The genus Fusarium has a wide host range and causes many different forms of plant disease. These include seed rot and seedling blight diseases of cultivated plants. The Fusarium-caused diseases of wild plants are less well-known. In this study we examined Fusarium sp. n-caused disease development on non-dormant seeds of the important rangeland weed Bromus tectorum as part of broader studies of the phenomenon of stand failure or ‘die-off’ in this annual grass. We previously isolated an undescribed species in the Fusarium tricinctum species complex from die-off soils and showed that it is pathogenic on seeds. It can cause high mortality of non-dormant B. tectorum seeds, especially under conditions of water stress, but rarely attacks dormant seeds. In this study, we used scanning electron microscopy (SEM) to investigate the mode of attack used by this pathogen. Non-dormant B. tectorum seeds (i.e., florets containing caryopses) were inoculated with isolate Skull C1 macroconidia. Seeds were then exposed to water stress conditions (-1.5MPa) for 7 d, then transferred to free water. Time lapse SEM photographs of healthy vs. infected seeds revealed that hyphae under water stress conditions grew toward and culminated their attack at the abscission layer of the floret attachment scar. A prominent infection cushion, apparent macroscopically as a white tuft of mycelium at the radicle end of the seed, developed within 48 hours after inoculation. Seeds which lacked an infection cushion completed germination upon transfer to free water, whereas seeds with an infection cushion were almost always killed. In addition, hyphae on seeds that did not initiate germination lacked directional growth and did not develop the infection cushion. This strongly suggests that the fungal attack is triggered by seed exudates released through the floret attachment scar at the initiation of germination. Images of cross-sections of infected seeds showed that the fungal hyphae first penetrated the caryposis wall, then entered the embryo, and later ramified throughout the endosperm, completely destroying the seed.

There has been an urge for increasing the efficiency in advanced gas turbine engines. To fulfill these needs the inlet gas temperatures should be increased in the gas turbine engines, thermal barrier coatings (TBCs) have gained significant applications in increasing the gas inlet temperatures. Insulating characteristics of ceramic TBCs allow the operation at up to 150~250 ˚C higher gas temperatures. Because of the severe turbine engine operating conditions that include high temperature, steep temperature gradient, thermal cycling, oxidation and hot-corrosion, TBCs can fail by spallation at the interface between the metal and ceramic. The lack of understanding in failure mechanisms and their prediction warrant a development of non-destructive evaluation technique that can monitor the quality and degradation of TBCs. In addition, the development of NDE technique must be based on a robust correlation to the characteristics of TBC failure. The objective of this study is to develop electrochemical impedance spectroscopy (EIS) as a Non-destructive evaluation (NDE) technology for application to TBCs. To have a better understanding of the multilayer TBCs using EIS they were divided into individual layers and EIS were performed on them. The individual layers included polycrystalline ZrO2-7~8 wt.%Y2O3 (YSZ) (topcoat) of two different densities were subjected to sintering by varying the sintering temperature and holding time for three different thickness and hot extruded NiAl alloy buttons which were subjected to isothermal oxidation with varying temperature and time. NiAl is as similar to the available commercial bondcoats used in TBCs. Then degradation monitoring with electrolyte penetration was carried out on electron beam physical vapor deposited (EB PVD) TBCs as a function of isothermal exposure. Quality control for air plasma sprayed TBCs were carried out as a function of density, thickness and microstructure. Dense vertically cracked TBCs were tested as a function of vertical crack density and thickness. Electrochemical impedance response was acquired from all specimens at room temperature and analyzed with an AC equivalent circuit based on the impedance response as well as multi-layered structure and micro-constituents of specimens. Physical and microstructural features of these specimens were also examined by optical and electron microscopy. The EIS measurement was carried out in a three-electrode system using a standard Flat Cell (K0235) from Princeton Applied Research™ and IM6e BAS ZAHNER™ frequency response analyzer. The electrolyte employed in this investigation was 0.01M (molar) potassium Ferri/Ferro Cyanide {(K3Fe(CN)6/K4Fe(CN)6·3H2O)}. The thickness and density were directly related to the resistance and capacitance of the polycrystalline YSZ with varying thickness and open pores. As the effective thickness of the YSZ increased with sintering time and temperature, the resistance of the YSZ (RYSZ) increased proportionally. The variation in capacitance of YSZ (CYSZ) with respect to the change in porosity/density and thickness was clearly detected by EIS. The samples with high porosity (less dense) exhibited large capacitance, CYSZ, compared to those with less porosity (high density), given similar thickness. Cracking in the YSZ monoliths resulted in decrease of resistance and increase in capacitance and this was related to the electrolyte penetration. Growth and spallation of TGO scale on NiAl alloys during isothermal oxidation at various temperatures and holding time was also correlated with resistance and capacitance of the TGO scale. With an increase in the TGO thickness, the resistance of the TGO (RTGO) increased and capacitance of the TGO (CTGO) decreased. This trend in the resistance and capacitance of the TGO changed after prolonged heat treatment. This is because of the spallation of the TGO scale from the metal surface. The parabolic growth of TGO during high temperature oxidation was inversely proportional to the capacitance of TGO, excluding the abrupt changes associated with the failure. As a function of isothermal exposure for EB-PVD TBCs, initial increase in the resistance of YSZ with thermal exposure was observed perhaps due to the high temperature sintering of YSZ. The parabolic growth of TGO during high temperature oxidation was inversely proportional to the capacitance of TGO. An explanation based on electrolyte penetration into sub-critical damage is proposed for the gradual decrease in the resistances of YSZ and TGO with prolonged thermal exposure. Observation of exposed metallic bond coat surface on the fracture surface, which readily provides conduction, was related to the abrupt and large increase in the capacitance of YSZ and TGO. A direct relation between the resistance of the YSZ (RYSZ) and density of the YSZ was observed for APS TBCs with varying topcoat density. APS TBCs with varying topcoat chemistry and thickness were tested and directly related to resistance of topcoat. With the increase in the topcoat thickness, the capacitance decreased and the resistance increased. The higher values of CCAT and RCAT compared to that of CYSZ and RYSZ were related to the higher dielectric constant and resistivity of CaTiO3. Dense vertically cracked TBCs were tested with varying crack density were tested and the variation in the resistance was related indirectly to the cracks and directly to the difference in the thickness of the topcoat. EB-PVD TBCs with varying density (dense and columnar) were tested and the variation in resistance was attributed to the dense structure and columnar structure of the topcoat with columnar structure having lower resistance because of more electrolyte penetration through the columnar structure. From this study, EIS showed a potential as a NDE technique for quality assurance and lifetime remain assessment of TBCs. Future work should continue on developing a mathematical model to study the impedance curves and come up with a model for individual layers of TBC and then sum them up to get the multilayered TBC response. The flexible instrument probe of EIS needs to be designed and tested for field evaluation of TBCs.

