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11	Novel materials for heat dissipation in semiconductor technologies Streb, Fabian 14 August 2018 (has links) Thermal management is a major bottleneck for the next-but-one generation of semiconductor devices, especially the performance of SiC and GaN devices is limited by heat dissipation. This thesis evaluates four new packaging concepts with regards to thermal management: Diamond based substrates, phase change materials, Cu-Graphene composite films and anisotropic heat dissipation. Anisotropic heat dissipation is shown to be the most auspicious concept. A metal-matrix composite baseplate for a high performance power module using annealed pyrolytic graphite is created and evaluated. The baseplate shows a locally increased heat dissipation compared to a plain metal baseplate by 30 %. Furthermore, the thermal contact between device (baseplate) and cooler is of high importance. A study of different characterization methods for thermal interface materials is performed and a new method for the quantification of the thermal contact conductance is presented. The study shows that a combination of several methods is necessary so that the complete picture of heat dissipation performance of thermal interface materials becomes apparent. The new developed method allows to select the perfect thermal grease for a given combination of device and cooler. / Wärmemanagement ist eine große Herausforderung sowohl für aktuelle als auch für zukünftige Halbleiterprodukte. Speziell die nächste Produktgeneration mit SiC oder GaN Chips benötigen neue Entwärmungskonzepte, um ihr volles Potential bezüglich höherer Stromstärken zu entfalten. In dieser Arbeit wurden vier neuartige Konzepte erforscht: Diamant basierte Substrate, Phasen-Wechsel-Materialien, Cu-Graphene Kompositschichten und anisotrope Entwärmung. Es zeigte sich, dass anisotrope Entwärmung das vielversprechendste Konzept ist. Als Demonstrator wurde eine Bodenplatte mit thermisch pyrolytischen Graphiteinleger für ein Leistungsmodul gefertigt. Sie zeigt eine lokale Erhöhung der Entwärmung von 30 %. Weiter ist der thermische Kontakt zwischen Bauteil und Kühler sehr wichtig. Verschiedene Charakterisierungsmethoden für thermische Schnittstellen-Materialien wurden verglichen. Dieser Vergleich zeigt, dass eine Kombination verschiedener Methoden notwendig ist, um ein vollständiges Bild über die Leistungsfähigkeit solcher Materialien zu gewinnen. Eine neue Messmethode wurde entwickelt, um die thermische Kontakt-Leitfähigkeit zu messen. Diese neue Methode ermöglicht es, die beste Wärmeleitpaste für eine vorgegebene Kombination aus Produkt und Kühleroberfläche zu identifizieren. info:eu-repo/classification/ddc/620 ddc:620 Verbund; Halbleiter; Kühlung
12	Cooling of electrically insulated high voltage electrodes down to 30 mK / Kühlung von elektrisch isolierten Hochspannungselektroden bis 30 mK Eisel, Thomas 07 November 2011 (has links) (PDF) The Antimatter Experiment: Gravity, Interferometry, Spectroscopy (AEGIS) at the European Organization for Nuclear Research (CERN) is an experiment investigating the influence of earth’s gravitational force upon antimatter. To perform precise measurements the antimatter needs to be cooled to a temperature of 100 mK. This will be done in a Penning trap, formed by several electrodes, which are charged with several kV and have to be individually electrically insulated. The trap is thermally linked to a mixing chamber of a 3He-4He dilution refrigerator. Two link designs are examined, the Rod design and the Sandwich design. The Rod design electrically connects a single electrode with a heat exchanger, immersed in the helium of the mixing chamber, by a copper pin. An alumina ring and the helium electrically insulate the Rod design. The Sandwich uses an electrically insulating sapphire plate sandwiched between the electrode and the mixing chamber. Indium layers on the sapphire plate are applied to improve the thermal contact. Four differently prepared test Sandwiches are investigated. They differ in the sapphire surface roughness and in the application method of the indium layers. Measurements with static and sinusoidal heat loads are performed to uncover the behavior of the thermal boundary resistances. The thermal total resistance of the best Sandwich shows a temperature dependency of T-2,64 and is significantly lower, with roughly 30 cm2K4/W at 50 mK, than experimental data found in the literature. The estimated thermal boundary resistance between indium and sapphire agrees very well with the value of the acoustic mismatch theory at low temperatures. In both designs, homemade heat exchangers are integrated to transfer the heat to the cold helium. These heat exchangers are based on sintered structures to increase the heat transferring surface and to overcome the significant influence of