitivity, fast recovery time, reduced form factor, for in situ blood pressure and flow monitoring with minimal invasiveness. Real-time endovascular pressure measurement techniques are crucial to evaluate the hemodynamics, which indicates the physiological state of the cardiovascular system. Current technology relies on fluid filled catheter coupled to remote transducers to measure endovascular pressures and gradients. The fluid filled catheters are bulky, inherently inaccurate due to the tubing mechanical resonance, and with low signal integrity due to the vibration noises from the environment. Silicon based conventional pressure sensors have complications due to issues of catheter stiffness, biocompatibility or small form factor integration. We propose a paradigm shift in designing the endovascular pressure sensing technology, through developing compact flexible sensing structures using nanoengineered piezoelectric polymers which can be integrated on catheters without consuming the internal lumen space. We focused on designing novel nanostructures using PVDF-TrFE (Polyvinyledene fluoride trifluoroethylene), with well controlled [Beta]-crystalline phase to significantly improve the resulting sensor performance. The research objectives include: (1) Thin-film structures for higher piezoelectric effect without any mechanical stretching or poling requirements, (2) High density highly-aligned electrospun nanofibers through electrospinning towards enhanced sensitivity; (3) Core-shell electrospun nanofiber for tapping the near [Beta]-crystalline phase formation and high cyrstallinity by virtue of inherent stress and stretching involved in the fabrication procedure. For pressure sensor design and characterization, we worked on two main form factors designs: thin-film, and aligned electrospun nanofiber based sensors patterned on catheter tips which are ready to be deployed in intra-vascular environment. Testing results showed promising results from PVDF based pressure sensors. The average sensitivity of the PVDF sensors was found to be four times higher than commercial pressure sensor while the PVDF sensor had five fold shorter response time than commercial pressure sensor, making the PVDF sensors highly suitable for real-time pressure measurements using catheters. / text

Orientador: Fabiano Fruett / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica e de Computação / Made available in DSpace on 2018-08-12T17:39:52Z (GMT). No. of bitstreams: 1 Coraucci_GuilhermedeOliveira_M.pdf: 8439243 bytes, checksum: d062ad2bf9b0e8eaae04ac2443802dab (MD5) Previous issue date: 2008 / Resumo: Apresentamos neste trabalho um sensor de pressão piezorresistivo de multiterminais totalmente compatível com o processo de fabricação CMOS, constituído de um piezoelemento sensível ao estresse mecânico disposto sobre uma membrana microfabricada. O layout deste piezoelemento permite maximizar o efeito do estresse mecânico sobre a deflexão das equipotenciais distribuídas sobre sua região ativa. Utilizamos a análise baseada no Método de Elementos Finitos no projeto da membrana, bem como na definição da disposição dos piezoelementos sobre a mesma. O sensor foi fabricado em duas tecnologias diferentes: CMOS 0,3 ?m MAS (Austria Mikro Systeme International) - disponibilizado pelo Projeto Multi-Usuário PMU-FAPESP - e CCS/Unicamp (Centro de Componentes Semicondutores da Unicamp). Realizamos a membrana, no sensor fabricado na tecnologia AMS, através de um processo de desbaste mecânico da pastilha de silício. Já para o sensor fabricado na tecnologia do CCS/Unicamp, utilizamos um aparato de corrosão química (solução de KOH) para corrosão anisotrópica do silício monocristalino e, desta forma, obtivemos uma membrana com maior qualidade. Realizamos o estudo, analítico e numérico, da dependência da tensão de saída do piezoelemento de multiterminais com relação ao estresse mecânico. Os sensores fabricados apresentaram sensibilidade proporcional ao número de contatoscorrente de entrada e pouca dependência desta sensibilidade com sua geometria para uma grande faixa de variação de suas dimensões. Na tecnologia AMS, o sensor apresentou uma sensibilidade de 0,24 mV/psi e na tecnologia CCS/Unicamp 4,8 mV/psi com linearidade máxima de aproximadamente 5,6% FSO / Abstract: This work describes a CMOS-Compatible multiterminal piezoresistive pressure sensor based on the transversal piezoresistive effect, which consists of a piezotransducer fabricated on a membrane. The layout of this piezoelement is designed in such a way that its sensitivity is improved by maximizing the effect of the mechanical stress over the equipotential lines distribution in its active region. We performed Element Finite analyses in both membrane and piezoelement designs. The sensor was fabricated using two different technologies: CMOS 0,35 ?m AMS process (Austria Mikro Systeme International) - supported by the Fapesp Multi-User Project - and CCS/Unicamp process (Center for Semiconductor Components). In the AMS process, we realized a diaphragm by reducing the thickness of the die through a mechanical polishing process. In the sensor fabricated at CCS/Unicamp process, a backside bulk micro-machining was performed by using an automated KOH chemical etching apparatus, which provides a well-controlled anisotropic etching process. The sensor sensitivity is proportional to the number of input current terminals. The sensor sensitivity dependence related to its geometry is minimized even for a wide range of the sensor layout's aspect-ratio. In the AMS process, sensor's sensitivity amounted to 0.24 mV/psi and in the CCS/Unicamp process the sensitivity amounted to 4,8 mV/psi with a maximum linearity of about 5,6% FSO / Mestrado / Eletrônica, Microeletrônica e Optoeletrônica / Mestre em Engenharia Elétrica