Return to search

The joint study of BGA solder ball on the OSP type substrate

none

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0817109-170237
Date17 August 2009
CreatorsLin, Kuan-ting
ContributorsDer-shin Gan, Ker-chang Hsieh, Po-we Kao
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817109-170237
Rightsnot_available, Copyright information available at source archive

Page generated in 0.0016 seconds