<p> The properties and device applications of silicon thin films vacuum evaporated both onto single crystal silicon and onto silicon dioxide substrates have been investigated. </p> <p> The feasibility of obtaining device quality homoepitaxial silicon thin films by vacuum evaporation onto non heat-treated substrates having temperatures of 700°C has been demonstrated. A new technique, that of gas-doping, has been developed and has been shown to be capable of reproducibly introducing controlled concentrations of doping impurities in the range applicable to device fabrication into the deposited layers. The combined deposition-doping technique has been employed in the production of silicon layers containing impurity steps more abrupt than may be obtained by conventional fabrication techniques. </p> <p> The electrical properties of the vacuum evaporated homoepitaxial silicon layers have been shown to be comparable in most respects to those of bulk high purity single crystal silicon. The characteristics of rectifying and of varactor diodes prepared by the technique of vacuum evaporation combined with gas doping have been considered. </p> <p> Silicon films evaporated onto Si02 substrates have been shown to possess structures ranging from amorphous through randomly oriented polycrystalline to oriented polycrystalline as the substrate temperature is increased from 25°C to 850°C. The electrical characteristics of doped polycrystalline films obtained both by vacuum evaporation combined with gas doping and by the diffusion-annealing of amorphous films have been shown to be comparable with those reported for similar material deposited by chemical techniques. The experimentally observed properties of the disordered material have been qualitatively explained employing an inhomogeneous film model. The suitability of thin films of doped polycrystalline silicon on sio2 substrates for the production of high value resistors for monolithic integrated circuits has been considered. </p> / Thesis / Doctor of Philosophy (PhD)