The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

The interaction of radiation with integrated circuits can provoke transient faults due to the deposit of charge in sensitive nodes of transistors. Because of the decrease the size in the process technology, charge sharing between transistors placed close to each other has been more and more observed. This phenomenon can lead to multiple transient faults. Therefore, it is important to analyze the effect of multiple transient faults in integrated circuits and investigate mitigation techniques able to cope with multiple faults. This work investigates the effect known as single-event-induced charge sharing in integrated circuits. Two main techniques are analyzed to cope with this effect. First, a placement constraint methodology is proposed. This technique uses placement constraints in standard cell based circuits. The objective is to achieve a layout for which the Soft-Error Rate (SER) due charge shared at adjacent cell is reduced. A set of fault injection was performed and the results show that the SER can be minimized due to single-event-induced charge sharing in according to the layout structure. Results show that by using placement constraint, it is possible to reduce the error rate from 12.85% to 10.63% due double faults. Second, Triple Modular Redundancy (TMR) schemes with different levels of granularities limited by majority voters are analyzed under multiple faults. The TMR versions are implemented using a standard design flow based on a traditional commercial standard cell library. An extensive fault injection campaign is then performed in order to verify the softerror rate due to single-event-induced charge sharing in multiple nodes. Results show that the proposed methodology becomes crucial to find the best trade-off in area, performance and soft-error rate when TMR designs are considered under multiple upsets. Results have been evaluated in a case-study circuit Advanced Encryption Standard (AES), synthesized to 90nm Application Specific Integrated Circuit (ASIC) library, and they show that combining the two techniques, the error rate resulted from multiple faults can be minimized or masked. By using TMR with different granularities and placement constraint methodology, it is possible to reduce the error rate from 11.06% to 0.00% for double faults. A detailed study of triple, four and five multiple faults combining both techniques are also described. We also tested the TMR with different granularities in SRAM-based FPGA platform. Results show that the versions with a fine grain scheme (FGTMR) were more effectiveness in masking multiple faults, similarly to results observed in the ASICs. In summary, the main contribution of this master thesis is the investigation of charge sharing effects in ASICs and the use of a combination of techniques based on TMR redundancy and placement to improve the tolerance under multiple faults.

Partial circuit replication is a soft error mitigation technique that uses redundant copies of a circuit to mask or detect the effects of soft errors. By masking or detecting the effect of soft errors on SRAM-based FPGAs, implemented circuits can be made more reliable. The technique is applied selectively, to only a portion of the components within a circuit. Partial application lowers the cost of implementation. The objective of partial circuit replication is to provide maximal benefit at limited or minimized cost. The greatest challenge of partial circuit replication is selecting which components within a circuit to replicate. This dissertation advances the state of the art in the effective use of partial circuit replication for masking and detecting soft errors in SRAM-based FPGAs. It provides a theoretical foundation in which the expected benefits and challenges of partial circuit replication can be understood. It proposes several new selection approaches for identifying the most beneficial areas of a circuit to replicate. These approaches are applied to two complex FPGA-based computer networking systems and another FPGA design. The effectiveness of the selection approaches are evaluated through fault injection and accelerated radiation testing. More benefit than expected is obtained through partial circuit replication when applied to critical components and sub-regions of the designs. In one example, in an open-source computer networking design, partial circuit replication masks and detects approximately 70% of failures while replicating only 5% of circuit components, a benefit-cost ratio of 14.0.

Triple Modular Redundancy (TMR) is a common reliability technique for mitigating single event upsets (SEUs) in FPGA designs operating in radiation environments. For FPGA systems that employ configuration scrubbing, majority voters are needed in all feedback paths to ensure proper synchronization between the TMR replicates. Synchronization voters, however, consume additional resources and impact system timing. This work introduces and contrasts seven algorithms for inserting synchronization voters while automatically performing TMR. The area cost and timing impact of each algorithm on a number of circuit benchmarks is reported. The work demonstrates that one of the algorithms provides the best overall timing performance results with an average 8.5% increase in critical path length over a triplicated design without voters and a 29.6% area increase. Another algorithm provides far better area results (an average 3.4% area increase over a triplicated design without voters) at a slightly higher timing cost (an average 14.9% increase in critical path length over a triplicated design without voters). In addition, this work demonstrates that restricting synchronization voter locations to flip-flop output nets is an effective heuristic for minimizing the timing performance impact of synchronization voter insertion.

