Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.

Methods of noise coupling in high speed thick film circuits has been investigated. Parasitic coupling parameters have been experimentally determined for a variety of single and multilayer thick film layouts. In addition, the severity of the problem has been studied by measuring coupled noise induced on carefully constructed test cards. Curves are presented as an aid for predicting noise levels as a function of conductor spacing and signal edge speed. The measurements are discussed quantitatively and guidelines for the design of high speed thick film circuits are summarized.

No description available.

A técnica de análises PIXE (Particle Induced X-ray Emission) de alvos finos é rotineiramente usado no Instituto de Física da Universidade de São Paulo (USP) pelo Lamfi (Laboratório de Materiais e Feixes Iônicos) em análises quantitativas elementares. A calibração do arranjo experimental do Lamfi é realizada através da irradiação de filmes finos padrões evaporados, sendo o rendimento de produção de raios X ajustado a partir deprimeiros princípios. Em análises PIXE de alvos espessos (TTPIXE), a composição daparticular amostra introduz efeitos de perda de energia das partículas incidentes e autoabsorção dos raios X produzidos. Estes efeitos são inexistentes na análise PIXE de alvosfinos. Paradoxalmente há a necessidade de se conhecer a composição da amostra, paracomputar estes efeitos, numa análise elementar quantitativa de alvos espessos. Este trabalhopropõe a diluição de amostras sólidas numa matriz conhecida onde as características de perda de energia das partículas incidentes e auto absorção da radiação produzida estejam caracterizadas (exemplo: ácido bórico, grafite) e supostamente não sofram alterações devido à introdução da amostra (diluição). Para o cálculo do rendimento de produção de raios X em análises TTPIXE é proposto um fator de correção para alvos espessos, dependente exclusivamente da matriz diluidora, aplicado ao rendimento de produção de raios X de alvos finos. Este procedimento viabiliza a utilização da curva de resposta para análises de alvos finos, já calibrada, do arranjo. Utilizando os modelos mais aceitos para o poder de freamento para prótons incidentes, seções de choque de produção de raios X e coeficientes de absorção de radiação pela matéria, o software (Clara) foi desenvolvido para o cálculo do rendimento de produção de raios X em alvos espessos, bem como os fatores de correção para dado raio X e determinada matriz. Alvos espessos foram confeccionados a partir de amostra padrão de referência (SRM-IAEA356 Marine sediment) para verificar os valores calculados pelo Clara e da metodologia de análise proposta. Os valores experimentais encontram-se em concordância com os valores certificados para um coeficiente de intervalo de confiança de 95% considerando o novo limite de detecção imposto pela diluição. Um roteiro para preparação de alvos espessos a partir de amostras sólidas, bem como a descrição do arranjo experimental, estão inclusos. / Thin film PIXE (Particle Induced X-ray Emission) analysis is been routinely used in the Institute of Physics of the University of Sao Paulo (USP) for quantitative analysis of materials. The X-ray production yield of the PIXE-SP setup is calibrated with monoelementary evaporated thin film standards, and fitted with a first principles yield function. However, in thick target PIXE (TTPIXE) analysis, the particular sample composition needs to be known in advance to calculate the stopping power and the X-ray absorption coefficients. In this work, a matrix standardization is proposed, in which a powdered solid sample is diluted in a known light element matrix (like graphite, boric acid, etc.) whose energy loss and selfabsorption are known and supposed almost unchanged. Furthermore, a scheme is proposed where elementary TTPIXE yields are calculated applying a pre-determined thick target correction factor to the thin target PIXE yields. This procedure enables the use of the already calibrated thin film X-ray yields also for thick target analysis. Using the most accepted stopping power model, ionization cross-sections and X-ray attenuation coefficients, a software (Clara) was developed to calculate the elementary TTPIXE X-ray yields and the corresponding thick target correction factors, for a given and pre-determined matrix. The program also allows testing the addition of any contaminant to the primary matrix and to compute the corresponding change in the thick target PIXE X-ray yields. This option was used to calculate the effect of increasing sample mass in the light element matrix, on the calculated yields, the effect of small changes in target composition, and the quantitative limitations of the proposed scheme. Thick test targets were prepared with a standard reference material (SRM-IAEA356 Marine sediment) and used to verify the accuracy of Clara and of the proposed scheme. The experimental values of the sample composition agreed with the certified values for 95% confidence interval coefficient to the new detection limit imposed by dilution. A protocol for target preparation of solid samples using this technique as well as the description of the experimental setup, are included.

In the last decade, reliability problems have become a critical subject in power modules. Understanding design weakness and failure mechanisms of thick wire bond are two critical steps in managing the risk of wire bond heel crack which is the topic of this thesis. Although this thesis does not target a specific type of power modules, we note that thick wire bond heel crack failures occur in Insulated Gate Bipolar Transistors (IGBTs). In fact, our aim is to understand failure mechanism in 300μm thick wire bonds with different geometries and materials. Since these wires experience harsh environmental conditions and high load transients, the wires undergo repetitive flexural movement which causes heel crack due to fatigue. For the purpose of understanding this failure mechanism, two experimental setups are built and utilized. The first experimental setup loads the wires using constant currents and observes the response using a scanning laser vibrometer to measure the displacement. The second experimental setup applies repetitive prescribed displacement to the first foot of the wire and detects fatigue failure using a Wheatstone bridge. It is realized that wires have different displacement property depending on their geometry and material. Maximum displacements are observed for Al-H11 instead of CuCorAl and PowerCu.

In this paper we examine continuous functions which on the surface seem to defy well-known mathematical principles. Before describing these functions, we introduce the Baire Category theorem and the Cantor set, which are critical in describing some of the functions and counterexamples. We then describe generic continuous functions, which are nowhere differentiable and monotone on no interval, and we include an example of such a function. We then construct a more conceptually challenging function, one which is everywhere differentiable but monotone on no interval. We also examine the Cantor function, a nonconstant continuous function with a zero derivative almost everywhere. The final section deals with products of derivatives.

In the last decade, reliability problems have become a critical subject in power modules. Understanding design weakness and failure mechanisms of thick wire bond are two critical steps in managing the risk of wire bond heel crack which is the topic of this thesis. Although this thesis does not target a specific type of power modules, we note that thick wire bond heel crack failures occur in Insulated Gate Bipolar Transistors (IGBTs). In fact, our aim is to understand failure mechanism in 300μm thick wire bonds with different geometries and materials. Since these wires experience harsh environmental conditions and high load transients, the wires undergo repetitive flexural movement which causes heel crack due to fatigue. For the purpose of understanding this failure mechanism, two experimental setups are built and utilized. The first experimental setup loads the wires using constant currents and observes the response using a scanning laser vibrometer to measure the displacement. The second experimental setup applies repetitive prescribed displacement to the first foot of the wire and detects fatigue failure using a Wheatstone bridge. It is realized that wires have different displacement property depending on their geometry and material. Maximum displacements are observed for Al-H11 instead of CuCorAl and PowerCu.

Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1990. / Vita. Abstract. Includes bibliographical references (leaves 77-81). Also available via the Internet.

Thesis (M.Sc.)--University of Adelaide, Dept. of Environmental Biology, 2002. / Includes bibliographical references (leaves 150-161).

Thesis (Ph.D.)--Drexel University, 2008. / Includes abstract and vita. Includes bibliographical references (leaves 132-139).