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This work is an effort to investigate and derive a simple equivalent circuit model to represent an electromagnetically coupled microstrip patch antenna. This provides a simple approach to the complicated electromagnetic coupling behaviour in the patch. A simplified theory based on the broadside coupled line and improved transmission line theories is developed to derive the equivalent circuit of EM coupled patch antenna. The design parameters are determined from the above mentioned theory. Computer programs are developed to provide a practical design of such antennas without involving complicated, time consuming, rigorous methods. A number of sample patches are designed, made and tested to verify the theory. These elements are also incorporated into an array to evaluate their performance in an array environment. The impedance and pattern measurements are made for comparison with theoretical results.

International Telemetering Conference Proceedings / October 30-November 02, 1989 / Town & Country Hotel & Convention Center, San Diego, California / The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper will discuss alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis will be placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems.

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With smaller electronic devices and higher transmission speeds, a digital circuit will cause potential electromagnetic interference (EMI) and signal integrity (SI) problems. Nowadays, the flexible printed circuit board (FPC) is widely used in electronic systems, especially in the video circuit. In this thesis, we used transmission line model to explain effect of the structure of the flexible printed circuit board transmission lines. Eye-diagram is a fast and convenient tool to analyze the quality of the high speed transmission, and we can use the equivalent model to substitute for the electromagnetic (EM) model to simulate the performance. We used differential circuit and the reflection gain to increase the height and width parameters of Eye-diagram, and make the quality of signal transmission higher. For video driver circuit, since the terminal resistance is different depending on whether the IC is on or off, the standard probe cannot measure mixed-mode S-parameter directly due to the connectors. Thus, we provided a de-embedding method to remove the effects of high speed interconnect line on the test board. Finally, we use a simple structure to verify the method, and it can be used to measure mixed-mode S-parameter on the standard of Mobile Industry Processor Interface (MIPI) for D-PHY, v0.90.00.