Semiconductor manufacturing defects adversely affect yield and reliability. Manufacturers expend vast resources to reduce defects within their processes. As the minimum feature size get smaller, defects become increasingly difficult to prevent. Defects can change the behavior of a logic circuit resulting in a fault. Manufacturers and designers may improve yield, reliability, and profitability by using design techniques that make products robust even in the presence of faults. Triple modular redundancy (TMR) is a fault tolerant technique commonly used to mask faults using voting outcomes from three processing elements (PE). TMR is effective at masking errors as long as no more than a single processing element is faulty. Time distributed voting (TDV) is proposed as an active fault tolerant technique. TDV addresses the shortcomings of triple modular redundancy (TMR) in the presence of multiple faulty processing elements. A faulty PE may not be incorrect 100% of the time. When a faulty element generates correct results, a majority is formed with the healthy PE. TDV observes voting outcomes over time to make a statistical decision whether a PE is healthy or faulty. In simulation, fault coverage is extended to 98.6% of multiple faulty PE cases. As an active fault tolerant technique, TDV identifies faulty PE's so that actions may be taken to replace or disable them in the system. TDV may provide a positive impact to semiconductor manufacturers by improving yield and reliability even as fault frequency increases.

Radiation effects encountered in space or aviation environments can affect the configuration bits in Field Programmable Gate Arrays (FPGA) causing errors in FPGA output. One method of increasing FPGA reliability in radiation environments includes adding redundant logic to mask errors and allow time for repair. Despite the redundancy added with triple modular redundancy (TMR) and configuration scrubbing there exist some configuration bits that individually affect multiple TMR domains causing errors in FPGA output. A new tool called DeBit is introduced that identifies hardware resources associated with a single bit failure. This tool identifies a novel failure mode involving global routing resources and the failure mode is verified through a series of directed tests on global routing resources. Lastly, a mitigation strategy is proposed and tested on a single error in a triple modular redundancy (TMR) design.

Radiation effects encountered in space or aviation environments can affect the configuration bits in Field Programmable Gate Arrays (FPGA) causing errors in FPGA output. One method of increasing FPGA reliability in radiation environments includes adding redundant logic to mask errors and allow time for repair. Despite the redundancy added with triple modular redundancy (TMR) and configuration scrubbing there exist some configuration bits that individually affect multiple TMR domains causing errors in FPGA output. A new tool called DeBit is introduced that identifies hardware resources associated with a single bit failure. This tool identifies a novel failure mode involving global routing resources and the failure mode is verified through a series of directed tests on global routing resources. Lastly, a mitigation strategy is proposed and tested on a single error in a triple modular redundancy (TMR) design.

The test of digital integrated circuits compares the test pattern results for the device under test (DUT) to the expected test pattern results of a standard reference. The standard response is typically obtained from simulations. The test pattern and response are created and evaluated assuming ideal test conditions. The standard response is normally stored within automated test equipment (ATE). However the use of ATE is the major contributor to the test cost. This thesis explores an alternative strategy to the standard response. As an alternative to the stored standard response, the response is estimated by fault tolerant technique. The purpose of the fault tolerant technique is to eliminate the need of standard response and enable online/real-time testing. Fault tolerant techniques use redundancy and majority voting to estimate the standard response. Redundancy in the circuit leads to fault aliasing. Fault aliasing misleads the majority voter in estimating the standard response. The statistics and phenomenon of aliasing are analyzed for benchmark circuits. The impact of fault aliasing on test with respect to coverage, test escape and over-kill is analyzed. The results show that aliasing can be detected with additional test vectors and get 100% fault coverage.

