• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 1
  • Tagged with
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

A novel package technical for high power InGaN LED based on Si bench and Cu plating technologies

Huang, Hui-sheng 01 July 2010 (has links)
¡@¡@A high efficient packaging technique was proposed for power InGaN light emitting diodes( LEDs ).In this approach , sub-mounts based on Si bench technology were used to provide a fact heat conducting channel between the LEDs and the cases.Two different structures of the Si sub-mounts were used, namely, a conventional Si block and a Si block with a copper-filled V-groove. ¡@¡@The thermal resistance of the two different sub-mounts were measured and compared. For a 45mil power LED biased at 1W, thermal resistance of 12.77¢J/W and 18.79¢J/W were measured for the Si sub-mount and the Si sub-mount with copper-filled V-groove. We believe the better thermal resistance of the sub-mount with copper-filled V-groove is due to high thermal conductivity of the copper.

Page generated in 0.0265 seconds