No description available.

The effects of microbubbles injection in the boundary layer of a turbulent channel flow are investigated. Electrolysis demonstrated to be an effective method to produce microbubbles with an average diameter of 30 ??m and allowed the placement of microbubbles at desired locations within the boundary layer. Measurement of velocity fluctuations and the instantaneous wall shear stress were carried out in a channel flow facility. The wall shear stress is an important parameter that can help with the characterization of the boundary layer. This parameter can be obtained indirectly by the measurement of the flow pressure at the wall. The wall shear stress in the channel was measured by means of three different independent methods: measurement of the pressure gradient by a differential pressure transducer, Particle Image Velocimetry (PIV), and an optical wall shear stress sensor. The three methods showed reasonable agreement of the wall shear stress values for single-phase flow. However, differences as skin friction reductions were observed when the microbubbles were injected. Several measurements of wall-pressure were taken at various Reynolds numbers that ranged from 300 up to 6154. No significant drag reduction was observed for flows in the laminar range; however, a drag reduction of about 16% was detected for turbulent Reynolds numbers. The wall-pressure measurements were shown to be a powerful tool for the measurement of drag reduction, which could help with the design of systems capable of controlling the skin friction based on feedback given by the wall-pressure signal. The proposed measurement system designed in this work has capabilities for application in such diverse fields as multiphase flows, drag reduction, stratified flows, heat transfer among others. The synchronization between independent systems and apparatus has the potential to bring insight about the complicated phenomena involved in the nature of fluid flows.

Plants have molecular mechanisms for nutrient-related stress responses; however, their exact regulation remains unclear. For example, the integral myo-inositol (inositol) signal transduction pathway allows Arabidopsis thaliana to sense and respond to changes in environmental stimuli, such as water, light availability, and nutrient stress. The inositol signaling pathway relies on dynamic changes in second messenger levels of inositol(1,4,5)P3 (InsP3) and is regulated by myo-inositol polyphosphate 5-phosphatases (5PTases). The 5PTses keep balance between InsP3 signal transduction and termination. Previous work has identified the Sucrose non-fermenting (Snf) 1-related kinase (SnRK1.1) as a binding partner to 5PTase13, a potential InsP3 regulator, and a novel protein called P80, a predicted component of the Cullin4 (CUL4) E3 Ubiquitin ligase complex. In plants, SnRK1.1 is a central integrator of metabolism, stress responses, and developmental signals. Moreover, SnRK1.1 is conserved with the eukaryotic AMP-activated protein (AMPK) and Snf1 kinases—enzymes fundamental to transcriptional regulation and metabolic balance. Studying SnRK1.1 regulation may reveal mechanisms for agricultural sustainability and may offer valuable links to understanding metabolic diseases and lifespan in humans. Therefore, the research presented here centered on characterizing the regulation of SnRK1 gene expression and steady-state protein levels in plants. I show developmental and nutrient-related regulation of spatial expression patterns of SnRK1 genes and SnRK1.1 protein. Further, I present a model for regulation of SnRK1.1 protein stability in vivo based on SnRK1.1 steady-state protein levels in p80 and cul4 co-suppressed (cs) mutants. My results indicate SnRK1.1 regulation is dynamic, and dependent on the timing of particular cues from development and the environment. / Master of Science

Le contrôle des écoulements vise à modifier le comportement naturel d’un écoulement fluidique. Dans le domaine des transports, contrôler les phénomènes fluidiques tels que le décollement peut permettre d’économiser du carburant, d’améliorer les performances des véhicules ou encore d’assurer davantage la sécurité des passagers. Dans ce contexte, des capteurs avec de fines résolutions temporelle et spatiale sont requis afin de connaître l’écoulement à contrôler et adapter en temps réel le contrôle. Dans ce travail, l’objectif a été de développer des micro-capteurs de frottement et de pression pour les mesures en écoulements turbulents et le contrôle de décollement. Tout d’abord un micro-capteur calorimétrique a été conçu et réalisé par des techniques de microfabrication pour mesurer simultanément le frottement pariétal et la direction de l’écoulement. Le micro-capteur a ensuite