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The gluing of unseasoned wood, called green gluing, is a relatively new sawmill process, implying a radically changed order of material flow in the production of value-added wood-based products. It facilitates the enhancement of raw material recovery and value yield by integrating defect elimination and gluing already before kiln drying. The present study evaluates green glued adhesive bonds in flatwise glued beams and finger joints. The main part of this work deals with green gluing using a moisture curing polyurethane adhesive (PUR). Standardised test methods and specially designed, small scale, specimens were used for the determination of the strength, fracture energy and the ductility of both dry- and green glued bonds in tension and in shear. Using the small scale specimens it was possible to capture the complete stress versus deformation curves, including also their unloading part. An optical system for deformation measurement was used for the analysis of bond behaviour. The influence of moisture content during curing and temperature after curing on the adhesive chemical composition and on the mechanical properties was investigated. Furthermore, the moisture transport through the adhesive bond during curing was tested. Finally, microscopy studies were performed for analysis of bond morphology and fracture. The results show that two significant factors influence the shear strength of green glued bonds: wood density and adhesive spread rate. Bonds which fulfil the requirements according to EN 386 could be obtained within a wide range of process parameters. The small specimen tests showed that green glued PUR bonds can reach the same strength and fracture energy, both in shear and in tension, as dry glued bonds with the same adhesive amount. The local material properties of the bonds could be determined, thanks to the failure in the tests taking place within the adhesive bond itself and not in the wood. Following process factors were shown to cause lower bond strength: a) a low adhesive spread rate, b) high pressure and c) short pressing time in combination with low wood density and high moisture content. Moreover, the heat treatment of the cured PUR adhesive during drying influenced the chemical composition of the adhesive, providing for higher strength, stiffness and Tg of the adhesive, caused by an increased amount of highly ordered bidentate urea.

<p>QCR 20161026</p>

Low moisture veneer and regions of sapwood within hickory engineered wood flooring bonded with soy-flour adhesive are thought to be factors leading to potential performance deficiencies. The goal of this research was to gain a broader understanding of bonding low moisture hickory veneer with soy-based adhesive. Soyad® is of particular interest due to its novel cross-linking chemistry. Impacts of moisture content and wood region (heartwood versus sapwood) were analyzed with dry and wet shear bond strength tests, measurement of percent wood failure, lathe check characterization, and adhesive bondline thickness and penetration depth measurement. Impact of wood region and type (hickory versus red oak) was assessed by comparing wood buffering capacity and delamination following three-cycle water soaking. Dry and wet shear strength values met expectations for engineered wood flooring yet percentage wood failure results were uniformly very low for all combinations of moisture levels and wood regions. In contrast, delamination following wet and dry cycling was minor and within minimum requirements for all specimens tested. The influence of moisture level, wood region and type were inconsistent; statistically significant relationships were not evident within the moisture range studied. However, different wood regions and types exhibited differing veneer buffering capacities that had potential to interfere with pH requirements of Soyad®. Additional study of buffering capacity and resin cure is recommended to determine the significance of the buffering capacity results found in this study. / Master of Science / Performance issues including debonding and delamination have been reported for hickory engineered wood flooring products constructed using a soy-flour based adhesive. Sapwood regions within the composite and extremely low moisture veneer were provided by industry as possible factors that resulted in performance deficiencies. The goal of this research project was to gain a broader understanding of bonding low moisture hickory veneer with Soyad® adhesive. Soy-flour adhesive systems offer many environmental, health, and durability advantages. Soyad® is of particular interest due to its use of natural, renewable soy flour, a novel cross-linking resin, and no added formaldehyde. Test specimens were prepared using heartwood of hickory and red oak and sapwood of hickory. Analytical tests included determination of certain chemical properties of the adhesive and wood veneer, measurement of strength properties of the adhesive bond, and assessment of delamination tendencies of bonded panels following water soaking. Results indicate that moisture levels and the different growth regions and wood type had an inconsistent impact on the bond strengths yet percent wood failure was uniformly low and considered unacceptable by industry. Although this research established a foundation of basic knowledge, more information about adhesive bonding of wood with the recently developed soy based adhesives is needed to optimize the systems and provide technological advancements that lead to more efficient and safe utilization of woody materials from the forest.

In this time are for design of wooden elements available simplified procedures for fire modeling which defines ČSN EN 1991-1-2. But it is not experimentally tested the impact of adhesive on the final value of fire resistance of laminated panels. This diploma thesis solves basic normative practices that could explain the durability of glue bond against increased temperatures. in the practical part will be undertaken to experimentally assess the impact of various kinds of adhesive-based (epoxy, formaldehyde, PUR and EPI) on the glued bond durability against increased temperature. Glued joints that will be subjected to gradual temperature exposure in order to assemble the dependence of the temperature influence on the final strength of the joint according to the type of adhesive.

The current method for estimating wood failure is highly subjective. Various techniques have been proposed to improve the current protocol, but none have succeeded. This research aims to use deep learning/semantic segmentation using SegNet architecture to estimate wood failure in four types of three-ply plywood from mechanical shear strength specimens. We trained and tested our approach on custom and commercial plywood with bio-based and phenol-formaldehyde adhesives. Shear specimens were prepared and tested. Photographs of 255 shear bonded areas were taken. Forty photographs were used to solicit visual estimates from five human evaluators, and the remaining photographs were used to train the machine learning models. Twelve models were trained with the combination of four image sizes and three dataset splits. In comparison to visual estimates, the model trained on 512 × 512 image size with 90/10 dataset split had a mean absolute error (MAE) of 6%, which was the best among the literature.

The aim of my diploma thesis are methods which are able to describe durability aspects of glued wooden joints. The main objective are methods which primarily includes hygrothermal stress acting in the glued joint of wooden adherend and determine the service life of the specific glued joint by modelling based on Arrhenius relation and the other methods. Other part of this work is aimed to shear tests of the samples exposed to different thermal and humidity conditions and for individual sets of exposures determining the glue penetration depth into the wooden adherend by EPI fluorescent analysis. These analytic methods are used for quality check of the glued joints, which are mostly based on strength, chemical or structural parameters of the tested sample.