Spacecraft testing includes acoustics, vibrations, and thermal vacuum. Cal Poly’s Space Environments Lab is equipped with multiple vacuum chambers, but no thermal vacuum chamber. The purpose of this thesis is to incorporate an ATS Chiller system with the HVEC vacuum chamber so students are able to experiment with a thermal vacuum chamber. The ATS Chiller had leaky pipes that needed to be refurbished and a shroud was implemented to improve thermal capabilities of the system. The full system was able to reach temperatures as low as -38ºC and as high as 58ºC at a pressure of 10-6 Torr. The ATS Chiller was able to absorb up to 500W of heat dissipation from a component mounted to the platen inside of the vacuum chamber. Thermal modeling of the apparatus was performed in Thermal Desktop. The model was incorporated with the test data to extract interface resistance information between connected surfaces. Another model is used to analyze a theoretical component inside the apparatus to evaluate mounting methods and determine theoretical temperatures of the component. The model adjusts for material properties, including thermal conductivity and emissivity to accurately simulate testing conditions within +/- 3ºC. Platen and shroud adjustments were able to accommodate a peak bake out temperature of 130±2.2℃ of any component without damage to the system. Three temperature cycles were performed by the thermal vacuum chamber to reach extreme temperatures of 58℃ and -38. A 300 Watt heater was used to simulate component heat dissipation for the duration of the test. Furthermore, this thesis lays out further possibilities for thermal testing using the HVEC Vacuum chamber and ATS chiller as a thermal vacuum chamber.

L'électronique de puissance et particulièrement les systèmes de conversions deviennent un enjeu majeur de la transition énergétique et de l'avenir des transports. Les contraintes technico-économiques liées aux nouvelles applications impliquent une augmentation des densités de puissance au sein des modules tout en limitant leur coût et en conservant une robustesse satisfaisante. Aujourd'hui, des solutions semblent émerger grâce à des structures innovantes associées aux composants grands gap et à l'intégration tridimensionnelle. Ces solutions apportent cependant un certain nombre de contraintes liées aux interconnexions électrothermomécaniques (ETM). L'augmentation des niveaux de température permis par les composants grands gap et l'attrait du refroidissement double face offert par les assemblages 3D augmentent de manière importante les contraintes thermomécaniques et causent des problèmes de fiabilité. C'est pourquoi de nouvelles interconnexions ETM sont développées pour s'adapter aux nouvelles contraintes et rendre possible ce saut technologique. Cependant les outils permettant la caractérisation thermique et électrique de ces nouvelles interconnexions restent à développer. Les travaux présentés dans ce mémoire se portent sur le développement et la mise au point d'outils de caractérisation des interconnexions dans des assemblages 3D. La difficulté d'obtenir la température du composant au sein du boîtier nous a poussé à explorer deux voies permettant d'estimer la température de jonction (TJ). Premièrement par l'implantation de capteurs de température et de tension au coeur d'un composant de puissance grâce la réalisation d'une puce de test spécifique. Et deuxièmement, par l'observation de la réponse en température de composants fonctionnels faisant appel à l'utilisation d'un paramètre électrique thermosensible (PTS) du composant. Les deux pistes explorées mettent à profit des solutions spécifiques innovantes pour permettre des caractérisations thermique et électrique fines des assemblages d'électronique de puissance. / Power electronic and particularly conversion systems are becoming a major challenge for the future of energetic and transport systems. Technical and economic constraints related to new applications lead to an increase of module power densities while reducing cost and maintaining a good robustness. Today, solutions seem to emerge from innovative structures associated to wide band-gap semiconductors and three-dimensional integration. These solutions lead to many constraints in electro-thermo-mechanical (ETM) interconnection field. Temperature level rises allowed by wide band-gap semiconductors and attractiveness of double sided cooling provide by the 3D assemblies have significantly increase thermo-mechanical stresses and cause reliability problems. This is why new ETM interconnections are developed to facing those difficulties and enable this technological gap. However, thermal and electrical interconnections characterization tools need to be develop. Works presented in this thesis focuses on the development of tools for new interconnections characterization adapted to 3D package. The difficulty of obtaining the temperature of the component within the package has led us to explore two ways to estimate the junction temperature (TJ). In a first hand we integrate temperature and voltage sensors inside a power component in a clean room process thanks to the achievement of a specific thermal test chip (TTC). And in a second hand, by observing the temperature response of functional components, using a temperature-sensitive electrical parameter (TSEP). The both paths explored take advantage of innovative specific solutions to allow precise thermal and electrical characterization of power electronic assemblies.