été intégré en paroi d’une soufflerie afin de réaliser son étalonnage statique et dynamique et d’étudier sa sensibilité à la direction de l’écoulement. Troisièmement, le micro-capteur calorimétrique a été utilisé pour caractériser des écoulements décollés. Plusieurs micro-capteurs avec électronique miniaturisée ont été intégrés avec succès dans une maquette de volet et des essais de contrôle actif ont été réalisés. Enfin, la quatrième partie concerne le développement d’un micro-capteur de pression et d’un micro-capteur multi-paramètres réunissant les deux technologies. L’ensemble de ces micro-capteurs ont été caractérisés avec succès et montrent des résultats prometteurs pour caractériser les écoulements turbulents et permettre la mise en place de contrôle d’écoulement en boucle fermée. / Flow control aims at artificially changing the natural behaviour of a flow. In transport industries, controlling fluidic phenomena such as boundary layer separation allows saving fuel and power, improving vehicles performances or insuring passenger’s safety. In this context, sensors with accurate spatial and temporal resolution are required. Such devices enable to estimate the flow to control and allow real-time adaptation of the control. In this work, the objective is to develop wall shear stress and pressure micro-sensors for turbulent flows measurements and flow separation control.Firstly, a calorimetric micro-sensor was designed and realized using micromachining techniques for measuring simultaneously the wall shear stress amplitude and the flow direction. Secondly, the micro-sensor was flush-mounted at the wall of a wind tunnel for static and dynamic calibrations. Thirdly, it was used to characterized separated flows. Several configurations were studied: separation on airfoil profile, separation and reattachment downstream a 2D square rib and the separation on a flap model. Several micro-sensors with embedded electronics were successfully integrated on a flap model and active flow control experiments were performed. Finally, the fourth part of the document concerns the development of a pressure micro-sensor and the development of a multi-parameter micro-sensor combining both technologies.All these micro-sensors have been successfully realized and characterized and demonstrate promising results for measuring turbulent flows and implementing closed loop reactive flow control

Mechanochromic polymers are force-sensitive materials that change their color as a response to mechanical stimuli. This visualization of forces can be used to further optimize polymer-based materials by understanding microscopic force transduction or to display fatigue of material. Most mechanochromic systems rely on bond cleavage, so they can only distinguish between “on” and “off” state without any further correlation of the applied force with the optical signal. Although reversibility to the initial state is possible for most of these systems, it often demands time or input of energy making them rather unsuitable for sensing forces in real-time. In this work, the development and application of mechanochromic donor (D)-acceptor (A) torsional springs is presented as a new concept for mechanochromic materials. The mechanically induced planarization of D and A leads to a continuous red-shift of both absorption and emission color. A suitable DA-system is found in ortho-substituted diphenyldiketopyrrolopyrrole (o-DPP) having the large torsional angle required for the equilibrium geometry and therefore showing blue-shifted optical spectra compared to reference compounds with a smaller torsional angle. The covalent incorporation into tough poly(meta,meta,para-phenylene) (PmmpP) by Suzuki polycondensation enables sufficient force transduction to the DA spring during uniaxial elongation of thin-film specimens. The detected mechanochromic response correlates with the applied stress and shows full reversibility upon stress release. Theoretical experiments based on density functional theory (DFT) confirm the experimental results and offer a detailed explanation of the molecular deformations responsible for the optical shift. In addition, the application as stress sensor was tested investigating the molecular force transduction in glassy PmmpP as a function of the number average molecular weight (Mn) by blending o-DPP-PmmpP probe chains of varying Mn with pristine PmmpP. The distinct mechanochromic response for entangled and non-entangled probe chains, respectively, allows the extraction of the critical molar mass (Mc) that is required for entanglements to become effective. The resulting value for the entanglement molar mass Me ≈ 1/2 Mc is in excellent agreement with the value determined by rheology.

No description available.

