Afin d'améliorer les performances électriques des circuits intégrés (densité d'intégration, vitesse et fiabilité), des matériaux à permittivité élevée sont introduits dans les composants passifs, notamment les capacités " Métal-Isolant-Métal " (MIM). De nombreux diélectriques, allant d'une permittivité moyenne (SixNy, Ta2O5, HfO2, ZrO2) à très élevée (les pérovskites SrTiO3 et BaTiO3) en passant par les alliages de plusieurs éléments (HfTiO, TiTaO ou Pb(ZrxTi1-x)O3) sont largement étudiés comme candidats prometteurs. Ces composants et ces matériaux ont pour vocation de fonctionner à des fréquences de plus en plus élevées, jusqu'à plusieurs gigahertz. La permittivité complexe Er (permittivité réelle E'r et pertes E''r) des diélectriques peut varier avec la fréquence : des phénomènes de relaxation et de résonance peuvent apparaître. La caractérisation de ces matériaux et l'évaluation des performances des composants intégrant ces diélectriques deviennent nécessaires sur une très large bande de fréquence. Ce travail de thèse a pour objectifs d'obtenir les caractéristiques électriques des diélectriques sur une très large bande de fréquences, du continu à plusieurs dizaines de gigahertz, en configuration in-situ, c'est-à-dire en films minces et avec les mêmes procédés d'intégration que dans le composant MIM final. Pour cela, un outil générique, allant du développement de la technologie nécessaire à la réalisation des structures de test et aux procédures d'extraction des propriétés à hautes fréquences, a été développé, validé grâce au SixNy puis appliqué à différents diélectriques : AlN [1], TiTaO [2], HfO2 et ZrO2 [3,4]. [1] T. Bertaud et al., Microelectron. Eng. 88, 564 (2011). [2] T. Bertaud et al., J. Appl. Phys. 110, 044110 (2011). [3] T. Bertaud et al., IEEE Electr. Device L. 31 (2), 114 (2010). [4] T. Bertaud et al., IEEE T. Compon. Pack. 2 (3), 502 (2012).

This thesis is about techniques for proving the functional correctness of Abstract Data Type (ADT) implementations. We provide a framework for proving the functional correctness of imperative language implementations of ADTs, using a theory of refinement. We develop a theory of refinement to reason about both declarative and imperative language implementations of ADTs. Our theory facilitates compositional reasoning about complex implementations that may use several layers of sub-ADTs. Based on our theory of refinement, we propose a methodology for proving the functional correctness of an existing imperative language implementation of an ADT. We propose a mechanizable translation from an abstract model in the Z language to an abstract implementation in VCC’s ghost language. Then we present a technique to carry out the refinement checks completely within the VCC tool. We apply our proposed methodology to prove the functional correctness of the scheduling-related functionality of FreeRTOS, a popular open-source real-time operating system. We focused on the scheduler-related functionality, found major deviations from the intended behavior, and did a machine-checked proof of the correctness of the fixed code. We also present an efficient way to phrase the refinement conditions in VCC, which considerably improves VCC’s performance. We evaluated this technique on a simplified version of FreeRTOS which we constructed for this verification exercise. Using our efficient approach, VCC always terminates and leads to a reduction of over 90% in the total time taken by a naive check, when evaluated on this case-study.

Metal-insulator-metal (MIM) capacitors are used for analog, RF, and DRAM applications in ICs. The International Technology Roadmap for Semiconductors (ITRS) specifies continuing increase in capacitance density (> 7 fF/ m2), lower leakage current density (< 10 8 A/cm2), very low effective oxide thickness (EOT < 1 nm, for DRAM applications), and better capacitance density-voltage (C-V) linearity ( < 100 ppm/V2, for analog/RF applications). In addition, the maximum fabrication/processing temper-ature should not be greater than 400 0C, in order to be compatible with the thermal budget of back-end fabrication steps. Low dielectric constants of conventional SiO2 and Si3N4 capacitors limit the capacitance densities of these devices. Although scaling down of dielectric thickness increases the capacitance density, it results in large leakage current density and poor C-V linearity. In this work, the effects of high-k materials (Eu2O3, Gd2O3, TiO2) on the device performance of MIM capacitors are studied. The performance of multi-dielectric stack, and doped-dielectric stack devices are also investigated. The effects of anneal temperature, anneal ambient, anneal mode, and dielectric thickness on device performance are evaluated. C-V, current density-voltage (J-V), and reliability measurements are performed to benchmark the electrical performance, and this is correlated to the structural and material properties of the films through ellipsometry, scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) measurements. High-performance MIM capacitors are fabricated by using (RF sputtered) Eu2O3 dielectric. The fabricated devices are subjected to different anneal conditions, to study their device performance. Forming gas (FG) and argon (Ar) annealed devices are shown to have higher capacitance densities (7 fF/ m2jF G), lower leakage current densities (3.2 10 8 A/cm2jAr at -1 V), and higher , compared to oxygen (O2) annealed de-vices ( 100kHz = 193 ppm/V2jO2). The electrical characterization results are correlated with the surface chemical states of the films through XPS measurements. The annealing ambient is shown to alter the surface chemical states, which, in turn, modulate the electrical characteristics. High-density MIM capacitors are fabricated by using (RF sputtered) Gd2O3, and Gd2O3-Eu2O3 stacked dielectrics. The fabricated Gd2O3 capacitors are also subjected to different anneal conditions, to study their device performance. Although Gd2O3 capacitors provide high capacitance density (15 fF/ m2), they suffer from high leakage current density, high , and poor reliability. Therefore, stacked dielectrics of Gd2O3 and Eu2O3 (Gd2O3/Eu2O3 and Eu2O3/Gd2O3) are fabricated to reduce leakage current density, improve , and improve reliability, with only a marginal reduction in capacitance density, compared to Gd2O3 capacitors. Density of defects and barrier/trap heights are extracted for the fabricated capacitors, and correlated with the device characteristics. High-performance MIM capacitors with bilayer dielectric stacks of (ALD-deposited) TiO2-ZrO2, and Si-doped ZrO2 are characterized. Devices with (ALD-deposited) TiO2/ ZrO2/TiO2 (TZT) and AlO-doped TZT stacks are also characterized. The influence of doping on the device performance is studied. The surface chemical states of the deposited films are analyzed by high-resolution XPS. The structural analysis of the samples is performed by XRD measurements, and this is correlated to the electrical characteristics of the devices. Reliability measurements are performed to study the effects of constant voltage and current stress on device performance. High capacitance density (> 45 fF/ m2), low leakage current density (< 5 10 8 A/cm2 at -1 V, for most devices), and sub-nm EOT are achieved. These parameters exceed the ITRS specifications for DRAM storage capacitors.