Este trabalho aborda um sistema de aquisição de dados (SAD) analógico-digital, baseado em um esquema redundante com diversidade de projeto, que é testado em dois ambientes diferentes de radiação. O primeiro experimento considera um teste de dose total ionizante (Total Ioninzig Dose - TID) sob irradiação gama, e o segundo experimento considera os efeitos de eventos singulares (Single Event Effects - SEE) sob irradiação por íons pesados. O SAD é composto, principalmente, por três conversores analógicos-digitais (ADCs) e dois votadores. A técnica usada é a Redundância Modular Tripla (Triple Modular Redundancy - TMR), com implementação em diferentes níveis de diversidade (temporal e arquitetural). O sistema é construído em um System-on-Chip programável (PSoC 5LP) da Cypress Semiconductor, fabricado em tecnologia CMOS de 130nm. Para a irradiação com TID, se utiliza o PSoC de part number CY8CKIT-050 sob uma fonte de radiação gama de 60Co (cobalto-60), com uma taxa de dose efetiva de 1 krad(Si)/h por 10 dias, atingindo uma dose total de 242 krad(Si) Para SEE se utiliza o protótipo PSoC de part number CY8CKIT-059 (sem encapsulamento) em um acelerador de partículas 8UD Pelletron usando 16O (oxigeno-16) ao vácuo, com energia de 36 MeV em um LET aproximado de 5.5 MeV/mg/cm2 e uma penetração no silício de 25 mm, resultando em um fluxo de 354 p/cm2.s, e uma fluência de 5077915 p/cm2 depois de 14755 segundos (4h 09min). Observou-se com o resultado do primeiro estudo que um (1) dos módulos do sistema apresentou uma degradação significativa na sua linearidade durante a irradiação, enquanto os outros tiveram uma degradação menos grave, mantendo assim a funcionalidade e confiabilidade do sistema. Durante o tempo de irradiação do segundo estudo, foram observadas 139 falhas: 53 SEFIs (Single Events Funtional Interrupt), 29 falhas críticas e 57 falhas SDC (Silent Data Corruption), atingindo as diferentes copias do sistema e um dos votadores do mesmo, mas sempre mantendo a saída esperada. Nos dois experimentos se evidencia a vantagem de usar a diversidade de projeto, além do TMR, para melhorar a resiliência e confiabilidade em sistemas críticos redundantes que trabalham com sinais mistos. / This work presents an analog-to-digital data acquisition system (DAS) based on a redundant scheme with design diversity, being tested in two different radiation environments. The first experiment is a Total Ionizing Dose (TID) essay and the second one considers Single Event Effects (SEE) under heavy ion irradiation. The DAS is mainly composed of three analog-todigital converters (ADCs) and two voters. The used technique was the Triple Modular Redundancy (TMR) implementing different levels of diversity (temporal and architectural). The circuit was built in a programmable System-on-Chip (PSoC 5LP) from Cypress Semiconductor, fabricated in a 130nm CMOS technology process. For the irradiation with TID the part number CY8CKIT-050 PSoC was used under a 60Co (cobalt-60) gamma radiation source, with an effective dose rate of 1 krad(Si)/h during 10 days, reaching a total dose of 242 krad(Si). For SEE experiments the part number CY8CKIT-059 (without encapsulation) PSoC prototype under a 8UD Pelletron particle accelerator using 16O (oxigen-16) under vacuum, with an energy of 36 MeV, resulting in a flux of 354p/cm2.s and a fluence of 5077915p/cm2 after 14755 seconds (4h 09min). As result of the first study it was observed that one of the system’s modules presented a significant degradation in its linearity during the irradiation, while degradations in the other modules were not as deep, maintaining the system’s functionality and reliability. During the period of the radiation of the second study, 139 faults were observed, 82 of them were critical and 57 were SDC (Silent Data Corruption), reaching the different system copies and one of the voters, while always maintaining the correct output. The advantage of using diversity, besides TMR, to improve resilience and reliability in redundant systems working with mixed signals was demonstrated in both experiments.