Pure Sn and Sn-alloys are widely used in electrical and microelectronic devices as protective layer to prevent oxidation of Cu conductors and also as a component of Pb-free, Sn-based solders. Sn coatings, typically 0.5-10 μm thick, deposited on substrates, e.g., Cu, brass, etc., are prone to spontaneous growth (i.e., without any external stimuli) of Sn whiskers under ambient conditions. The growth of whiskers from Sn plating has caused numerous failures in micro-electronic devices, mainly due to short-circuiting, leading to failure of components or devices. Whisker growth is, thus especially very critical in aviation, space and defines applications, where the electronic components are designed for longer life span. Furthermore, due to miniaturization of electronic devices, the spacing between adjacent conductors or interconnects can be as small as a few hundred nanometres to a few micrometres, making them more prone to whisker induced short-circuiting. Minor alloying of Sn with Pub was the principle way for mitigating the whisker growth in Sn plated components; however, due to the recent worldwide acceptance of European Union’s Restriction of Hazardous Substances (RoHS) act, enforcing Pub-free manufacturing, whisker growth has re-emerged as a reliability issue in Pub-free solders and the Sn plating finishes. Even after decades of research, a universal whisker growth mechanism and hence effective mitigation technique is still not available in the public domain. This is mainly due to the fact that large number of factors that affect the whisker growth directly or indirectly, making it difficult to devise an experimental procedure, which allows studying effect of one factor at a time while keeping other factors constant. Although many mechanistic models for Sn whispering have been proposed in the past, the experimental evidences to support them are lacking. For example, recrystallization of whisker grain was proposed by various researchers; however, a direct observation confirming whisker grain is indeed a recrystallized grain has never been reported. Nevertheless, it is well understood that whisker growth is a form of stress relaxation process and diffusion plays important role in the formation of whiskers. Since Sn is extremely anisotropic with tetragonal crystal structure, the stress state of Sn coatings, as well as the diffusion needed for mass transport of atoms, varies drastically depending upon the direction of interest. Therefore, it is important to study the role of crystallographic texture (both macroscopic and microscopic) on whisker propensity by systematically varying the crystallographic texture of Sn coating while keeping thickness, grain size, substrate material, and post-deposition storage conditions the same. Better understanding of role of macro- and micro- texture is very crucial before any whispering mechanism can be proposed. Furthermore, recent studies indicate that role of stresses in Sn coatings driving whisker growth is not fully understood. It is generally accepted that compressive stress in Sn coating is the main factor that drives the whisker growth. However, whiskers were also observed when Sn coating was under tensile stress, making the role of stress controversial. Again, the stresses in Sn have multiple origins and need a systematic approach to understand their origin, quantify them and then relate it to whisker growth. Such systematic approach was never adopted in previous works. Hence, the current thesis aims to address the role of macro- and micro- crystallographic texture, stress regeneration mechanism, nature (i.e., magnitude and sign) of stress and stress gradient in the Sn coatings via systematic variation of texture, post-deposition storage conditions and substrate composition, including deposition of an interlayer in between Sn coating and the brass or Cu substrate. Whisker growth was studied from electro-deposited Sn coatings. The deposition parameters were optimized for producing different thickness and grain orientations. X-Ray diffraction (XRD) techniques were used to extract macro-texture of the coatings. The macro-texture measurement using XRD and micro-texture measurement using electron backscatter diffraction (EBSD) showed the same dominant and the second dominant orientations. It was observed that current density and deposition temperature, which are the two main electro-deposition parameters, significantly influence the crystallographic orientation of the grains. Thus, the global or macro-texture can be manipulated by changing the deposition parameters systematically. It was observed that whisker propensity increases drastically by growth of low index planes, such as (100) and (110), during deposition. Hence, proper selection of deposition parameters that lead to growth of high index planes can be used to suppress the whisker growth. Furthermore, micro-texture surrounding whisker grain was studied using EBSD technique by observing the same set of grains surrounding a whisker grain before and after whispering. Orientation imaging microscopy (OIM) maps of several whisker regions clearly indicate that whiskers preferentially grow from low index planes, such as (100), etc. Furthermore, using orientation dependent stiffness mapping (in-plane and out-of-plane), it was noticed that whiskers preferentially grew from regions