Yes / Aluminium alloys are widely used structural materials in automotive, aerospace, and transportation, among several other notable industries. However, aluminium alloys' low hardness and poor tribological performance prevent potential use in applications requiring high contact pressures and wear resistance. This paper presents a novel two-step technique for enhancing the mechanical properties of the aluminium alloy by impregnating the surface with Ni-coating containing hard TiO2 nanoparticles using a high-intensity electric arc generated during tungsten inert gas welding. The results show that the process significantly changes the Microstructure and mechanical properties. The surface hardness increased from 0.48 GPa to 0.65 GPa with a corresponding change of Young's modulus from 15 GPa to 24 GPa of the treated surface.

Scanning Electron Microscopy combined with Energy Dispersive X-ray Spectroscopy (SEM-EDS) is a widely applied elemental microanalysis method. The integration of silicon drift detectors (SDDs) has notably enhanced EDS performance, enabling precise elemental identification due to its large sensitive area and low output capacitance.  Accurate simulations of SDDs can provide insights that enable the design and optimization of future models without the need for costly and time-consuming experimental iterations. Moreover, the current model-based quantification methods for EDS applications have reached their maximum predictive accuracy. As such, creating a more accurate simulation model could help achieve a higher level of precision in these quantification models, which would be immensely valuable for all EDS applications.  With this objective in mind, a simulation framework for modeling SDDs in EDS was developed based on Geant4, Allpix Squared, and COMSOL Multiphysics. The simulation encompasses the entire physics pipeline, including characteristic X-ray emission from the target sample and its absorption in the detector. The generated charge carriers within the detector are propagated through the internal electric field of the SDD, and their individual charge contribution is measured to simulate EDS spectra. The simulated model was compared to existing literature and in-house experimental measurements, showing strong agreement in the case of a well-tuned SDD. Limitations of the simulation framework are discussed, and further research to enhance accuracy and speed is explored.

