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Construction of an integrated down-converter for operation at 200 GHzDigby, John William January 1999 (has links)
No description available.
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Electromigration induced step instabilities on silicon surfacesGibbons, Brian J., January 2006 (has links)
Thesis (Ph. D.)--Ohio State University, 2006. / Title from first page of PDF file. Includes bibliographical references (p. 161-165).
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Advanced processing methods for microelectronics industry silicon wafer handling components /Wang, Hongyun, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 147-156). Available also in a digital version from Dissertation Abstracts.
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Analysis, design, and measurement of on-wafer transmission line test structures /Friar, Robert James, January 2000 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 177-181). Available also in a digital version from Dissertation Abstracts.
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Investigation of an in-situ method for determining the modulation transfer function and its applications in a microlithographic wafer stepper /Carlson, Steven D. January 1990 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1990. / Spine title: In-situ method for determining modulation transfer. Includes bibliographical references (leaves 56-60.).
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Hot electron induced degradation in VLSI MOS devicesZhao, Si Ping January 1993 (has links)
No description available.
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Clinical Outcomes and Economic Characteristics Regarding Inpatient Treatment of Brain Tumors with Implantable Wafers in the United StatesCulver, Mark, VandenBerg, Justin January 2012 (has links)
Class of 2012 Abstract / Specific Aims: This study was aimed to evaluate inpatient clinical treatment characteristics associated with the use of intracranial implantation of chemotherapeutic wafers for malignant brain neoplasms within United States, and assess inpatient mortality and total charges regarding treatment with wafer versus without.
Methods: A retrospective cohort investigation was conducted utilizing inpatient discharge records from the Agency for Healthcare Research and Quality (AHRQ) Healthcare Cost and Utilization Project (HCUP) Nationwide Inpatient Sample from 2005 to 2009. From this nationally- representative sample, 9,455 adults aged 18 years or older were identified with malignant neoplasms of the brain treated with implantable chemotherapeutic wafers. Outcomes of inpatient mortality and charges were assessed via multivariate regression analysis, controlling for patient characteristics, hospital structure, comorbidities, and clinical complications.
Main Results: The average age of patients with brain neoplasms was 56.6 (±16.5) years, and of those patients, 42.9% were female. The odds ratio for inpatient mortality of patients treated with implantable chemotherapeutic wafers was OR=0.380 (P<0.001), and patients that received wafer treatment had increased charges exp(b)=2.147 (P<0.001).
Conclusions: Multiple factors were associated with inpatient mortality and charges among the 247,829 patients that were diagnosed with malignant brain neoplasms from 2005-2009. With regards to these patients, implantable chemotherapeutic wafers were associated with increased inpatient survival and increased charges.
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Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxideWatts, Paul E. 12 November 2002 (has links)
A study of potentiostatic and galvanostatic electrochemical etching of
silicon in tetramethylammonium hydroxide (TMAH) has been carried out. In
TMAH baths,, we find that biased (100) silicon etch rates increase 21% over OCP
etch rates. For TMAH baths seasoned with silicon, biased silicon etch rates
increase to 63% over those at OCP. Electrochemical etching eliminates the
growth of hillocks on etching surfaces regardless of etchant pH, [TMAH] or silicon
loading, resulting in highly smooth etching surfaces. Potentiostatic and galvanic
etching yield similar etch rates and surface consistency. / Graduation date: 2003
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Non-invasive thermal profiling of silicon wafer surface during RTP using acoustic and signal processing techniques /Syed, Ahmed Rashid, January 2000 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 104-108). Available also in a digital version from Dissertation Abstracts.
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Study on the curing process of no-flow and wafer level underfill for flip-chip applicationsZhang, Zhuqing, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).
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