of soft oriented grains (low modulus) surrounded by hard orientations. In addition, grain boundary disorientation analysis revealed presence of high fraction of high angle grain boundaries (HAGBs) in the vicinity of whisker grain. It was observed that overall fraction of HAGBs in the whispering region was 0.7 while the fraction of HAGBs surrounding and leading to whisker grain was 0.85. In addition, it was observed that whisker grew from pre-existing grain and not from the recrystallized grain. Also, grain boundary sliding was not observed as a pre-requisite for whisker growth in Sn coatings on brass substrate. The local stress field around the whisker grain also plays a crucial role in whisker growth. Therefore, local stress field around whisker site was simulated using crystal plasticity simulation by incorporating grid resolved spatial description of orientation in terms of Euler’s angles. The crystal plasticity model included slip systems of Sn and other material parameters, such as anisotropic elastic stiffness constants, critical resolved shear stresses for different slip systems, etc. Thus, the slip in individual grain was accounted following homogenization to maintain compatibility at grain boundaries. The simulated stress field shows that both in-plane and out-of-plane stresses were highly inhomogeneous without any unique condition around whisker grain. It has been observed that high compressive hydrostatic stresses develop in the vicinity of the whisker grain, while whisker grain is slightly tensile. Therefore, the gradient of hydrostatic stress around the whisker suggests whisker growth is mainly controlled by vacancy transport phenomenon. The stress in Sn coatings may originate from many factors, such as residual stress inherent to electro-deposition, diffusion of substrate atoms (Cu, Zn, etc.) into the coating, formation of interfacial intermetallic compound (IMC) layer, segregation of impurities at Sn grain boundaries, formation of surface oxide layer, and coefficient of thermal expansion (CTE) mismatch between in Sn and substrate as well as between differently orientated grains of Sn. Therefore, it is important to understand the dominant stress regeneration mechanism responsible for whisker growth. To identify dominant mechanism, which can continuously regenerate the compressive stress in Sn, samples deposited under fixed electro-deposition conditions were exposed to different post-deposition storage conditions, such as isothermal aging at room temperature, 50 °C, 150 °C, and thermal cycling from -25 to 85 °C with and without hold time at the highest temperature. It has been observed that Cu6Sn5 IMC growth due to the inter-diffusion of Cu and Sn atoms is the dominant mechanism responsible for whisker growth. Both growth kinetics and morphology of IMC have a significant impact on whisker growth. The role of CTE mismatch in regenerating compressive stresses in Sn coatings on brass substrate for whisker growth is highly limited. The substrate composition as well as the under layer metallization affects the inter-diffusion between Sn and the substrate atoms and therefore IMC growth, which is mainly responsible for whisker growth in Sn coatings on brass or Cu substrates. The effects of substrate composition on whisker growth was studied by using pure Cu, brass (65 wt. % Cu 35 wt. % Zn) and Ni (bulk and electro-deposited under layer) as substrate. Whisker growth was more rapid if brass substrate was used instead of pure Cu. Whiskers were not observed when Sn was deposited on either bulk Ni or when Ni under layer was electro-deposited on brass or Cu substrates prior to Sn deposition. Ni under layer effectively stops the diffusion of Cu into Sn, thus avoiding the growth of Cu6Sn5 (which places Sn coatings under compressive stress). Thus, it is clear that continuous formation of Cu6Sn5 at the interface provides the long-term driving force for whisker growth. Since the whisker growth is a stress driven phenomenon, it is important to understand the stress evolution in Sn coatings. Stress state of the Sn coatings was studied using custom-built laser curvature set-up with multi-beam optical stress sensor (MOSS). This allowed monitoring of curvature change of the coating-substrate system in real time and the bulk average stress was calculated using Stoney’s equation. For multi-layer system such as Sn deposited on pre-deposited Ni under layer on brass substrate modified Stoney’s equation was used. In case of Sn deposited on brass without any under layer, it is known that the Cu6Sn5 IMC do not form a continuous layer at the interface between Sn and substrate under aging at ambient conditions, therefore, the curvature change due to IMC can be neglected. In addition, glancing angle X-ray diffraction was employed to analyse stress in the top surface region of the coating. The variation of glancing angle allowed probing strain at different penetration depths. Both the bulk stress and the stress in only near surface region evolve with time. The residual bulk stresses in Sn coatings are tensile immediately after deposition. The residual stresses relax very quickly upon room temperature aging and become compressive. The bulk of Sn coatings on brass substrate progressively become more compressive upon continued aging. However, stresses in Sn coatings deposited on brass substrate