In this thesis, we present three novel algorithms. The first algorithm is a method of identifying numerical landmarks (a definition coined in this thesis). The second algorithm uses the projection of image regions onto x- and y- axes and the matching of the resulting 1D projections to determine an overall 2D translation for use in registration. The third algorithm aligns SEM images of successive layers of a semiconductor device by first extracting the positions of vias in the lower layer, and then searching for the best translation for subsets of vias such that they all or mostly connect to metalization in the upper layer. / To acquire high-resolution Scanning Electron Microscopy (SEM) images over wide areas, we must acquire several images ``tiling'' the surface and assemble them into a single composite image, using a process called image stitching. While for some applications, stitching is now routine, SEM mosaics of semiconductors pose several challenges: (1) by design, the image features (wire, via and dielectric) are highly repetitive, (2) the overlap between image tiles is small, (3) sample charging causes intensity variation between captures of the same region, and (4) machine instability causes non-linear deformation within tiles and between tiles. In this study, we compare the accuracy and computational cost of three well-known pixel-based techniques: Fast Fourier Transform (FFT), Sum of Squared Differences (SSD), and Normalized Cross Correlation (NCC). We compare well-known 2D algorithms, as well as novel projection-onto-1D versions. The latter reduces the computational complexity from O(n^2) to O(n), where n is the number of pixels, without loss of accuracy, and in some cases, with greater accuracy. Another approach to reducing the computational complexity of image alignment is to compare isolated landmarks, rather than pixels. In semiconductor images, there are no natural fiducials and adding them would destroy the information required to reconstruct their circuits, so we introduce a new class of landmarks which we call numerical landmarks. Related to Harris corners, the novel numerical landmarks are insensitive to brightness variations and noise. Finally, we consider the alignment problem between layers of image mosaics. Unlike in the ``horizontal'' directions, the vertical dimension is only sparsely sampled. Consequently, image features and landmarks cannot be used for alignment. Instead, we must rely on the relationship between vias (through-plane metalization) and wires (in-plane metalization), and we have developed a novel algorithm for matching vias in the lower layer with wires above, and use this to align subimages. / Thesis / Doctor of Philosophy (PhD) / Applications in materials science often require the acquisition of images of semiconductor computer chips at very high resolution. Using cameras with even tens of millions of pixels might not give us enough resolution over a wide field of view. One approach is to acquire several images of parts of the sample at high magnification and assemble them into a single composite image. This way, we can preserve the high resolution over a wide area. Algorithms developed for assembling the composite image are known as tiling or mosaicing. This whole process is known as image stitching (and includes image registration). In this thesis, we develop specialized algorithms suited for the 2D stitching of semiconductor images, including the generalization to 3D. This case is challenging because slight alignment errors may completely change the reconstructed circuit, and the images contain both repeated patterns (such as many parallel wires) and changes in brightness and distortions caused by the scanning device.

The application of the entropy concept to stabilize oxide systems opens the possibility of discovering new materials with unique structural and functional properties. High-entropy alloys and oxides, which are based on the entropy stabilization concept and composed of multi-principal elements, have the potential to tailor structural and functional properties to meet specific needs. The study of lanthanum-based perovskite materials that benefit from the entropy stabilization approach is a promising area of research.However, the inherent randomness of multi-principal elements presents new challenges, making it difficult to predict their behavior. To understand these difficulties, we have initiated a methodical investigation of La-based medium- and high-entropy perovskite oxides. This study focuses on the synthesis, characterization, sintering mechanism, and electrical conductivity properties of nine La1-xCax(A1/3, B1/3, C1/3)O3 medium-entropy perovskite oxide systems (A, B, and C = three combination of Cr or Co or Fe or Ni or Mn) and one La1-xCax(Cr0.2Co0.2Fe0.2Ni0.2Mn0.2)O3 high-entropy perovskite oxide system (for x = 0.1 to 0.3). This research aims to provide better understanding of: (1) synthesis process, (2) temperature of single-phase formation, (3) the impact of various combinations of multiple B-site transitional elements and Ca doping on crystal structure, and microstructure (4) sintering mechanism and (5) electrical conductivity properties.

The objective of the current study was to determine the efficacy of 3% acetic acid in reducing Salmonella in pork trimming and the effects of such treatment on meat quality. For 15-s dipping and 5-log CFU/pork cube inoculation, only 0.2- to 0.3-log reduction was observed (P ≤ 0.026). Acetic acid worked best at 75 s and 50°C, providing 1.4-log reduction (P < 0.001), damaging Salmonella cell membranes. When an inoculated pork cube was placed at the geometrical center of 2.3-kg pork trimming, dipping at 50°C for 75 s only reduced Salmonella by 0.2 log (P = 0.040). Although dipping slightly increased lightness (P < 0.001) and decreased redness (P ≤ 0.008) on the meat surface, no inside color change was detected (P = 0.120). Neither lipid oxidation (TBARS, P = 0.644), protein solubility (P = 0.187), nor water-holding capacity (P = 0.076) were affected by treatments.

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