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Process Window Challenges in Advanced Manufacturing: New Materials and Integration Solutions

With the continued progression of Moore’s law into the sub-14nm technology nodes, interconnect RC and power dissipation scaling play an increasingly important role in overall product performance. As critical dimensions in the mainstream Cu/ULK interconnect system shrink below 30nm, corresponding increases in relative process variation and decreases in overall process window mandate increasingly complex integrated solutions. Traditional metallization processes, e.g. PVD barrier and seed layers, no longer scale for all layout configurations as they reach physical and geometric limitations. Interactions between design, OPC, and patterning also play more and more critical roles with respect to reliability and yield in volume manufacturing; stated simply, scaling is no longer “business as usual”. Restricted design layouts, prescriptive design rules, novel materials, and holistic integration solutions each therefore become necessary to maximize available process windows, thus enabling new generations of cost-competitive products in the marketplace.

Identiferoai:union.ndltd.org:DRESDEN/oai:qucosa.de:bsz:ch1-qucosa-207003
Date22 July 2016
CreatorsFox, Robert, Augur, Rod, Child, Craig, Zaleski, Mark
ContributorsTU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
PublisherUniversitätsbibliothek Chemnitz
Source SetsHochschulschriftenserver (HSSS) der SLUB Dresden
LanguageEnglish
Detected LanguageEnglish
Typedoc-type:conferenceObject
Formatapplication/pdf, text/plain, application/zip
SourceAMC 2015 – Advanced Metallization Conference

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