with Ni under layer saturate quickly at low compressive stress. Surprisingly, stress in the top-most region of Sn coating measured using XRD evolve differently. The surface of Sn coating deposited on brass substrate is compressive initially and progressively become more tensile (less compressive), while the initial compressive stress in the sample with Ni under layer saturated at a higher compressive stress than the bulk stress value recorded from curvature measurement. Therefore, the surface of the Sn coatings with Ni under layer is always more compressive than the bulk stress in the Sn coating. Therefore, a negative stress gradient for the diffusion of Sn atoms towards surface is never established and whiskers do not grow in these Sn coatings. Interestingly, through thickness voids are observed in the Sn coatings on Ni. Contrarily, in Sn coatings without Ni under layer after 170 h of aging, the surface stress becomes more tensile than the bulk of the Sn coating, favouring continuous migration of atoms from the highly compressed region near Cu6Sn5 IMC layer to the stress-free whisker root. Aforementioned observation indicates the crucial role of negative stress gradient in the mass transport of atoms required for whispering. The importance of stress and stress gradient was further studied by analysing the effect of externally imposing stress and stress gradient on whisker growth. The stresses were applied using a three-point bend setup. It has been observed that externally applied stress accelerates the whisker growth. This is mainly because applied stress alters the diffusion kinetics and growth of Cu6Sn5 IMC at the interface. However, the coating under tensile stress shows more whisker growth as compared to the coating under high compressive stress. This is attributed to the fact the coating under tensile stress is under higher negative stress gradient. Therefore, it is proposed that out-of-plane stress gradient is more important rather than the sign and the magnitude of stress in determining the propensity of whisker growth in Sn coatings.

Cette thèse a pour but d'étudier une nouvelle décharge nanoseconde pulsée à barrière diélectrique basée sur 3 électrodes (SL-DBD pour « SLiding DBD » en anglais), de la comparer à la décharge nanoseconde conventionnelle utilisant 2 électrodes (NS-DBD), et d'évaluer sa capacité à être utilisée soit comme capteur de vitesse pariétale, soit comme actionneur électromécanique pour le contrôle d'écoulement. Dans la première partie, les propriétés électriques des deux décharges sont caractérisées, permettant ainsi d'identifier le paramètre électrique clé qui permet de passer d'un régime de décharge à un autre. Des visualisations par caméra intensifiée ont confirmé cette transition lorsque le champ électrique moyen devient supérieur à 6.5 kV/cm. Des diagnostiques mécaniques (Schlieren et mesures de pression) ont permis de caractériser précisément l'onde de pression générée par les deux décharges.Ensuite, l'influence d'un écoulement sur le comportement électrique de la SL-DBD a été étudiée, mettant en évidence que le courant « collecté » par l'électrode (3) était à peu près proportionnel à la vitesse de l'écoulement en proche paroi. Même s'il reste encore de nombreux points à vérifier, ce résultat encourageant permet d'envisager l'utilisation de la SL-DBD comme capteur de vitesse et/ou de frottement pariétal.Enfin, la troisième partie est consacrée à l'effet de la SL-DBD sur des écoulements aérodynamiques, dans le but de les manipuler. Plusieurs configurations ont été étudiées (profil d'aile, marche descendante, plaque plane) et les résultats ont permis de montrer la complexité des phénomènes physiques à l'origine du contrôle, sans pour autant pouvoir totalement les expliquer. / This thesis aims to study new design of nanosecond pulsed dielectric barrier discharge in 3 electrodes configuration: the sliding discharge (SL-DBD), to compare it to the conventional nanosecond DBD in 2 electrodes geometry (NS-DBD) and to show also its capacity to be used as a friction velocity or wall shear stress sensor and to be used as electromechanical actuator for flow control.In its first part, the electrical properties of these two discharges are characterized and point out the key parameter governing the transition of one regime to another. The visualizations with an intensified camera confirm this transition when the mean electric field increases over 6.5 kV/cm. Therefore they extend further and cover the inter-electrode gap. Mechanical diagnostics (Schlieren and pressure measurements) characterize the pressure wave generated by these discharges. In the second part, the electrical characterization of the SL-DBD under flow conditions shows that the courant « collected » by the third electrode is almost proportional to the wall flow velocity. However, even if other studies needed to be performed, these encouraging results reveal the ability of the SL-DBD to be used as a friction velocity or a wall shear stress sensor. Finally, the third part is addressed to the effect of the SL-DBD on aerodynamics flows in order to manipulate them. Several configurations are studied (airfoil, backward facing step, flat plate) and the results have shown the complexity of the physicals phenomena governing the control authority, without being able to fully explain them.