the thermal resistance (Kapitza resistance). The heat exchangers are optimized concerning the adherence of the sinter to the substrate and its sinter height, e.g. its thermal penetration length. Ruthenium oxide metallic resistors (RuO2) are used as temperature sensors for the investigations. They consist of various materials, which affect the reproducibility. The sensor conditioning and the resulting good reproducibility is discussed as well. cooling dilution refrigerator millikelvin high voltage electrical insulation thermal contact conductance thermal boundary resistance sapphire indium acoustic mismatch sintered heat exchanger sinter height thermal penetration length Kapitza resistance RuO2 sensor ruthenium oxide temperature sensor thermal cycling sensor conditioning micro cracks Kühlung Mischungskryostat Millikelvin Hochspannung elektrische Isolierung Thermischer Kontaktwiderstand Saphir Indium Acoustic Mismatch Theorie gesinterte Wärmeübertrager Sinterhöhe thermische Eindringtiefe Kapitza Widerstand RuO2-Sensor Ruthenium Oxid Temperatursensor thermisches Zyklieren Sensor-Konditionierung Mikrorisse ddc:620 rvk:UB 5180
13	Experimentální ověření pasivních prvků tepelné regulace družic / Experimental study on satellite´s passive thermal-regulation units Mateášik, Timko Marek January 2021 (has links) Diplomová práca sa zaoberá vplyvom termálnych medzivrstiev na tepelnú kontaktnú vodi- vosť a tepelný kontaktný odpor. Práca sa zameriava na aplikáciu termálnych medzivrstiev pre vylepšenie tepelnej kontaktnej vodivosti v tepelnom spínači a v kozmických zariade- niach obecne. Teoretická časť práce stručne skúma rôzne pasívne termálne kontrolné systémy použí- vane v kozmických zariadeniach, vrátane termálnych medzivrstiev, a vysvetľuje pozadie tejto práce. Táto práca ďalej skúma rôzne termálne medzivrstvy, predovšetkým povlaky a fólie, a uvádza výber vhodnej termálnej medzivrstvy. Experimentálna časť práce skúma povrchové parametre, tepelnú vodivosť a mikrotvr-dosť medených vzoriek, ktoré slúžia ako substrát pre povlak čistého striebra. Ďalej rieši podmienky merania, metódy vyhodnocovania a samotné experimentálne merania. Experimentálne merania sú vykonané v termo-vákuovej testovacej komore a na základe výsledkov sú vyvodené závery. Pre ďalšiu prácu sú uvedené doporučenia.
14	Cooling of electrically insulated high voltage electrodes down to 30 mK Eisel, Thomas 04 October 2011 (has links) The Antimatter Experiment: Gravity, Interferometry, Spectroscopy (AEGIS) at the European Organization for Nuclear Research (CERN) is an experiment investigating the influence of earth’s gravitational force upon antimatter. To perform precise measurements the antimatter needs to be cooled to a temperature of 100 mK. This will be done in a Penning trap, formed by several electrodes, which are charged with several kV and have to be individually electrically insulated. The trap is thermally linked to a mixing chamber of a 3He-4He dilution refrigerator. Two link designs are examined, the Rod design and the Sandwich design. The Rod design electrically connects a single electrode with a heat exchanger, immersed in the helium of the mixing chamber, by a copper pin. An alumina ring and the helium electrically insulate the Rod design. The Sandwich uses an electrically insulating sapphire plate sandwiched between the electrode and the mixing chamber. Indium layers on the sapphire plate are applied to improve the thermal contact. Four differently prepared test Sandwiches are investigated. They differ in the sapphire surface roughness and in the application method of the indium layers. Measurements with static and sinusoidal heat loads are performed to uncover the behavior of the thermal boundary resistances. The thermal total resistance of the best Sandwich shows a temperature dependency of T-2,64 and is significantly lower, with roughly 30 cm2K4/W at 50 mK, than experimental data found in the literature. The estimated thermal boundary resistance between indium and sapphire agrees very well with the value of the acoustic mismatch theory at low temperatures. In both designs, homemade heat exchangers are integrated to transfer the heat to the cold helium. These heat exchangers are based on sintered structures to increase the heat transferring surface and to overcome the significant influence of the thermal resistance (Kapitza resistance). The heat exchangers are optimized concerning the adherence of the sinter to the substrate and its sinter height, e.g. its thermal penetration length. Ruthenium oxide metallic resistors (RuO2) are used as temperature sensors for the investigations. They consist of various materials, which affect the reproducibility. The sensor conditioning and the resulting good reproducibility is discussed as well. info:eu-repo/classification/ddc/620 ddc:620

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